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公开(公告)号：US20240324997A1
公开(公告)日：2024-10-03
申请号：US18619391
申请日：2024-03-28
Applicant: SEIKO EPSON CORPORATION
Inventor： Keita KUBO , Chikara KOJIMA , Hikaru IWAI , Eiji OSAWA
CPC classification number: A61B8/4494 , A61B8/4444 , G01S7/52079 , G01S15/8925
Abstract: An ultrasonic probe includes: an ultrasonic device configured to transmit an ultrasonic wave; and an acoustic sheet provided at a transmission surface of the ultrasonic wave of the ultrasonic device. The acoustic sheet includes an acoustic lens configured to guide the ultrasonic wave output from the transmission surface in a predetermined direction, a base material covering at least a part of the acoustic lens and having a difference in acoustic impedance from a measurement target less than a predetermined threshold, and a first fixing portion provided at least at a first surface of the base material and configured to detachably fix the acoustic sheet to the measurement target, the first surface being configured to face the measurement target.
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公开(公告)号：US20200303618A1
公开(公告)日：2020-09-24
申请号：US16823449
申请日：2020-03-19
Applicant: SEIKO EPSON CORPORATION
Inventor： Chikara KOJIMA , Eiji OSAWA , Koji OHASHI , Kanechika KIYOSE , Tomohiro SAYAMA , Hironori SUZUKI , Katsuhiro IMAI , Yasuyuki MATSUMOTO , Takahiro KAMIJO
Abstract: An MEMS device includes: a first member; a second member forming a sealed space with the first member therebetween; and a third member disposed between the first member and the second member and joined to the first member and the second member, in which the third member has lower rigidity than rigidity of the first member and the second member, and the third member is provided with a communication portion that establishes communication between the sealed space and an external space.
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3.发明申请公开(公告)号：US20170236995A1
公开(公告)日：2017-08-17
申请号：US15583248
申请日：2017-05-01
Applicant: SEIKO EPSON CORPORATION
Inventor： Motoki TAKABE , Eiju HIRAI , Toshihiro SHIMIZU , Naoto YOKOYAMA , Eiji OSAWA
IPC: H01L41/187 , H01L41/09 , B41J2/14 , H01L41/047
CPC classification number: H01L41/1876 , B41J2/14233 , B41J2/1609 , B41J2/161 , B41J2/1612 , B41J2/1618 , B41J2/1623 , B41J2/1626 , B41J2002/14241 , B41J2002/14362 , B41J2202/03 , H01L41/0471 , H01L41/0805 , H01L41/083 , H01L41/09 , H01L41/0973 , H01L41/27 , H01L41/277
Abstract: The piezoelectric body is configured to have a layered structure such that a plurality of unit layers are stacked in a film thickness direction, and each of the unit layers is formed of a first layer on which the displacement is relatively easy to occur, and a second layer which has a high concentration of Zr as compared with the first layer. In addition, when composition ratio Ti/(Zr+Ti) of Zr to Ti in each of the first layer and the second layer is set as Cr1 and Cr2, the composition ratio of each layer is adjusted so as to satisfy the following conditions (1) to (3): 0.41≦Cr1≦0.81 (1) 0.1≦Cr1−Cr2≦0.3 (2) Cr1>Cr2 (3).
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公开(公告)号：US20230129454A1
公开(公告)日：2023-04-27
申请号：US17973592
申请日：2022-10-26
Applicant: SEIKO EPSON CORPORATION
Inventor： Seiji IZUO , Eiji OSAWA , Mitsuru MIYASAKA
Abstract: An ultrasonic sensor is a sensor that transmits an ultrasonic wave to a target object and receives the ultrasonic wave reflected by the target object, the ultrasonic sensor including an ultrasonic array chip on which ultrasonic elements that transmit and receive the ultrasonic wave are arranged in an array shape. Each of the ultrasonic elements includes a vibrating section and a piezoelectric element provided in the vibrating section, vibrates the vibrating section to transmit the ultrasonic wave, and outputs a reception signal of the ultrasonic wave by the vibration of the vibrating section. A resonance frequency of the ultrasonic element is 2000 kHz or less.
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公开(公告)号：US20230041175A1
公开(公告)日：2023-02-09
申请号：US17880718
申请日：2022-08-04
Applicant: SEIKO EPSON CORPORATION
Inventor： Eiji OSAWA , Hikaru IWAI
Abstract: An ultrasonic device includes a first substrate including a first surface on which a first electrode coupled to a piezoelectric element is placed, a second substrate including a second surface on which a second electrode is placed, an intermediate substrate placed between the first substrate and the second substrate and including a third surface joined to the first surface and a fourth surface facing the second surface, and a bonding portion, wherein the intermediate substrate has a through hole penetrating from the third surface to the fourth surface and a third electrode provided in the through hole and coupled to the first electrode, the second electrode is coupled to the third electrode and electrically coupled to the first electrode via the third electrode, a plurality of the bonding portions are provided in island shapes apart from one another between the second substrate and the intermediate substrate, and at least one of the bonding portions is provided to surround the third electrode.
