公开(公告)号：US5646826A

公开(公告)日：1997-07-08

申请号：US601671

申请日：1996-02-15

Applicant: Roman Katchmar

Inventor： Roman Katchmar

IPC: H01L23/40 ,  H01L23/433 ,  H05K1/02 ,  H05K3/40 ,  H05K7/20

CPC classification number: H01L23/433 ,  H01L23/4006 ,  H05K7/20463 ,  H05K7/20509 ,  H01L2023/405 ,  H01L2023/4056 ,  H01L2023/4062 ,  H01L2023/4068 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/0209 ,  H05K2201/066 ,  H05K2201/0949 ,  H05K2201/0959 ,  H05K2201/0969 ,  H05K2201/10689 ,  H05K2201/10734 ,  H05K2203/0126 ,  H05K3/4069

Abstract: Making a heat sink and printed circuit board assembly by providing a heat exchange element on the heat sink which lies in heat exchange contact with the heat sink and passes therethrough. After locating the board and heat sink in relative positions apart and with the heat exchange element aligned with an electronic component on the board, a settable thermally conductive compound is injected through a hole in the heat exchange element to bond it to the electrical component. The heat sink is detachable from the heat exchange element to expose the side of the board carrying the components so that maintenance or repair may be performed. Subsequently the heat sink is returned into its position in the assembly.

Abstract translation: 通过在散热器上提供热交换元件与散热器进行热交换接触并通过其中来制造散热器和印刷电路板组件。 在将板和散热器相对位置定位并且热交换元件与板上的电子部件对准之后，通过热交换元件中的孔将可固化的导热化合物注入到电组件中。 散热器可从热交换元件拆卸以暴露出承载部件的板的侧面，从而可进行维护或修理。 随后，散热器返回到组件中的位置。

公开(公告)号：US5276584A

公开(公告)日：1994-01-04

申请号：US42205

申请日：1993-04-02

Applicant: Hugh M. Collins ,  Hasler R. Hayes ,  John S. Moss ,  Clifford D. Read ,  Tristano F. Nicoletta ,  John B. Drayton ,  David J. Pell ,  Roman Katchmar

Inventor： Hugh M. Collins ,  Hasler R. Hayes ,  John S. Moss ,  Clifford D. Read ,  Tristano F. Nicoletta ,  John B. Drayton ,  David J. Pell ,  Roman Katchmar

IPC: H05K7/20

CPC classification number: H05K7/20545

Abstract: Electronic unit of printed circuit board with electronic components on one side and its other side in heat conducting contact with a heat sink enables the electronic components to be sealed from ambient atmosphere and thus unpackaged chips may be used. The units are mountable in a support frame with air cooling passages of the heat sinks extending vertically for convected cooling air. In each unit, a resistor network may extend into a cavity formed in a heat exchange rib and an electronic chip, perhaps unpackaged in the sealed environment, may be in heat conductive relationship with the heat sink.

Abstract translation: 印刷电路板的电子单元，其一面具有电子部件，另一侧与散热片进行热传导接触，使得电子部件能够与环境大气密封，因此可以使用未封装的芯片。 这些单元可安装在支撑框架中，散热器的空气冷却通道垂直延伸用于对流的冷却空气。 在每个单元中，电阻器网络可以延伸到形成在热交换肋中的空腔中，并且可能在密封环境中未封装的电子芯片可能与散热器处于热传导关系。

公开(公告)号：US06514792B2

公开(公告)日：2003-02-04

申请号：US09749422

申请日：2000-12-28

Applicant: Roman Katchmar

Inventor： Roman Katchmar

IPC: H01L2144

CPC classification number: H01L23/49838 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/094 ,  H05K2201/10969 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A surface mount area-array integrated circuit package is disclosed. The package consists of a package substrate having conductive vias and internal and external conductive traces, a semiconductor die electrically and mechanically connected to the top surface of package substrate, an area-array of conductive surface mount terminations electrically and mechanically connected to the bottom of the package substrate, and at least one adhesive mass. The at least one adhesive mass is located on the bottom of the package substrate and replaces the conductive terminations in the area(s) where the joint strain energy density is calculated to be the greatest. When mounted on a substrate, the at least one adhesive mass adheres the package to the substrate. Increased mechanical and electrical reliability is thus achieved.

