公开(公告)号：US12217996B2

公开(公告)日：2025-02-04

申请号：US17603934

申请日：2020-04-13

Applicant: SHINKAWA LTD.

Inventor： Jin Li ,  Hiroshi Kikuchi ,  Satoshi Enokido

IPC: H01L21/683 ,  H01L21/677

Abstract: This conveying device 1 comprises: a chuck 2 that contactlessly holds a semiconductor chip 103 to face a holding surface 2B; and a guide 3 that has a guide probe 9 capable of abutting a chip side surface 103s of the semiconductor chip 103, and for the semiconductor chip 103 held by the chuck 2, the guide probe 9 limits the movement of the semiconductor chip 103 in the lateral direction which intersects a normal N to the holding surface 2B. The guide probe 9 is capable of reciprocating movement in which a probe tip 9a moves towards and away from the holding surface 2B.

公开(公告)号：US10262968B2

公开(公告)日：2019-04-16

申请号：US15716525

申请日：2017-09-27

Applicant: SHINKAWA LTD.

Inventor： Shigeru Hayata ,  Satoshi Enokido

IPC: B23K1/00 ,  H01L21/00 ,  H01L23/00 ,  B23K1/06 ,  B23K3/08 ,  B23K35/02 ,  B23K101/40

Abstract: In order to easily and accurately measure an offset for wire bonding and improve precision of wire bonding, a wiring bonding apparatus includes a first imaging unit, a bonding tool, a moving mechanism, a reference member, a second imaging unit arranged on the opposite side to the bonding tool and the first imaging unit with respect to a reference surface, and a control unit. The first imaging unit detects a position of an optical axis of the first image capture unit with respect to a position of the reference member, the second imaging unit detects the position of the reference member when moving the bonding tool above the reference member according to pre-stored offset values, and detects a position of a ball-shaped tip section of a wire, and the control unit measures a change in offset between the bonding tool and the first imaging unit based on each detection result.