公开(公告)号：US20110178672A1

公开(公告)日：2011-07-21

申请号：US12736883

申请日：2009-04-20

Applicant: Oliver Leibfried ,  Roland Gerstner

Inventor： Oliver Leibfried ,  Roland Gerstner

IPC: B60R21/01 ,  G01R31/02 ,  G06F17/00

CPC classification number: H02J7/0031 ,  B60R16/0232 ,  G01R31/2829

Abstract: A protective device against corrosion for an onboard electrical system, in particular thermal corrosion. The protective device includes at least one sensor for detecting a shunt and a switching device which is controllable by the sensor and outputs a switching pulse for the activation of a control unit upon control by the sensor. Also described is a method for the control of the onboard electrical system.

Abstract translation: 防止车载电气系统腐蚀的保护装置，特别是热腐蚀。 保护装置包括用于检测分路的至少一个传感器和由传感器控制的开关装置，并且在由传感器控制时输出用于启动控制单元的开关脉冲。 还描述了用于控制车载电气系统的方法。

公开(公告)号：US09071059B2

公开(公告)日：2015-06-30

申请号：US12736883

申请日：2009-04-20

Applicant: Oliver Leibfried ,  Roland Gerstner

Inventor： Oliver Leibfried ,  Roland Gerstner

IPC: G01M17/00 ,  H02J7/00 ,  G01R31/28 ,  B60R16/023

CPC classification number: H02J7/0031 ,  B60R16/0232 ,  G01R31/2829

Abstract: A protective device against corrosion for an onboard electrical system, in particular thermal corrosion. The protective device includes at least one sensor for detecting a shunt and a switching device which is controllable by the sensor and outputs a switching pulse for the activation of a control unit upon control by the sensor. Also described is a method for the control of the onboard electrical system.

Abstract translation: 防止车载电气系统腐蚀的保护装置，特别是热腐蚀。 保护装置包括用于检测分路的至少一个传感器和由传感器控制的开关装置，并且在由传感器控制时输出用于启动控制单元的开关脉冲。 还描述了用于控制车载电气系统的方法。

公开(公告)号：US4967316A

公开(公告)日：1990-10-30

申请号：US417294

申请日：1989-10-05

Applicant: Ulrich Goebel ,  Roland Gerstner ,  Walter Roethlingshoefer ,  Dietrich Bergfried ,  Michael Krapp

Inventor： Ulrich Goebel ,  Roland Gerstner ,  Walter Roethlingshoefer ,  Dietrich Bergfried ,  Michael Krapp

IPC: H01G4/06 ,  B60R16/02 ,  B60R16/023 ,  H04B15/00 ,  H05K1/02 ,  H05K1/05 ,  H05K1/16 ,  H05K3/00 ,  H05K3/32 ,  H05K7/14 ,  H05K9/00

CPC classification number: B60R16/0239 ,  H04B15/00 ,  H05K1/0231 ,  H05K1/162 ,  H05K1/0201 ,  H05K1/053 ,  H05K2201/09318 ,  H05K2201/10636 ,  H05K2203/0315 ,  H05K3/0061 ,  H05K3/284 ,  H05K3/321 ,  Y02P70/611

Abstract: An electrical circuit unit, particularly for motor vehicles, features a grounded housing (1) and a printed circuit board (2) which, for protection against incoming and outgoing radiation of electrical noise, is short-circuited at high frequencies to the grounded housing. For this purpose, a noise suppression capacitor (6) on the PC board (2) is connected in series to a second capacitor. This second capacitor is formed by a metallized surface (8) on the board (2) and a metal-filled adhesive, as a first plate, a metal inner surface (11) of the housing (1) as a second plate, and an intermediate passivation or eloxal layer serving as a dielectric (13). The metal-filled adhesive acts to electrically bridge most of the gap between the metallized surface (8) and the housing surface (11), thereby capacitively coupling the metal-filled adhesive to the housing (1) and increasing the capacitance.

Abstract translation: 特别是用于机动车辆的电路单元具有接地壳体（1）和印刷电路板（2），该电路板用于防止电噪声的入射和射出辐射被高频地短路到接地的壳体。 为此，PC板（2）上的噪声抑制电容器（6）与第二电容器串联连接。 该第二电容器由板（2）上的金属化表面（8）和作为第一板的金属填充的粘合剂，作为第二板的壳体（1）的金属内表面（11）形成，并且 中间钝化或用作电介质的氧氟化物层（13）。 金属填充的粘合剂用于电连接金属化表面（8）和壳体表面（11）之间的大部分间隙，从而将金属填充的粘合剂电容耦合到壳体（1）并增加电容。

公开(公告)号：US5355280A

公开(公告)日：1994-10-11

申请号：US133529

申请日：1993-10-07

Applicant: Walter Rothlingshofer ,  Ulrich Goebel ,  Roland Gerstner

Inventor： Walter Rothlingshofer ,  Ulrich Goebel ,  Roland Gerstner

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K3/00 ,  H05K3/38 ,  H05K7/20

CPC classification number: H05K7/205 ,  H05K1/0206 ,  H05K3/0061 ,  H05K7/20509 ,  H01L2224/48091 ,  H01L2224/49175 ,  H05K1/0306 ,  H05K1/05 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2203/068 ,  H05K3/386 ,  Y10S428/901

Abstract: A connection arrangement with PC board features a ceramic substrate glued to a base plate of metal, used as a cooling body. Islands have been hollowed out of the adhesive layer and are filled with thermally conductive paste. Particularly effective thermal dissipation is possible in the area of the islands filled with thermally conductive paste, so that the islands are always disposed underneath components with great energy or heat dissipation.

Abstract translation: 与PC板的连接装置具有胶合到金属基板的陶瓷基板，用作冷却体。 群岛已经从粘合剂层中掏空，并且填充有导热浆料。 在填充有导热浆料的岛的区域中特别有效的散热是可能的，使得岛总是以大的能量或散热被布置在组件的下方。

公开(公告)号：US5220724A

公开(公告)日：1993-06-22

申请号：US756490

申请日：1991-09-09

Applicant: Roland Gerstner

Inventor： Roland Gerstner

IPC: H05K1/18 ,  H05K3/12 ,  H05K3/32 ,  H05K3/34 ,  H05K13/04

CPC classification number: H05K13/0469 ,  H05K3/321 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/181 ,  H05K2201/0129 ,  H05K2201/10636 ,  H05K2201/10969 ,  H05K2203/0108 ,  H05K2203/0338 ,  H05K2203/1105 ,  H05K3/1216 ,  H05K3/341 ,  H05K3/3484 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A method for mounting Surface-Mounted-Devices ("SMD's") on a substrate, e.g. a PC board, involves warming an adhesive containing conductive particles from a room-temperature solid state to a warmed fluid state, applying said fluid adhesive to the substrate, permitting the adhesive to cool back into a solid state, subsequently warming the substrate and adhesive to render the adhesive tacky and yielding, mounting the components (2-5) in the tacky adhesive, and permitting the adhesive to cool back into a solid state, thereby securing the components on the substrate.

Abstract translation: 将表面安装器件（“SMD”）安装在基板上的方法，例如， PC板包括将含有导电颗粒的粘合剂从室温固态加热至加热的流体状态，将所述流体粘合剂施加到基底上，允许粘合剂冷却回固态，随后将基底和粘合剂加热至 使粘合剂发粘并产生，将组分（2-5）安装在粘性粘合剂中，并允许粘合剂冷却回固态，从而将组分固定在基材上。