Abstract translation: 公开了一种表面安装区域阵列集成电路封装。 该封装由具有导电通孔和内部和外部导电迹线的封装基板，半导体管芯电连接和机械连接到封装基板的顶表面，导电表面安装端子的区域阵列电气和机械连接到 封装衬底和至少一个粘合剂块。 至少一个粘合剂物质位于封装衬底的底部，并替代计算接头应变能量密度最大的区域中的导电端子。 当安装在基底上时，至少一个粘合剂块将包装粘附到基底上。 从而实现了增加的机械和电气可靠性。

公开(公告)号：US5467251A

公开(公告)日：1995-11-14

申请号：US133396

申请日：1993-10-08

Applicant: Roman Katchmar

Inventor： Roman Katchmar

IPC: H01L23/367 ,  H01L23/373 ,  H05K1/02 ,  H05K3/30 ,  H05K3/40 ,  H05K3/42 ,  H05K7/20

CPC classification number: H05K1/0206 ,  H01L23/3672 ,  H01L23/3677 ,  H01L23/3737 ,  H01L2224/48091 ,  H01L2224/4824 ,  H05K2201/0209 ,  H05K2201/066 ,  H05K2201/09072 ,  H05K2201/0959 ,  H05K2201/10416 ,  H05K2201/10689 ,  H05K3/0061 ,  H05K3/305 ,  H05K3/4069 ,  H05K3/42 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Printed circuit board and heat sink assembly in which heat conductive elements are provided to distribute heat across the board before transferring heat into the heat sink. Also in other structures, heat is conducted directly into a heat sink from surface mount components while bypassing the board.

Abstract translation: 印刷电路板和散热器组件，其中提供导热元件以在将热量传递到散热器之前在板上分布热量。 同样在其他结构中，在旁路板时，热量直接从表面安装部件传导到散热器中。

公开(公告)号：US06194782B1

公开(公告)日：2001-02-27

申请号：US09103802

申请日：1998-06-24

Applicant: Roman Katchmar

Inventor： Roman Katchmar

IPC: H01L2334

CPC classification number: H01L23/49838 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/094 ,  H05K2201/10969 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A surface mount area-array integrated circuit package is disclosed. The package consists of a package substrate having conductive vias and internal and external conductive traces, a semiconductor die electrically and mechanically connected to the top surface of package substrate, an area-array of conductive surface mount terminations electrically and mechanically connected to the bottom of the package substrate, and at least one adhesive mass. The at least one adhesive mass is located on the bottom of the package substrate and replaces the conductive terminations in the area(s) where the joint strain energy density is calculated to be the greatest. When mounted on a substrate, the at least one adhesive mass adheres the package to the substrate. Increased mechanical and electrical reliability is thus achieved.

Abstract translation: 公开了一种表面安装区域阵列集成电路封装。 该封装由具有导电通孔和内部和外部导电迹线的封装基板，半导体管芯电连接和机械连接到封装基板的顶表面，导电表面安装端子的区域阵列电气和机械连接到 封装衬底和至少一个粘合剂块。 至少一个粘合剂物质位于封装衬底的底部，并替代计算接头应变能量密度最大的区域中的导电端子。 当安装在基底上时，至少一个粘合剂块将包装粘附到基底上。 从而实现了增加的机械和电气可靠性。

公开(公告)号：US5796582A

公开(公告)日：1998-08-18

申请号：US755429

申请日：1996-11-21

Applicant: Roman Katchmar

Inventor： Roman Katchmar

IPC: H05K7/20

CPC classification number: H05K7/20509 ,  H05K7/20463

Abstract: Making an assembly of a printed circuit board structure and heat sink structure by locating a thermally conductive surface release agent upon a side of one of the structures and causing a flowable thermally conductive material to flow through a hole in the heat sink and lie between the release agent and the other structure. The thermally conductive material lies in heat conductive contact with the release agent and with the other structure and in alignment with an electronic component which is to be cooled upon the board. The release agent ensures easy release of the printed circuit board structure from the heat sink structure for disassembly purposes. An assembly of the two structures is also covered.

