公开(公告)号：US20200273742A1

公开(公告)日：2020-08-27

申请号：US16622297

申请日：2018-03-07

Applicant: SHINKAWA LTD.

Inventor： Shoji WADA

IPC: H01L21/687 ,  H01L21/67

Abstract: An apparatus for manufacturing a semiconductor device includes a base portion, a bonding stage arranged on the base portion and having a placement surface for placing a substrate; and one or more connecting members which connect the base portion and the bonding stage, wherein at least one of the one or more connecting members is a connecting plate that deflects following the expansion and contraction of the bonding stage in the plane direction caused by a temperature change.

公开(公告)号：US20210225799A1

公开(公告)日：2021-07-22

申请号：US16087087

申请日：2017-03-24

Applicant: SHINKAWA LTD.

Inventor： Kohei SEYAMA ,  Yuji EGUCHI ,  Shoji WADA

IPC: H01L23/00 ,  H01L21/52 ,  H01L25/065 ,  H01L25/10

Abstract: The present invention has: a heater; and a bonding tool having a lower surface on which a memory chip is adsorbed; and an upper surface attached to the heater, and is provided with a bonding tool which presses the peripheral edge of the memory chip to a solder ball in a first peripheral area of the lower surface and which presses the center of the memory chip (60) to a DAF having a heat resistance temperature lower than that of the solder ball in a first center area. The amount of heat transmitted from the first center area to the center of the memory chip is smaller than that transmitted from the first peripheral area (A) to the peripheral edge of the memory chip. Thus, the bonding apparatus in which the center of a bonding member can be heated to a temperature lower than that at the peripheral edge can be provided.

公开(公告)号：US20170297131A1

公开(公告)日：2017-10-19

申请号：US15591674

申请日：2017-05-10

Applicant: Shinkawa Ltd.

Inventor： Kohei SEYAMA ,  Shoji WADA

IPC: B23K3/08 ,  B23K101/42

CPC classification number: B23K3/082 ,  B23K2101/42

Abstract: A flux reservoir apparatus (100, 200) includes a stage (12) having a recessed portion (13) for reserving flux (51, 52, 53) therein and a flux pot (20) composed of an annular member having a through hole (30) through which the flux (51, 52, 53) flows, the flux pot arranged to move back and forth on the surface (14) of the stage (12) to feed the flux (51, 52, 53) into the recessed portion (13) and to smooth the surface of the flux (51, 52, 53), in which the through hole (30) is an elongated hexagonal hole with a length greater than the width of the recessed portion (13) in the direction perpendicular to the back-and-forth direction, and in which the bottom surface of a flux pot main body (21) is a chevron surface. This reduces leakage of the flux (51, 52, 53) in the flux reservoir apparatus (100, 200).