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1.发明授权公开(公告)号：US10483151B2
公开(公告)日：2019-11-19
申请号：US15472671
申请日：2017-03-29
Applicant: SHIBAURA MECHATRONICS CORPORATION
Inventor： Masaaki Furuya
IPC: H01L21/68 , H01L21/687 , H01L21/67 , H01L21/677
Abstract: According to one embodiment, a substrate transfer apparatus includes: a first gripping plate; a first claw that is supported by the first gripping plate, and has an abutment surface abutting on the outer peripheral surface of a substrate located above and below a surface of the first gripping plate; a second gripping plate arranged as overlapping with the first gripping plate; a second claw that is supported by the second gripping plate, and has an abutment surface abutting on the outer peripheral surface of the substrate located above and below the surface of the first gripping plate; and a gripping part configured to move the first gripping plate and the second gripping plate relative to each other such that the first claw and the second claw move close to and away from each other in a direction intersecting the outer peripheral surface of the substrate.
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公开(公告)号：US10319602B2
公开(公告)日：2019-06-11
申请号：US14490939
申请日：2014-09-19
Applicant: SHIBAURA MECHATRONICS CORPORATION
Inventor： Nobuo Kobayashi , Koichi Hamada , Yoshiaki Kurokawa , Masaaki Furuya , Hideki Mori , Yasushi Watanabe , Yoshinori Hayashi
IPC: H01L21/311 , B05C3/02 , H01L21/67
Abstract: A substrate treatment apparatus which can more efficiently regenerate phosphoric acid which is able to be returned to etching treatment along with such etching treatment as much as possible without using a large facility, that is, a substrate treatment apparatus which treats a silicon substrate W on which a nitride film is formed by a liquid etchant which contains phosphoric acid, which comprises an etching treatment unit (the spin treatment unit 30) which gives a suitable quantity of liquid etchant to each substrate which is fed one at a time so as to etch the substrate and remove the nitride film, a phosphoric acid regenerating unit (the spin treatment unit 30) which mixes liquid etchant used for treatment of one substrate and a suitable quantity of liquid hydrofluoric acid for the amount of the used liquid etchant under a predetermined temperature environment to regenerate the phosphoric acid, and a phosphoric acid recovery unit (the pump 38, phosphoric acid recovery tank 50, and pump 52) which returns the phosphoric acid which was obtained by the phosphoric acid regenerating unit to the liquid etchant to be used at the etching treatment unit.
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3.发明授权公开(公告)号：US12257595B2
公开(公告)日：2025-03-25
申请号：US18119401
申请日：2023-03-09
Applicant: SHIBAURA MECHATRONICS CORPORATION
Inventor： Masaaki Furuya , Hiroaki Kobayashi , Hideki Mori
IPC: B05C11/10
Abstract: According to one embodiment, a processing liquid supply device includes a plurality of tanks, a supply path that supplies a processing liquid to a processing device, a heating unit that heats the processing liquid, a dilution unit that dilutes the processing liquid, a new-liquid supply unit that supplies a new liquid, a common flow path through which the processing liquid of the plurality of tanks passes, a switching unit that switches between the plurality of tanks so that at least a tank is selected from which the processing liquid passes to the common flow path, a densitometer provided in the common flow path, and a control device that controls at least one of the heating unit, the dilution unit, and the new-liquid supply unit so that the concentration reaches a target value set in advance.
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公开(公告)号：US11193850B2
公开(公告)日：2021-12-07
申请号：US16587737
申请日：2019-09-30
Applicant: SHIBAURA MECHATRONICS CORPORATION
Inventor： Masataka Yokoi , Nobuo Kobayashi , Masaaki Furuya , Atsushi Kinase
Abstract: A gas leak detecting device of a heater pipe and a gas leak detecting method of a heater pipe, which are able to reliably detect a leak of gas from a heater pipe in which a fine hole is formed. A gas leak detecting device of a heater pipe, which is provided with an inside pipe housing a heater element and an outside pipe sealed surrounding the inside pipe and which is adjusted by a pressure adjustment mechanism in gas pressure in a space between the outside pipe and the inside pipe to a predetermined pressure value. The gas leak detecting device includes a gas flow resistance part, a pressure detection unit, and a leak judging device that judges whether gas is leaking from the heater pipe based on a detected pressure value obtained by the pressure detection unit.
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公开(公告)号：US09922861B2
公开(公告)日：2018-03-20
申请号：US14247329
申请日：2014-04-08
Applicant: SHIBAURA MECHATRONICS CORPORATION
Inventor： Masaaki Furuya , Koichi Higuchi
IPC: H01L21/687
CPC classification number: H01L21/68728
Abstract: A rotary table; a drive motor M configured to rotate the rotary table; a pin base supported by the rotary table; a pin fixing member configured to move closer to or away from C1 upon the pin base revolving; first chuck pins and second chuck pins provided on the pin fixing member and configured to be into contact with an outer edge of the substrate W; a substrate gripping force generation mechanism including a spring member; a chuck pin switching mechanism including an inertia member configured to be rotated coaxially with the rotary table and a protruded member provided on an outer peripheral part of the inertia member; and a cam member provided on the pin fixing member and configured to engage with protruded member.
