公开(公告)号：US20250157893A1

公开(公告)日：2025-05-15

申请号：US18507381

申请日：2023-11-13

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jie CHANG ,  Sen SUN ,  XiaoYing YUAN ,  Sixin JI ,  AnAn XING ,  Keunhyuk LEE

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

Abstract: A package includes a semiconductor die attached to a die attach pad by a first sinter bond. The package further includes a clip having a first end and a second end. The first end of the clip is attached to a device contact pad on the semiconductor die by a second sinter bond and the second end of the clip is attached to a post of a lead by a joint. The package further includes a mold body encapsulating the semiconductor die.

公开(公告)号：US20240051089A1

公开(公告)日：2024-02-15

申请号：US17819469

申请日：2022-08-12

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Sen SUN ,  Kun FENG ,  Hu CHENG ,  Naima WANG

IPC: B25B1/24

CPC classification number: B25B1/2405

Abstract: Implementations of a clamp finger may include a first portion including at least one tip configured to clamp a substrate against an anvil during a bonding operation; and a second portion including a first opening therethrough configured to permit coupling of the second portion with a clamping bridge. The first portion may be slidably coupled with the second portion through a rail and the first portion may include an opening therethrough configured to receive a screw that fixedly couples the at least one tip of the first portion at a desired position relative to the second portion.