公开(公告)号：US20220319891A1

公开(公告)日：2022-10-06

申请号：US17608753

申请日：2021-04-23

Applicant: SHINKAWA LTD.

Inventor： Yuji EGUCHI ,  Kohei SEYAMA

IPC: H01L21/68 ,  H01L21/683

Abstract: A manufacturing apparatus of a semiconductor device includes a stage, a bonding head, a copying mechanism mounted on the bonding head, and a controller executing adjustment processing. In the adjustment processing, the controller causes a facing surface of the bonding head to abut against a reference surface of the stage after setting the copying mechanism to a locked state, then presses the facing surface against the reference surface after switching the copying mechanism to a free state, and after that, switches the copying mechanism to the locked state.

公开(公告)号：US20200083190A1

公开(公告)日：2020-03-12

申请号：US16615816

申请日：2018-05-24

Applicant: SHINKAWA LTD. ,  TOHOKU UNIVERSITY

Inventor： Yuji EGUCHI ,  Kohei SEYAMA ,  Tomonori NAKAMURA ,  Hiroshi KIKUCHI ,  Takehito SHIMATSU ,  Miyuki UOMOTO

IPC: H01L23/00

Abstract: This method for producing a structure wherein base materials are bonded by atomic diffusion comprises: a step for applying a liquid resin on the base material; a step for smoothing the surface of the liquid resin by surface tension; a step for forming a resin layer by curing; a step for forming a metal thin film on the resin layer; a step for forming a metal thin film on the base material; and a step for bringing the metal thin film of the base material and the metal thin film of the base material into close contact with each other, thereby bonding the metal thin film of the resin layer and the metal thin film of the base material with each other by atomic diffusion

公开(公告)号：US20220165591A1

公开(公告)日：2022-05-26

申请号：US17602279

申请日：2020-04-07

Applicant: SHINKAWA LTD.

Inventor： Shigeyuki SEKIGUCHI ,  Yuji EGUCHI ,  Kohei SEYAMA

IPC: H01L21/67 ,  H05K13/04 ,  H01L23/00

Abstract: This bonding apparatus is provided with: a tape feeder module which takes out an electronic component from a carrier tape and transfers the electronic component thus taken out; a die supply module which has a die pick-up mechanism for picking up a semiconductor die from a semiconductor wafer bonded to a dicing sheet by pushing up the semiconductor die and which transfers the semiconductor die thus picked up; and a bonding module which arranges, on a circuit substrate, the semiconductor die supplied by the die supply module and/or the electronic component supplied by the tape feeder module.

公开(公告)号：US20230154775A1

公开(公告)日：2023-05-18

申请号：US17915094

申请日：2020-12-14

Applicant: SHINKAWA LTD.

Inventor： Yuji EGUCHI ,  Kohei SEYAMA

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67259 ,  H01L21/67132 ,  H01L21/68764

Abstract: A semiconductor device manufacturing device (10) includes a stage (12), an installing head (14) that has a chip holding surface (26) and disposes a chip (100) on a substrate (110), a measuring mechanism (16) that measures a tilt angle of the chip (100) loaded on an installing surface (112) of the substrate (110) by the installing head (14) with respect to the installing surface (112) as a detection tilt angle Sd, a holding surface adjusting mechanism (18) that changes a holding surface tilt angle Sb which is a tilt angle of the chip holding surface (26) with respect to a loading surface (21), and a controller (20) that calculates a correction amount C of the holding surface tilt angle Sb based on the detection tilt angle Sd and changes the holding surface tilt angle Sb by the holding surface adjusting mechanism (18) according to the calculated correction amount C.

公开(公告)号：US20240063049A1

公开(公告)日：2024-02-22

申请号：US18270732

申请日：2021-03-16

Applicant: SHINKAWA LTD.

Inventor： Yuji EGUCHI

IPC: H01L21/683 ,  H01L21/677

CPC classification number: H01L21/6838 ,  H01L21/67721

Abstract: A suction device, a suction unit, a suction method, and a computer-readable recording medium are provided. The suction device according to the present invention includes: a suction head; a movement control unit that causes the suction head to move between a first position for suction of an electronic component housed in a recess of a housing member and a second position further separated from the electronic component than the first position; a suction control unit that causes suction of the electronic component to the suction head when the suction head is located at the first position. When located at the first position, the suction head has a contact portion that comes into contact with a first surface on an outer side of a region where the recess in the housing member is opened.

公开(公告)号：US20210225799A1

公开(公告)日：2021-07-22

申请号：US16087087

申请日：2017-03-24

Applicant: SHINKAWA LTD.

Inventor： Kohei SEYAMA ,  Yuji EGUCHI ,  Shoji WADA

IPC: H01L23/00 ,  H01L21/52 ,  H01L25/065 ,  H01L25/10

Abstract: The present invention has: a heater; and a bonding tool having a lower surface on which a memory chip is adsorbed; and an upper surface attached to the heater, and is provided with a bonding tool which presses the peripheral edge of the memory chip to a solder ball in a first peripheral area of the lower surface and which presses the center of the memory chip (60) to a DAF having a heat resistance temperature lower than that of the solder ball in a first center area. The amount of heat transmitted from the first center area to the center of the memory chip is smaller than that transmitted from the first peripheral area (A) to the peripheral edge of the memory chip. Thus, the bonding apparatus in which the center of a bonding member can be heated to a temperature lower than that at the peripheral edge can be provided.