公开(公告)号：US20240369435A1

公开(公告)日：2024-11-07

申请号：US18630460

申请日：2024-04-09

Applicant: Robert Bosch GmbH

Inventor： Johannes Classen ,  Andreas Scheurle ,  Manuel Glas

IPC: G01L19/00 ,  G01L9/00 ,  G01P15/125

Abstract: A membrane sensor. The membrane sensor includes: a pressure sensor configured to generate a first sensor signal depending on a deflection of a pressure-loadable membrane; an acceleration sensor configured to generate a second sensor signal depending on an acceleration acting on a MEMS functional structure; and an evaluation circuit configured to compensate for a dependence of the first sensor signal on an acceleration force, in particular weight force, acting on the membrane, based on the second sensor signal. The pressure sensor and the acceleration sensor are stacked one above the other in a z direction. A method for generating a compensated sensor signal using such a membrane sensor is also described.

公开(公告)号：US20230161150A1

公开(公告)日：2023-05-25

申请号：US17917343

申请日：2021-07-16

Applicant: Robert Bosch GmbH

Inventor： Johannes Classen

IPC: G02B26/08 ,  G02B17/00

CPC classification number: G02B26/0841 ,  G02B17/002

Abstract: A micromirror arrangement having at least a first micromirror, a second micromirror, and a third micromirror. The second micromirror has a first component and a second component. The first component is arranged, in particular in a plan view, in a manner overlapping a first mirror surface of the first micromirror. The second component is arranged, in particular in the plan view, in a manner overlapping a third mirror surface of the third micromirror.

公开(公告)号：US20220091154A1

公开(公告)日：2022-03-24

申请号：US17447876

申请日：2021-09-16

Applicant: Robert Bosch GmbH

Inventor： Cristian Nagel ,  Johannes Classen ,  Lars Tebje ,  Rolf Scheben ,  Rudy Eid

IPC: G01P15/08 ,  G01P15/125 ,  B81B3/00

Abstract: A micromechanical structure including a substrate, a moveable seismic mass, a detection structure, and a main spring. The seismic mass is connected to the substrate using the main spring. A first direction and a second direction perpendicular thereto define a main extension plane of the substrate. The detection structure detects a deflection of the seismic mass and includes first electrodes mounted at the seismic mass and second electrodes mounted at the substrate. The first electrodes and second electrodes have a two-dimensional extension in the first and second directions. The micromechanical structure has a graduated stop structure including a first spring stop, a second spring stop, and a fixed stop.

公开(公告)号：US11274038B2

公开(公告)日：2022-03-15

申请号：US16700391

申请日：2019-12-02

Applicant: Robert Bosch GmbH

Inventor： Johannes Classen

IPC: B81C1/00 ,  B81B7/04

Abstract: A method for setting a pressure in a cavern formed using a substrate and a substrate cap, the cavern being part of a semiconductor system, including an additional cavern formed with using the substrate and of the substrate cap, a microelectromechanical system being situated in the cavern, an additional microelectromechanical system being situated in the additional cavern, a diffusion area being situated in the substrate and/or in the substrate cap, the method includes a gas diffusing with the aid of the diffusion area from the surroundings into the cavern, during the diffusing, a diffusivity and/or a diffusion flow of the gas from the surroundings into the cavern being greater than an additional diffusivity and/or an additional diffusion flow of the gas from the surroundings into the additional cavern, and/or during the diffusing, the additional cavern being at least essentially protected from a penetration of the gas into the additional cavern.

公开(公告)号：US11215632B2

公开(公告)日：2022-01-04

申请号：US16748911

申请日：2020-01-22

Applicant: Robert Bosch GmbH

Inventor： Johannes Classen ,  Lars Tebje

IPC: G01P15/18 ,  G01P15/125 ,  G01P1/00

Abstract: A micromechanical inertial sensor, having a substrate; and a seismic mass which is connected to the substrate and developed so that it has a detection capability of a low-g acceleration of approximately 1 g in a first Cartesian coordinate direction, and the seismic mass is furthermore developed so that it has a detection capability of a high-g acceleration of at least approximately 100 g in at least one second Cartesian coordinate direction.

公开(公告)号：US10656173B2

公开(公告)日：2020-05-19

申请号：US15775219

申请日：2016-11-14

Applicant: Robert Bosch GmbH

Inventor： Johannes Classen ,  Antoine Puygranier ,  Denis Gugel ,  Guenther-Nino-Carlo Ullrich ,  Markus Linck-Lescanne ,  Sebastian Guenther ,  Timm Hoehr

IPC: G01P15/125 ,  B81B5/00 ,  G01P15/08

Abstract: A micromechanical structure for an acceleration sensor includes a movable seismic mass including electrodes, the seismic mass being attached to a substrate with the aid of an attachment element; first fixed counter electrodes attached to a first carrier plate; and second fixed counter electrodes attached to a second carrier plate, where the counter electrodes, together with the electrodes, are situated nested in one another in a sensing plane of the micromechanical structure, and where the carrier plates are situated nested in one another in a plane below the sensing plane, each being attached to a central area of the substrate with the aid of an attachment element.

