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公开(公告)号:US11491787B2
公开(公告)日:2022-11-08
申请号:US17102723
申请日:2020-11-24
Applicant: SII PRINTEK INC.
Inventor: Tomoki Ai , Yuki Yamamura , Masakazu Hirata , Kenji Suzuki
Abstract: There are provided a head chip and so on capable of improving the print image quality. The head chip according to an embodiment of the present disclosure is provided with an actuator plate having a plurality of ejection grooves and a nozzle plate having a plurality of nozzle holes individually communicated with the plurality of ejection grooves. The plurality of ejection grooves is arranged side by side so as to at least partially overlap each other along a predetermined direction. Further, the nozzle holes adjacent to each other along the predetermined direction out of the plurality of nozzle holes are arranged so as to be shifted from each other along an extending direction of the ejection grooves in the nozzle plate.
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公开(公告)号:US11225079B2
公开(公告)日:2022-01-18
申请号:US17105067
申请日:2020-11-25
Applicant: SII PRINTEK INC.
Inventor: Masakazu Hirata , Kenji Suzuki , Masanori Tamura
Abstract: There are provided a head chip and so on capable of improving the print image quality while suppressing the manufacturing cost. The head chip according to an embodiment of the present disclosure includes an actuator plate having a plurality of ejection grooves, a nozzle plate having a plurality of nozzle holes, and a cover plate having a first through hole, a second through hole, and a wall part. The plurality of nozzle holes includes a plurality of first nozzle holes arranged so as to be shifted toward the first through hole, and a plurality of second nozzle holes arranged so as to be shifted toward the second through hole. In a first ejection groove communicated with the first nozzle hole, a first cross-sectional area of a part communicated with the first through hole is smaller than a second cross-sectional area of a part communicated with the second through hole. In a second ejection groove communicated with the second nozzle hole, the second cross-sectional area is smaller than the first cross-sectional area. A first expansion flow channel part is formed in the vicinity of the first nozzle hole, and a second expansion flow channel part is formed in the vicinity of the second nozzle hole. A central position of the first expansion flow channel part coincides with a first central position of the first nozzle hole, or is shifted toward the first through hole. A central position of the second expansion flow channel part coincides with a second central position of the second nozzle hole, or is shifted toward the second through hole.
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公开(公告)号:US20210162754A1
公开(公告)日:2021-06-03
申请号:US17102723
申请日:2020-11-24
Applicant: SII PRINTEK INC.
Inventor: Tomoki Ai , Yuki Yamamura , Masakazu Hirata , Kenji Suzuki
Abstract: There are provided a head chip and so on capable of improving the print image quality. The head chip according to an embodiment of the present disclosure is provided with an actuator plate having a plurality of ejection grooves and a nozzle plate having a plurality of nozzle holes individually communicated with the plurality of ejection grooves. The plurality of ejection grooves is arranged side by side so as to at least partially overlap each other along a predetermined direction. Further, the nozzle holes adjacent to each other along the predetermined direction out of the plurality of nozzle holes are arranged so as to be shifted from each other along an extending direction of the ejection grooves in the nozzle plate.
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4.
公开(公告)号:US20240066902A1
公开(公告)日:2024-02-29
申请号:US18238228
申请日:2023-08-25
Applicant: SII Printek Inc.
Inventor: Yuichi TAKAHAMA , Kenji Suzuki , Nobuhiro Kawakami , Takuma Yanagisawa
IPC: B41J29/377 , B41J2/045 , B41J2/14
CPC classification number: B41J29/377 , B41J2/04515 , B41J2/04581 , B41J2/1408 , B41J2/14201 , B41J2202/08
Abstract: A cooling efficiency is increased. An inkjet head is provided with a head main body for jetting ink, a cooling pipe which has corrosion resistance to the ink, and through which the ink for cooling a drive circuit passes, and a cooling member which has higher thermal conductivity than that of the cooling pipe, in which at least a part of the cooling pipe is embedded, and which has recessed parts in at least a part of a portion surrounding the cooling pipe.
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