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1.发明申请公开(公告)号：US20150224772A1
公开(公告)日：2015-08-13
申请号：US14616491
申请日：2015-02-06
Applicant: SEIKO EPSON CORPORATION
Inventor： Tsuyoshi YODA , Hiroshi SUGITA , Ikuya MIYAZAWA
CPC classification number: C23C18/1603 , B41J2/14233 , B41J2/161 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1643 , B41J2002/14491 , H01L2224/18 , Y10T428/24488
Abstract: A conduction structure includes a device substrate (third substrate) including a conductive portion, an IC (second substrate) including an upper surface, an end surface inclined toward the upper surface, and a conductive portion (second conductive portion), a sealing plate (first substrate) including an upper surface, an end surface (first side wall portion) inclined toward the upper surface, and a conductive portion (first conductive portion), and plating layers that respectively form electrical connections between a conductive portion and a conductive portion and between a conductive portion and the conductive portion.
Abstract translation: 导电结构包括包括导电部分的器件衬底（第三衬底），包括上表面的IC（第二衬底），朝向上表面倾斜的端面和导电部分（第二导电部分），密封板 第一基板），包括上表面，朝向上表面倾斜的端面（第一侧壁部）和导电部（第一导电部），以及分别在导电部和导电部之间形成电连接的镀层，以及 在导电部分和导电部分之间。
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公开(公告)号：US20170106653A1
公开(公告)日：2017-04-20
申请号：US15295773
申请日：2016-10-17
Applicant: SEIKO EPSON CORPORATION
Inventor： Yasuyuki MATSUMOTO , Shuichi TANAKA , Tsuyoshi YODA , Naohiro NAKAGAWA
CPC classification number: B41J2/14201 , B41J2/14233 , B41J2/1607 , B41J2/161 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1634 , B41J2/1643 , B41J2002/14491 , B41J2202/18
Abstract: A liquid ejecting head includes a first substrate in which a piezoelectric element is provided; and a second substrate on which the first substrate is connected to a first surface, in which the second substrate is provided with a penetration hole, which penetrates through the second substrate in a plate thickness direction, and penetration wiring, which is formed from a conductor that is formed in an inner portion of the penetration hole, the penetration wiring is formed from a first end portion, which is provided on a first surface side, a second end portion, which is provided on a second surface side, which is a surface that is on an opposite side to the first surface, and connection wiring, which connects the first end portion and the second end portion, and a cross-sectional area of the connection wiring in a planar direction of the first surface is smaller than cross-sectional areas of the first end portion and the second end portion in the planar direction.
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3.发明申请公开(公告)号：US20150231882A1
公开(公告)日：2015-08-20
申请号：US14620620
申请日：2015-02-12
Applicant: Seiko Epson Corporation
Inventor： Tsuyoshi YODA
CPC classification number: B41J2/1433 , B41J2/14233 , B41J2002/14491
Abstract: A wiring mounting structure includes: a first base that has a first main surface, a second main surface that is an undersurface opposite to the first main surface, and an inclined surface that is formed between the first main surface and the second main surface to have an angle as a reference angle with the second main surface, which is less than 90 degrees; a second base that has a third main surface which is joined to the second main surface of the first base; an adhesive which is disposed between the second main surface of the first base and the third main surface of the second base from an end portion of the inclined surface of the first base to an exposed region on the third main surface of the second base and by which the first base and the second base are joined; and a connection wiring that is provided to be continuous on from the inclined surface through the front surface of the adhesive to the third main surface of the second base. The front surface of the adhesive is provided to be continuous to the inclined surface and thus an angle formed between the front surface of the adhesive in a portion in which the adhesive is provided to be continuous to the inclined surface and the third main surface on which the adhesive is provided is less than the reference.
Abstract translation: 布线安装结构包括：具有第一主表面，与第一主表面相对的下表面的第二主表面的第一基底和形成在第一主表面和第二主表面之间的倾斜表面，以具有 作为与第二主表面的基准角的角度小于90度; 第二基座，具有与第一基座的第二主面接合的第三主面; 第一基座的第二主表面和第二基座的第三主表面之间的粘合剂，从第一基底的倾斜表面的端部到第二基底的第三主表面上的暴露区域，以及第二基底的第三主表面的暴露区域， 第一基座和第二基座接合; 以及连接配线，其通过粘合剂的前表面从第二基体的第三主面从倾斜面连续设置。 粘合剂的前表面设置成与倾斜表面连续，因此在粘合剂设置成与倾斜表面连续的部分和第三主表面之间形成在粘合剂的前表面之间的角度 提供的粘合剂小于参考。
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公开(公告)号：US20140082936A1
公开(公告)日：2014-03-27
申请号：US14095182
申请日：2013-12-03
Applicant: Seiko Epson Corporation
Inventor： Tsuyoshi YODA
IPC: H01L21/768
CPC classification number: H01L21/76898 , B81B7/0006 , B81B2201/0242 , B81B2201/0271 , G01C19/56 , G01C19/5776 , H01L21/76877 , H01L23/481 , H01L2924/00 , H01L2924/0002 , H05K3/225 , H05K3/321 , H05K3/4038 , H05K3/429 , H05K3/462 , Y10T29/49126 , Y10T29/49128 , Y10T29/49139
Abstract: A wiring substrate includes: a substrate having a first surface and a second surface; a first insulating layer stacked on the first surface; a pad electrode stacked on the first insulating layer; a through electrode connected to the pad electrode; and a second insulating layer disposed between the substrate and the through electrode and between the first insulating layer and the through electrode, wherein a diameter of the through electrode in a connection section between the pad electrode and the through electrode is smaller than a diameter of the through electrode on the second surface side, the first insulating layer, the second insulating layer and the through electrode overlap with each other in a peripheral area of the connection section, when seen from a plan view, and the thickness of the first insulating layer in the area is thinner than the thickness of the first insulating layer in other areas.
