公开(公告)号：US20210092825A1

公开(公告)日：2021-03-25

申请号：US16861595

申请日：2020-04-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： In Ho CHOI ,  Min Seok Choi ,  Jeong-Gil Kim ,  Hyuck Shin ,  In Jae Lee ,  Sung Ho Jang

IPC: H05G2/00

Abstract: An extreme ultraviolet generation apparatus is provided. The extreme ultraviolet generation apparatus includes a chamber, a droplet generator configured to provide a droplet into the chamber, a shroud which extends along a movement path of the droplet inside the chamber and surrounds the movement path of the droplet, a charging unit configured to charge the droplet, a monitoring unit configured to measure a position of the charged droplet, an alignment unit including at least one electromagnet, the alignment unit configured to correct the position of the charged droplet within the shroud using the at least one electromagnet, and an acceleration unit configured to accelerate the charged droplet after the position of the charged droplet has been corrected.

公开(公告)号：US11109474B2

公开(公告)日：2021-08-31

申请号：US16861595

申请日：2020-04-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： In Ho Choi ,  Min Seok Choi ,  Jeong-Gil Kim ,  Hyuck Shin ,  In Jae Lee ,  Sung Ho Jang

IPC: H05G2/00

Abstract: An extreme ultraviolet generation apparatus is provided. The extreme ultraviolet generation apparatus includes a chamber, a droplet generator configured to provide a droplet into the chamber, a shroud which extends along a movement path of the droplet inside the chamber and surrounds the movement path of the droplet, a charging unit configured to charge the droplet, a monitoring unit configured to measure a position of the charged droplet, an alignment unit including at least one electromagnet, the alignment unit configured to correct the position of the charged droplet within the shroud using the at least one electromagnet, and an acceleration unit configured to accelerate the charged droplet after the position of the charged droplet has been corrected.

公开(公告)号：US20240411235A1

公开(公告)日：2024-12-12

申请号：US18419219

申请日：2024-01-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dae Geun YOON ,  Sung Hyup Kim ,  In Jae Lee

IPC: G03F7/00 ,  H01L21/67 ,  H01L21/68 ,  H01L21/683

Abstract: A semiconductor manufacturing apparatus includes a wafer stage, a wafer table including main body supported by the wafer stage and a protrusion protruding from a sidewall of the main body in a first direction, a position module on an upper surface of the wafer table and configured to move in the first direction and a second direction intersecting the first direction, an electrostatic chuck on an upper surface of the position module, a first cable connected to the position module, the first cable extending in the first direction and configured to move the position module in the first direction, a second cable between a bottom surface of the protrusion and a lower wall of the wafer stage, the second cable extending in the second direction and configured to move the position module in the second direction, and a cable connecting member connecting the first cable and the second cable.