公开(公告)号：US20240162110A1

公开(公告)日：2024-05-16

申请号：US18054229

申请日：2022-11-10

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Seungwon IM ,  Jeungdae KIM ,  Oseob JEON ,  Byoungok LEE

IPC: H01L23/373 ,  H01L21/56 ,  H01L23/31 ,  H01L23/42 ,  H01L23/495

CPC classification number: H01L23/3735 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/42 ,  H01L23/49503 ,  H01L24/32 ,  H01L2224/32245

Abstract: In a general aspect, a semiconductor device package can include a die attach paddle having a first surface and a second surface that is opposite the first surface; a semiconductor die coupled with the first surface of the die attach paddle, and a direct-bonded-metal (DBM) substrate The DBM substrate can include a ceramic layer having a first surface and a second surface that is opposite the first surface, a first metal layer disposed on the first surface of the ceramic layer and coupled with the second surface of the die attach paddle, a second metal layer disposed on the second surface of the ceramic layer, and a thermally conductive adhesive disposed on the second metal layer, At least a surface of the thermally conductive adhesive can be exposed external to the device package. The thermally conductive adhesive can be configured for coupling the device package with a thermal dissipation appliance.

公开(公告)号：US20230327350A1

公开(公告)日：2023-10-12

申请号：US18190725

申请日：2023-03-27

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Seungwon IM ,  Oseob JEON ,  Dongwook KANG ,  Youngsun KO ,  Jeungdae KIM ,  Changsun YUN ,  Jihwan KIM

IPC: H01R12/58 ,  H01R43/16 ,  H01R43/26

CPC classification number: H01R12/585 ,  H01R43/26 ,  H01R43/16

Abstract: In a general aspect, an electronic device assembly includes a substrate arranged in a plane. The substrate has a first side and a second side, the second side being opposite the first side. The assembly also includes a plurality of semiconductor die disposed on the first side of the substrate and at least one signal pin. The at least one signal pin includes a proximal end portion coupled with the first side of the substrate, a distal end portion, and a medial portion disposed between the proximal end portion and the distal end portion. The medial portion is pre-molded in a molding compound, the proximal end portion and the distal end portion exclude the molding compound. The at least one signal pin is arranged along a longitudinal axis that is orthogonal to the plane of the substrate.

公开(公告)号：US20210066174A1

公开(公告)日：2021-03-04

申请号：US16668401

申请日：2019-10-30

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Seungwon IM ,  Jeungdae KIM ,  Oseob JEON

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495

Abstract: In one general aspect, a semiconductor device package can include a die attach paddle having a first surface and a second surface that is opposite the first surface. The package can also include a semiconductor die coupled with the first surface of the die attach paddle. The package can further include a direct-bonded-metal (DBM) substrate. The DBM substrate can include a ceramic layer having a first surface and a second surface that is opposite the first surface; a first metal layer disposed on the first surface of the ceramic layer and coupled with the second surface of the die attach paddle; and a second metal layer disposed on the second surface of the ceramic layer. The second metal layer can be exposed external to the semiconductor device package. The second metal layer can be electrically isolated from the first metal layer by the ceramic layer.