Abstract translation: 布线基板包括：具有第一表面和第二表面的基板; 堆叠在第一表面上的第一绝缘层; 堆叠在所述第一绝缘层上的焊盘电极; 连接到焊盘电极的贯通电极; 以及设置在所述基板和所述贯通电极之间并且位于所述第一绝缘层与所述贯通电极之间的第二绝缘层，其中，所述焊盘电极和贯通电极之间的连接部中的贯通电极的直径小于 在第二表面侧的贯通电极，第一绝缘层，第二绝缘层和贯通电极在连接部的周边区域彼此重叠，从平面图看，第一绝缘层的厚度 该区域比其它区域的第一绝缘层的厚度薄。
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5.发明申请公开(公告)号：US20170368826A1
公开(公告)日：2017-12-28
申请号：US15627662
申请日：2017-06-20
Applicant: SEIKO EPSON CORPORATION
Inventor： Motoki TAKABE , Eiju HIRAI , Munehide SAIMEN , Yasuyuki MATSUMOTO , Shuichi TANAKA , Tsuyoshi YODA
CPC classification number: B41J2/14201 , B41J2/1404 , B41J2/14072 , B41J2/14088 , B41J2/14233 , B41J2/1607 , B41J2002/14491 , B41J2202/18
Abstract: A MEMS device includes a wire that is formed of a conductive portion embedded into a recess opened in a first face of a substrate and a bump electrode that is electrically connected to the wire. A total width, in a second direction intersecting a first direction along which the wire extends on the first face, of an opening of the recess in a connection region where the wire and the bump electrode are electrically connected to each other is narrower than a width, in the second direction, of an opening of the recess in a region outside the connection region.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20150343768A1
公开(公告)日：2015-12-03
申请号：US14442043
申请日：2014-02-24
Applicant: SEIKO EPSON CORPORATION
Inventor： Tsuyoshi YODA
CPC classification number: B41J2/1433 , B41J2/14233 , B41J2/161 , B41J2/1623 , B41J2/1629 , B41J2/1631 , B41J2/1643 , B41J2/1646 , B41J2002/14241 , B41J2002/14491 , H05K1/181 , H05K3/10 , H05K2201/10212 , Y10T29/4913
Abstract: A liquid droplet ejecting head includes a vibrating plate on which terminals are formed, a reservoir forming substrate which is bonded to the vibrating plate and has a through portion having an inclined surface at an acute angle with respect to the vibrating plate as an inner wall, a substrate which is located on an opposite side to the vibrating plate through the reservoir forming substrate, is bonded to the reservoir forming substrate, and has terminals formed thereof, an IC package which is mounted on the substrate and is electrically connected to the terminals of the substrate, and wirings which are formed on the inclined surface and electrically connect the terminals on the vibrating plate and the terminals on the substrate.
Abstract translation: 液滴喷射头包括形成有端子的振动板，储存器形成基板，其结合到振动板并具有相对于振动板作为内壁具有锐角的倾斜表面的通孔部分， 通过储存器形成基板位于与振动板相反的一侧的基板被结合到储液器形成基板，并且具有形成有端子的IC封装，IC封装被安装在基板上并电连接到 基板和布线，其形成在倾斜表面上并将振动板上的端子和基板上的端子电连接。
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7.发明申请公开(公告)号：US20140306342A1
公开(公告)日：2014-10-16
申请号：US14315965
申请日：2014-06-26
Applicant: Seiko Epson Corporation
Inventor： Tsuyoshi YODA , Kazumi HARA
IPC: H01L23/00
CPC classification number: H01L24/13 , H01L21/6835 , H01L21/76898 , H01L23/481 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/90 , H01L2224/13009 , H01L2224/13099 , H01L2224/73103 , H01L2224/73204 , H01L2224/81005 , H01L2224/83191 , H01L2224/83194 , H01L2224/83856 , H01L2224/90 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/00012 , H01L2224/29099 , H01L2924/00
Abstract: A semiconductor device includes a semiconductor substrate and a through electrode provided in a through hole formed in the semiconductor substrate. The through electrode partially protrudes from a back surface of the semiconductor substrate, which is opposite to an active surface thereof. The through electrode includes a resin core and a conductive film covering at least a part of the resin core.