公开(公告)号：US10607888B2

公开(公告)日：2020-03-31

申请号：US16475755

申请日：2018-04-06

Applicant: Robert Bosch GmbH

Inventor： Christoph Schelling ,  Johannes Classen ,  Simon Genter

IPC: H01L21/768 ,  H01L23/48 ,  H01L23/00

Abstract: A conductive through-plating for a substrate includes a metal component, a first conductive structure situated on or in the environment of a surface of the substrate, and a second conductive structure situated on or in the environment of a further surface of the substrate. A method for producing the through-plating includes, in a first step, at least partially applying above the surface a grid structure that includes a group of openings; in a second step following the first step, carrying out an etching producing a trench in the substrate and at least partially also underneath the group of openings; and, in a fifth step following the second step, carrying out a metallization situating a metal component at least partially in the trench such that the metal component is part of a seal sealing the trench in the area of the surface.

公开(公告)号：US10294095B2

公开(公告)日：2019-05-21

申请号：US15582333

申请日：2017-04-28

Applicant: Robert Bosch GmbH

Inventor： Benny Pekka Herzogenrath ,  Johannes Classen

IPC: H01L29/84 ,  B81B3/00 ,  B81C1/00 ,  G01C19/5712 ,  G01P15/125 ,  G01C19/56 ,  G01C19/5656 ,  G01P1/00 ,  G01P15/08

Abstract: A micromechanical sensor that is produced surface-micromechanically includes at least one mass element formed in a third functional layer that is non-perforated at least in certain portions. The sensor has a gap underneath the mass element that is formed by removal of a second functional layer and at least one oxide layer. The removal of the at least one oxide layer takes place by introducing a gaseous etching medium into a defined number of etching channels arranged substantially parallel to one another. The etching channels are configured to be connected to a vertical access channel in the third functional layer.

公开(公告)号：US09863781B2

公开(公告)日：2018-01-09

申请号：US14540298

申请日：2014-11-13

Applicant: Robert Bosch GmbH

Inventor： Wolfram Bauer ,  Johannes Classen ,  Rainer Willig ,  Matthias Meier ,  Burkhard Kuhlmann ,  Mathias Reimann ,  Ermin Esch ,  Hans-Dieter Schwarz ,  Michael Veith ,  Christoph Lang ,  Udo-Martin Gomez

IPC: G01C25/00 ,  G01C19/5726 ,  G01C19/56

CPC classification number: G01C25/00 ,  G01C19/56 ,  G01C19/5726

Abstract: A yaw rate sensor (10) includes a movable mass structure (12) and a drive component (13) which is suitable for setting the movable mass structure (12) in motion (14), and an analysis component (15) which is suitable for detecting a response (40) of the movable mass structure (12) to a yaw rate (Ω). A method for functional testing of a yaw rate sensor (10) includes the following steps: driving a movable mass structure (12), feeding a test signal (42) into a quadrature control loop (44) at a feed point (48) of the quadrature control loop (44), feeding back a deflection (40) of the movable mass structure (12), detecting a measure of the feedback of the movable mass structure (12), and reading out the response signal (47) from the quadrature control loop (44). In the yaw rate sensor (10) and also in the method, the readout of the response signal (47) in relation to a processing direction (45) of the test signal (42) is provided between a feed point (48) for a test signal (42) and an actuator (38) for feeding back a deflection (40) of the movable mass structure (12).

公开(公告)号：US09840410B2

公开(公告)日：2017-12-12

申请号：US15268017

申请日：2016-09-16

Applicant: Robert Bosch GmbH

Inventor： Johannes Classen

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00238 ,  B81B7/007 ,  B81B2201/0235 ,  B81B2207/012 ,  B81B2207/07 ,  B81C2203/0109 ,  B81C2203/035 ,  B81C2203/0792 ,  G01P15/0802 ,  G01P15/125 ,  H01L2224/11

Abstract: A method for manufacturing a micromechanical component, including: providing a MEMS wafer; structuring the MEMS wafer proceeding from a surface of a second substrate layer of the MEMS wafer, at least one electrically conducting connection being formed between a first substrate layer and the second substrate layer of the MEMS wafer; providing a cap wafer; joining the MEMS wafer to the cap wafer; structuring the MEMS wafer proceeding from a surface of the first substrate layer of the MEMS wafer; providing an ASIC wafer; and joining the ASIC wafer to the joint of the MEMS wafer and the cap wafer.