公开(公告)号：US20220165591A1

公开(公告)日：2022-05-26

申请号：US17602279

申请日：2020-04-07

Applicant: SHINKAWA LTD.

Inventor： Shigeyuki SEKIGUCHI ,  Yuji EGUCHI ,  Kohei SEYAMA

IPC: H01L21/67 ,  H05K13/04 ,  H01L23/00

Abstract: This bonding apparatus is provided with: a tape feeder module which takes out an electronic component from a carrier tape and transfers the electronic component thus taken out; a die supply module which has a die pick-up mechanism for picking up a semiconductor die from a semiconductor wafer bonded to a dicing sheet by pushing up the semiconductor die and which transfers the semiconductor die thus picked up; and a bonding module which arranges, on a circuit substrate, the semiconductor die supplied by the die supply module and/or the electronic component supplied by the tape feeder module.

公开(公告)号：US20240082941A1

公开(公告)日：2024-03-14

申请号：US17913162

申请日：2021-07-20

Applicant: SHINKAWA LTD.

Inventor： Shigeyuki SEKIGUCHI

IPC: B23K3/08

CPC classification number: B23K3/082

Abstract: A flux transfer apparatus (100) includes: a stage (12), having a concave part (13) at a central part; a flux pot (20), having, disposed on a bottom plate (25), a through hole (27) supplying flux (50) to a concave part (13), and reciprocally moving on a surface (14, 15) of the stage (12) to supply the flux (50) to the concave part (13); a detector (30), detecting a remaining amount of the flux (50) stored in the flux pot (20). The detector is disposed on a lower side of the stage (12) or a lateral side of the flux pot (20).