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Patent Agency Ranking
公开(公告)号：US20190353480A1
公开(公告)日：2019-11-21
申请号：US16414107
申请日：2019-05-16
Applicant: Seiko Epson Corporation
Inventor： Eiji OSAWA , Daisuke HONDA
Abstract: An ultrasonic sensor includes a first base facing a conveying surface, a transmission section on a first axis tilted relative to the conveying surface and at a far side of the first base for transmitting an ultrasonic wave toward the first axis, and a reception section on the first axis and at a far side of the conveying surface for receiving the ultrasonic wave. The transmission section has a plurality of transmission elements for transmitting the ultrasonic wave arranged to cross the first axis. The first base has a first aperture through which the ultrasonic wave transmitted from the transmission section along the first axis passes. An area of the first aperture is smaller than an area of an ultrasonic wave transmission surface of the transmission section. The transmission section delays driving the transmission elements to converge the ultrasonic wave transmitted from the transmission section toward the first aperture.
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公开(公告)号：US20170179368A1
公开(公告)日：2017-06-22
申请号：US15358261
申请日：2016-11-22
Applicant: Seiko Epson Corporation
Inventor： Koji SUMI , Eiji OSAWA
IPC: H01L41/09 , H01L41/187 , H01L41/047
CPC classification number: H01L41/081 , B06B1/0622 , B41J2/14233 , B41J2002/14241 , B41J2002/14419 , B41J2002/14491 , B41J2202/03 , H01L41/0973
Abstract: A vibrating plate is provided between a substrate and a piezoelectric element formed of electrodes and a piezoelectric layer and includes a first layer which is formed of a silicon oxide and a second layer which is formed of a ceramic having a Young's modulus larger than that of the silicon oxide. Under the condition in which the following expression (1) has a constant value, where in the expression (1), Ev1, dv1, Ev2, and dv2 represent Young's modulus of the first layer, the thickness thereof, Young's modulus of the second layer, and the thickness thereof, Ev1×dv12+Ev2×dv22 (1) when the combination of dv1 and dv2 which sets the value of the following expression (2) in a range of from the minimum value to +2% thereof is represented by (Dv1, Dv2), Ev1×dv13+Ev2×dv23 (2) the thickness of the first layer and the thickness of the second layer are represented by Dv1 and Dv2.
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公开(公告)号：US20250051117A1
公开(公告)日：2025-02-13
申请号：US18799532
申请日：2024-08-09
Applicant: SEIKO EPSON CORPORATION
Inventor： Seiji TAKAMATSU , Koya MATSUYAMA , Shuichi KADOTA , Masayoshi YAMADA , Eiji OSAWA , Hikaru IWAI
Abstract: A medium transport device includes a first roller pair and an ultrasonic detection section positioned downstream of the first roller pair, wherein the ultrasonic detection section includes a transmission sensor chip configured to emit ultrasonic waves along a first axis, a receiving sensor chip that is configured to receive the ultrasonic waves and that is disposed at a position on the first axis and, a transmission board on which the transmission sensor chip is mounted, a receiving board on which the receiving sensor chip is provided, a first protection member positioned between the transmission sensor chip and the medium, a second protection member positioned between the receiving sensor chip and the medium, a transmission board holder configured to hold the transmission board and the first protection member, and a receiving board holder configured to hold the receiving board and the second protection member.
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公开(公告)号：US20240324991A1
公开(公告)日：2024-10-03
申请号：US18619663
申请日：2024-03-28
Applicant: SEIKO EPSON CORPORATION
Inventor： Chikara KOJIMA , Keita KUBO , Hikaru IWAI , Eiji OSAWA
IPC: A61B8/00
CPC classification number: A61B8/4444 , A61B8/4422
Abstract: An ultrasound probe includes: an ultrasound device configured to perform at least one of transmission and reception of an ultrasound wave; and a case housing the ultrasound device. The ultrasound device includes a vibration plate and a piezoelectric element disposed at the vibration plate. The case is provided with an opening facing the vibration plate, and a first communication hole that is provided at a position different from a position of the opening and that communicates an internal space of the case with outside of the case. The case includes a sealing mechanism configured to prevent entry of a water droplet from the opening into the internal space.
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公开(公告)号：US20240083704A1
公开(公告)日：2024-03-14
申请号：US18466266
申请日：2023-09-13
Applicant: SEIKO EPSON CORPORATION
Inventor： Masayoshi YAMADA , Eiji OSAWA
Abstract: An ultrasonic device includes: an ultrasonic element that has a transmission surface transmitting an ultrasonic wave and that transmits the ultrasonic wave in a direction intersecting the transmission surface; a wiring arranged at a transmission surface outer circumference of the transmission surface and coupled to the ultrasonic element; a shield covering the wiring; a holder arranged at a shield outer circumference of the shield and extending in the direction; and a protector facing the transmission surface and having a hole through which the ultrasonic wave passes. The shield is provided with a shield opening that faces the transmission surface. The holder is provided with a holder opening that faces the transmission surface. The protector is arranged at the holder opening.
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