公开(公告)号：US10529688B1

公开(公告)日：2020-01-07

申请号：US15462885

申请日：2017-03-19

Applicant: SMART Modular Technologies, Inc.

Inventor： Satyanarayan Shivkumar Iyer ,  Reuben J. Chang ,  Victor Mahran

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00

Abstract: A system and method of manufacture of an integrated circuit device system includes mounting a first elevated device on a first riser positioned adjacent to a base device. The first elevated device includes a first device overhang that extends over the base device. A second elevated device can be mounted on a second riser adjacent to the first riser to allow the attachment of a second elevated device mounted above the first elevated device to achieve higher component densities.

公开(公告)号：US10573354B2

公开(公告)日：2020-02-25

申请号：US15273385

申请日：2016-09-22

Applicant: SMART Modular Technologies, Inc.

Inventor： Satyanarayan Shivkumar Iyer ,  Robert S. Pauley, Jr.

IPC: G06F12/00 ,  G11C7/00 ,  G06F13/00 ,  G06F13/28 ,  G06F3/06

Abstract: Approaches, techniques, and mechanisms are disclosed for manufacturing and operating high density memory systems. The high density memory systems can increase the amount of memory available to a computing system by allowing the connection of multiple memory modules into a single memory interface on a motherboard via a memory adapter as described herein.

公开(公告)号：US20180081554A1

公开(公告)日：2018-03-22

申请号：US15273385

申请日：2016-09-22

Applicant: SMART Modular Technologies, Inc.

Inventor： Satyanarayan Shivkumar Iyer ,  Robert S. Pauley, JR.

IPC: G06F3/06

Abstract: Approaches, techniques, and mechanisms are disclosed for manufacturing and operating high density memory systems. The high density memory systems can increase the amount of memory available to a computing system by allowing the connection of multiple memory modules into a single memory interface on a motherboard via a memory adapter as described herein.

公开(公告)号：US09648754B1

公开(公告)日：2017-05-09

申请号：US14231622

申请日：2014-03-31

Applicant: SMART Modular Technologies, Inc.

Inventor： Satyanarayan Shivkumar Iyer ,  Robert S. Pauley, Jr. ,  Victor Mahran

IPC: H05K1/11 ,  H05K1/14 ,  H05K3/30 ,  H05K1/18

CPC classification number: H05K1/181 ,  H05K3/301 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/10159 ,  Y02P70/611

Abstract: A system and method of manufacture of an integrated circuit device system includes: a module interposer having a module first side and a module second side; an outer chip assembly mounted to the module first side; a mirrored chip assembly mounted to the module second side, the mirrored chip assembly below the outer chip assembly; and a carrier attached to the module second side, the carrier includes a carrier first side and a carrier second side, the mirrored chip assembly suspended above the carrier first side.

公开(公告)号：US09603252B1

公开(公告)日：2017-03-21

申请号：US14077908

申请日：2013-11-12

Applicant: SMART Modular Technologies, Inc.

Inventor： Satyanarayan Shivkumar Iyer ,  Reuben J. Chang ,  Victor Mahran

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K1/181 ,  H05K3/301 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/10159 ,  Y02P70/611

Abstract: A system and method of manufacture of an integrated circuit device system includes: a carrier having a first side; a base device mounted on the first side; a first riser mounted on the first side; a second riser mounted on the first side and adjacent to the first riser; a peripheral elevated device mounted on the first riser, the peripheral elevated device having a device overhang above the base device; and an inner elevated device mounted on the second riser, the inner elevated device having the device overhang above the base device.