公开(公告)号：US20250015044A1

公开(公告)日：2025-01-09

申请号：US18346976

申请日：2023-07-05

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Hao YAN ,  Kun FENG ,  Sixin JI ,  ZhengDong GE

IPC: H01L23/00 ,  H01L23/373

Abstract: A die-attach process that creates a bond strength sufficient to hold a die to a substrate while it is handled before being permanently attached is disclosed. The die-attach process includes forming locking features in a metal layer of a substrate so a bond at the die-substrate interface is strengthened. The locking features may include a plurality of cavities or slots formed in a metal layer of the substrate. The cavities and slots can increase a surface area and provide anchor points for a die-attach film placed between the die and the substrate.

公开(公告)号：US20240304596A1

公开(公告)日：2024-09-12

申请号：US18179072

申请日：2023-03-06

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Dukyong LEE ,  Hao YAN ,  Kun FENG

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L24/27 ,  H01L24/29 ,  H01L2224/27003 ,  H01L2224/2711 ,  H01L2224/2732 ,  H01L2224/27418 ,  H01L2224/27438 ,  H01L2224/277 ,  H01L2224/27848 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/83101 ,  H01L2224/83104 ,  H01L2224/83201 ,  H01L2224/8384

Abstract: Implementations of a sintering film frame may include a frame including an outer perimeter and an inner perimeter, the inner perimeter defining an opening through the frame; a position detection opening through the frame; at least two alignment holes through the frame; and a frame identifier on a side of the frame.

公开(公告)号：US20240051089A1

公开(公告)日：2024-02-15

申请号：US17819469

申请日：2022-08-12

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Sen SUN ,  Kun FENG ,  Hu CHENG ,  Naima WANG

IPC: B25B1/24

CPC classification number: B25B1/2405

Abstract: Implementations of a clamp finger may include a first portion including at least one tip configured to clamp a substrate against an anvil during a bonding operation; and a second portion including a first opening therethrough configured to permit coupling of the second portion with a clamping bridge. The first portion may be slidably coupled with the second portion through a rail and the first portion may include an opening therethrough configured to receive a screw that fixedly couples the at least one tip of the first portion at a desired position relative to the second portion.