公开(公告)号：US20150366066A1

公开(公告)日：2015-12-17

申请号：US14528804

申请日：2014-10-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae-Seong KIM ,  Yeon-Seop YU ,  Bok-Hee LEE

IPC: H05K1/18 ,  H05K3/00 ,  H05K3/30

CPC classification number: H05K1/185 ,  H05K1/0271 ,  H05K2201/09072 ,  H05K2201/09827 ,  H05K2201/09854 ,  Y10T29/49131

Abstract: An electronic device embedded substrate and a method of manufacturing the same are disclosed. The electronic device embedded substrate in accordance with an aspect of the present invention includes: an electronic device; and a core substrate having a cavity, in which the electronic device is embedded and of which a width of at least a portion is smaller than widths of other portions thereof.

Abstract translation: 公开了一种电子器件嵌入式基板及其制造方法。 根据本发明的一个方面的电子设备嵌入式基板包括：电子设备; 以及具有空腔的芯基板，其中嵌入有电子器件，其中至少一部分的宽度小于其它部分的宽度。

公开(公告)号：US20160234941A1

公开(公告)日：2016-08-11

申请号：US15019647

申请日：2016-02-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seong-Ryul CHOI ,  Tae-Seong KIM ,  Bok-Hee LEE ,  Yeon-Seop YU

IPC: H05K1/18 ,  H01L23/538 ,  H05K3/40 ,  H05K3/12 ,  H05K3/30 ,  H05K3/00

CPC classification number: H01L23/5383 ,  H01L21/4857 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/8014 ,  H01L2924/15311 ,  H05K1/186 ,  H05K3/007 ,  H05K3/4682 ,  H05K3/4697 ,  H05K2203/0156

Abstract: A printed circuit board, a semiconductor package and a method of manufacturing the same are provided. The printed circuit board includes an insulation layer, an electronic component embedded within the insulation layer, a component guide affixing the embedded electronic component at an installed position, and a circuit layer disposed in the insulation layer.

Abstract translation: 提供一种印刷电路板，半导体封装及其制造方法。 印刷电路板包括绝缘层，嵌入在绝缘层内的电子部件，将嵌入式电子部件固定在安装位置的部件引导件和设置在绝缘层中的电路层。