公开(公告)号：US20160207762A1

公开(公告)日：2016-07-21

申请号：US14600256

申请日：2015-01-20

Applicant: SIGURD MICROELECTRONICS CORP.

Inventor： CHIH-WEI LU ,  KUAN-TIEN SHEN ,  TSAN-LIEN YEH

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81C1/00309 ,  B81B2201/0214 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2207/012 ,  B81B2207/07 ,  B81C2203/0154 ,  B81C2203/035

Abstract: A sensor package structure and method is characterized in connecting a sensor with a circuit substrate in a flip chip bonding method to enhance the structure strength and miniaturize the product; using a no-flow underfill glue to fill the gap between the sensor and the circuit substrate to protect the contacts of the flip chip structure, prevent the performance from being affected by the overflowing encapsulant, and promote the reliability of products. The present invention uses the no-flow underfill glue process to replace the processes of forming a dam and a soft protection layer and thus simplifies the fabrication process and reduces the fabrication cost.

Abstract translation: 传感器封装结构和方法的特征在于以倒装芯片接合方法将传感器与电路基板连接，以提高结构强度并使产品小型化; 使用无流动底部填充胶填充传感器和电路基板之间的间隙，以保护倒装芯片结构的触点，防止性能受溢出密封剂的影响，并提高产品的可靠性。 本发明使用无流动底部填充胶工艺来代替形成坝和软保护层的工艺，从而简化制造工艺并降低制造成本。