Abstract translation: 通过将导热表面脱模剂定位在结构之一的一侧并使可流动的导热材料流过散热器中的孔并且位于释放器之间，从而组装印刷电路板结构和散热器结构 代理和其他结构。 导热材料与脱模剂和其它结构导热接触，并与要在板上冷却的电子部件对准。 脱模剂确保从散热器结构容易地将印刷电路板结构从拆卸的目的释放。 这两个结构的组合也被覆盖。

公开(公告)号：US5661902A

公开(公告)日：1997-09-02

申请号：US496649

申请日：1995-06-29

Applicant: Roman Katchmar

Inventor： Roman Katchmar

IPC: H01L23/367 ,  H01L23/373 ,  H05K1/02 ,  H05K3/30 ,  H05K3/40 ,  H05K3/42 ,  H05K7/20 ,  H05K3/34

CPC classification number: H05K1/0206 ,  H01L23/3672 ,  H01L23/3677 ,  H01L23/3737 ,  H01L2224/48091 ,  H01L2224/4824 ,  H05K2201/0209 ,  H05K2201/066 ,  H05K2201/09072 ,  H05K2201/0959 ,  H05K2201/10416 ,  H05K2201/10689 ,  H05K3/0061 ,  H05K3/305 ,  H05K3/4069 ,  H05K3/42 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A method of making a printed circuit board and heat sink structure by initially providing the board with a heat conductive layer oh each of its two sides, the two conductive layers thermally interconnected by heat conductive material extending through holes in the board. An electronic component is mounted spaced apart from the conductive layer on one side of the board and is thermally connected to that layer by a thermally conductive viscous substance injected through a hole from the other side of the board. The viscous material flows in a reverse direction through other holes in the board. A heat sink is then attached by thermally conductive material to the conductive layer on the other side of the board. A method is also included of injecting a thermally conductive curable resin between an electronic component and a printed circuit board with a release agent between the component and the resin. After cooling the resin at sufficiently high temperature for it to be in contact with the release agent, the cured resin cools and shrinks away from the component. Subsequent heating of the resin expands it into heat conductive engagement with the component for quicker release of heat therefrom.

Abstract translation: 通过首先向板提供其两侧的导热层，制造印刷电路板和散热器结构的方法，两个导电层通过延伸穿过板中的孔的导热材料热互连。 电子部件安装在板的一侧上与导电层间隔开并且通过从板的另一侧注入的导热粘性物质与该层热连接。 粘性物质沿着相反方向流过板中的其它孔。 然后将散热器通过导热材料附着到板的另一侧上的导电层上。 还包括在电子部件和印刷电路板之间注入导热固化性树脂的方法，该组合物与树脂之间具有脱模剂。 在足够高的温度下冷却树脂使其与脱模剂接触之后，固化的树脂冷却并从组分收缩。 随后加热树脂使其膨胀成与组件的导热接合，从而更快地释放热量。

公开(公告)号：US5218516A

公开(公告)日：1993-06-08

申请号：US786232

申请日：1991-10-31

Applicant: Hugh M. Collins ,  Hasler R. Hayes ,  John S. Moss ,  Clifford D. Read ,  Tristano F. Nicoletta ,  John B. Drayton ,  David J. Pell ,  Roman Katchmar

Inventor： Hugh M. Collins ,  Hasler R. Hayes ,  John S. Moss ,  Clifford D. Read ,  Tristano F. Nicoletta ,  John B. Drayton ,  David J. Pell ,  Roman Katchmar

IPC: H05K7/20

CPC classification number: H05K7/20545

Abstract: Electronic module of printed circuit board with electronic components on one side and its other side in heat conducting contact with a heat sink enables the electronic components to be sealed from ambient atmosphere and thus unpackaged chips may be used. The modules are mountable in a support frame with air cooling passages of the heat sinks extending vertically for convected cooling air. In each module, a resistor network may extend into a cavity formed in a heat exchange rib and an electronic chip, perhaps unpackaged in the sealed environment, may be in heat conductive relationship with the heat sink.

Abstract translation: 具有电子元件的印刷电路板的电子模块，其另一侧与散热器进行导热接触，使得电子元件能够与环境大气密封，因此可以使用未封装的芯片。 模块可安装在支撑框架中，散热器的空气冷却通道垂直延伸用于对流的冷却空气。 在每个模块中，电阻器网络可以延伸到形成在热交换肋中的空腔中，并且可能在密封环境中未封装的电子芯片可能与散热器处于热传导关系。