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Patent Agency Ranking
公开(公告)号：US09679787B2
公开(公告)日：2017-06-13
申请号：US14472923
申请日：2014-08-29
Applicant: SHIBAURA MECHATRONICS CORPORATION
Inventor： Masaaki Furuya
CPC classification number: H01L21/67028 , G03F7/162 , G03F7/3021 , H01L21/67051 , H01L21/6715 , H01L21/68785
Abstract: A spin treatment apparatus includes an annular liquid receiver, an annular cup body and an annular partitioning member. The annular liquid receiver surrounds a rotating substrate at a distance from an outer periphery of the substrate and is configured to receive liquid flying from the rotating substrate and accommodate the liquid. The annular cup body surrounds the liquid receiver at a distance from an outer periphery of the liquid receiver and forms an annular outer exhaust flow channel for generating an airflow along an upper surface to an outer peripheral surface of the liquid receiver. The annular partitioning member is provided inside the annular liquid receiver and forms an annular inner exhaust flow channel for generating an airflow along an inner peripheral surface to a lower surface of the liquid receiver.
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公开(公告)号：US09454080B2
公开(公告)日：2016-09-27
申请号：US14491065
申请日：2014-09-19
Applicant: Shibaura Mechatronics Corporation
Inventor： Masaaki Furuya
CPC classification number: G03F7/162 , G03F7/3021 , G03F7/42 , H01L21/68728
Abstract: A spin treatment apparatus according to an embodiment performs a treatment while rotating a substrate and includes: at least three clamp pins configured to contact an outer peripheral surface of the substrate and clamp the substrate; rotatable pin rotators provided for the respective clamp pins and each configured to retain the corresponding clamp pin at a position offset from a rotation axis of the pin rotator parallel with a rotation axis of the substrate; magnet gears provided for the respective pin rotators around outer peripheral surfaces thereof and each having a magnetic-pole part formed spirally about the rotation axis of the pin rotator; rotation magnets provided for the respective magnet gears and positioned to attract and be attracted by the magnetic-pole part of the corresponding magnet gear; and a movement mechanism configured to move the rotation magnets along the rotation axes of the pin rotators.
Abstract translation: 根据实施例的旋转处理装置在旋转基板的同时执行处理，并且包括：至少三个夹持销，其构造成接触基板的外周表面并夹持基板; 为相应的夹紧销提供的可旋转的针式转子，并且每个构造成将相应的夹紧销保持在与转子的旋转轴线偏置的位置，该位置与衬底的旋转轴线平行; 磁轮齿轮围绕其外周表面设置用于相应的销转子，并且每个具有围绕销转子的旋转轴线螺旋形成的磁极部分; 设置在各磁铁上的旋转磁铁，定位成吸引并被相应磁齿轮的磁极部吸引; 以及移动机构，其构造成沿着所述销转子的旋转轴线移动所述旋转磁体。
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公开(公告)号：US11996310B2
公开(公告)日：2024-05-28
申请号：US17476368
申请日：2021-09-15
Applicant: SHIBAURA MECHATRONICS CORPORATION
Inventor： Masaaki Furuya
IPC: H01L21/67 , B65G47/90 , H01L21/677
CPC classification number: H01L21/67706 , B65G47/90 , H01L21/67167 , H01L21/67173 , H01L21/67712
Abstract: A substrate carrying apparatus that can reduce attachment of dust to substrates can be provided. The substrate carrying apparatus 1 of the present embodiment includes a carrying arm 2 for carrying a substrate, a column 32 standing up from a base body 31 with fixed angle, an upper link 33 which supports the carrying arm 2 at one end, which is rotatably connected to the column 32, and which moves the carrying arm 2 up and down in accordance with a rotation, a lower link 34 which is connected to be rotatable around an axis in parallel with a rotation axis of the upper link 33 as a center below a portion of the column 32 connected to the upper link 33, a connection link 35 which is rotatably connected to the upper link 33 and the lower link 34 so that the upper link 33 rotates in accordance with a rotation of the lower link 34, and a driving unit 4 which rotates the lower link 34.
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公开(公告)号：US10276406B2
公开(公告)日：2019-04-30
申请号：US14212899
申请日：2014-03-14
Applicant: SHIBAURA MECHATRONICS CORPORATION
Inventor： Konosuke Hayashi , Masaaki Furuya , Takashi Ootagaki , Yuji Nagashima , Atsushi Kinase , Masahiro Abe
Abstract: A substrate processing device includes a suction drying section drying a surface of a substrate by absorbing and removing a liquid droplet of volatile solvent formed on the surface of the substrate by a heating operation of a heating section.
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公开(公告)号：US09607865B2
公开(公告)日：2017-03-28
申请号：US14212218
申请日：2014-03-14
Applicant: SHIBAURA MECHATRONICS CORPORATION
Inventor： Konosuke Hayashi , Masaaki Furuya , Takashi Ootagaki , Yuji Nagashima , Atsushi Kinase , Masahiro Abe
IPC: H01L21/67 , H01L21/677
CPC classification number: H01L21/67051 , H01L21/67028 , H01L21/67034 , H01L21/6776
Abstract: A substrate processing device 100 includes a cleaning liquid supply unit 114 supplying a cleaning liquid to a surface of a substrate W, a solvent supply unit 115 supplying a volatile solvent to the surface of the substrate W supplied with the cleaning liquid to replace the cleaning liquid on the surface of the substrate W with the volatile solvent, a heating unit 117 heating the substrate W supplied with the volatile solvent, and a drying unit 118 drying the surface of the substrate W by removing a droplet of the volatile solvent produced on the surface of the substrate W by a heating operation of the heating unit 117, and the heating unit 117 and the drying unit 118 are arranged in a course of transportation of the substrate W transported from the solvent supply unit 115.
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