公开(公告)号：US20240212711A1

公开(公告)日：2024-06-27

申请号：US18500465

申请日：2023-11-02

Applicant: Resonac Corporation

Inventor： Chihiro TAMURA

IPC: G11B5/84 ,  G11B5/012 ,  G11B5/725 ,  G11B5/82

CPC classification number: G11B5/8408 ,  G11B5/012 ,  G11B5/725 ,  G11B5/82

Abstract: A film forming apparatus includes chambers configured to perform a film forming process, a carrier configured to hold a substrate to be subjected to the film forming process in the chambers, and a transport mechanism configured to successively transport the carrier through the chambers. The carrier includes a support surface configured to support the carrier from below when transporting the carrier, and the support surface is provided parallel to the transport direction. The chambers include rotating members, provided parallel to the transport direction, and configured to make contact with the support surface when transporting the carrier. The rotating members are made of a magnetic material, and a magnet is provided around each of the rotating members.

公开(公告)号：US20240150889A1

公开(公告)日：2024-05-09

申请号：US18502354

申请日：2023-11-06

Applicant: Resonac Corporation

Inventor： Chihiro TAMURA ,  Kengo NOGAMI ,  Kazuyuki YOSHINO

IPC: C23C14/56 ,  B05C13/00

CPC classification number: C23C14/568 ,  B05C13/00

Abstract: Falling of a substrate and deformation or breakage of the substrate are inhibited. A substrate holder includes a hole portion in which a disk-shaped substrate is placed upright, and at least four supporting members attached elastically-deformably on a periphery of the hole portion. Two of the four supporting members support disk-shaped substrate at first- and second-side circumferential end portions of disk-shaped substrate positioned at vertical-direction upper positions of disk-shaped substrate. Remaining two of the four supporting members support disk-shaped substrate at third- and fourth-side circumferential end portions of disk-shaped substrate positioned at vertical-direction lower positions of disk-shaped substrate. Central angle in disk-shaped substrate between either first- or second-side circumferential end portion and uppermost end portion of disk-shaped substrate is from 15° through 40°. Central angle in disk-shaped substrate between either third- or fourth-side circumferential end portion and lowermost end portion of disk-shaped substrate is from 10° through 15°.