Abstract translation: 半导体器件包括半导体衬底和设置在形成于半导体衬底中的通孔中的通孔。 贯通电极从半导体基板的与其有效面相反的背面部分突出。 贯通电极包括树脂芯和覆盖至少一部分树脂芯的导电膜。
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8.发明申请公开(公告)号：US20150343769A1
公开(公告)日：2015-12-03
申请号：US14442061
申请日：2014-02-24
Applicant: SEIKO EPSON CORPORATION
Inventor： Tsuyoshi YODA
CPC classification number: B41J2/1433 , B41J2/14233 , B41J2/161 , B41J2/1623 , B41J2/1629 , B41J2/1631 , B41J2/1643 , B41J2/1646 , B41J2002/14241 , B41J2002/14491 , H05K1/0284 , H05K1/0306 , H05K1/11 , H05K3/10 , H05K2201/09036 , Y10T29/4913
Abstract: A liquid droplet ejecting head includes a vibrating plate on which a first terminal group having first and second terminals and a second terminal group having third and fourth terminals are formed, a reservoir forming substrate which has a first wiring forming portion having first and second inclined surfaces and a second wiring forming portion having third and fourth inclined surfaces, a first wiring which is formed on the first inclined surface and is electrically connected to the first terminal, a second wiring which is formed on the second inclined surface and is electrically connected to the second terminal, a third wiring which is formed on the third inclined surface and is electrically connected to the third terminal, and a fourth wiring which is formed on the fourth inclined surface and is electrically connected to the fourth terminal.
Abstract translation: 一种液滴喷射头，包括：振动板，具有第一和第二端子的第一端子组和形成有第三和第四端子的第二端子组，具有第一布线形成部分的第一和第二倾斜面的振荡板， 以及第二布线形成部分，具有第三和第四倾斜表面，第一布线形成在第一倾斜表面上并与第一端子电连接;第二布线，形成在第二倾斜表面上并电连接到 第二端子，形成在第三倾斜面上并与第三端子电连接的第三布线，以及形成在第四倾斜面上并与第四端子电连接的第四布线。
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9.发明申请公开(公告)号：US20150230333A1
公开(公告)日：2015-08-13
申请号：US14616466
申请日：2015-02-06
Applicant: SEIKO EPSON CORPORATION
Inventor： Tsuyoshi YODA , Shuichi TANAKA , Ikuya MIYAZAWA
CPC classification number: C23F1/02 , B41J2/14233 , B41J2/1612 , B41J2/1623 , B41J2/1629 , B41J2/1631 , B41J2/1642 , B41J2/1643 , B41J2/1646 , B41J2002/14241 , B41J2002/14419 , B41J2002/14491 , H01L2224/18
Abstract: A conduction structure includes a device substrate (first substrate), an IC (second substrate) having an upper surface and an end surface, a sealing plate (third substrate) having an upper surface and an end surface, a conductive layer having a first part provided on an upper surface of the device substrate, a second part provided on the end surface of the IC and connected to the first part, a third part provided on the upper surface of the IC and connected to the second part, and a fourth part provided on the end surface of the sealing plate and connected to both of the first part and the second part, and a plating layer overlapped with the conductive layer.
Abstract translation: 导电结构包括器件衬底（第一衬底），具有上表面和端面的IC（第二衬底），具有上表面和端表面的密封板（第三衬底），具有第一部分的导电层 设置在所述器件基板的上表面上的第二部分，设置在所述IC的端面上并连接到所述第一部分的第二部分，设置在所述IC的上表面并连接到所述第二部分的第三部分， 设置在密封板的端面上并连接到第一部分和第二部分，以及与导电层重叠的镀层。
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10.发明申请公开(公告)号：US20130075896A1
公开(公告)日：2013-03-28
申请号：US13675561
申请日：2012-11-13
Applicant: Seiko Epson Corporation
Inventor： Tsuyoshi YODA , Kazumi HARA
IPC: H01L23/498
CPC classification number: H01L24/13 , H01L21/6835 , H01L21/76898 , H01L23/481 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/90 , H01L2224/13009 , H01L2224/13099 , H01L2224/73103 , H01L2224/73204 , H01L2224/81005 , H01L2224/83191 , H01L2224/83194 , H01L2224/83856 , H01L2224/90 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/00012 , H01L2224/29099 , H01L2924/00
Abstract: A semiconductor device includes a semiconductor substrate and a through electrode provided in a through hole formed in the semiconductor substrate. The through electrode partially protrudes from a back surface of the semiconductor substrate, which is opposite to an active surface thereof. The through electrode includes a resin core and a conductive film covering at least a part of the resin core.
Abstract translation: 半导体器件包括半导体衬底和设置在形成于半导体衬底中的通孔中的通孔。 贯通电极从半导体基板的与其有效面相反的背面部分突出。 贯通电极包括树脂芯和覆盖至少一部分树脂芯的导电膜。
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