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1.发明授权Extended capacity memory system with load relieved memory and method of manufacture thereof 有权具有负载缓冲存储器的扩展容量存储器系统及其制造方法公开(公告)号：US09204550B2
公开(公告)日：2015-12-01
申请号：US13633074
申请日：2012-10-01
Applicant: SMART Modular Technologies, Inc.
Inventor： Victor Mahran , Robert S. Pauley, Jr.
IPC: G06F1/16 , H05K5/00 , H05K7/00 , H05K7/20 , H01L23/48 , H01R12/00 , H05K1/14 , H05K7/14 , H05K1/02 , G06F1/20 , G11C5/02
CPC classification number: G06F1/185 , G06F1/20 , G11C5/025 , H05K1/0209 , H05K1/144 , H05K1/145 , H05K7/1431 , H05K2201/042 , H05K2201/10159 , H05K2201/10303 , H05K2201/10378 , H05K2201/10409 , Y10T29/4913
Abstract: A method of manufacture of an enhanced capacity memory system includes: providing a dual in-line memory module carrier having a memory module and an integrated memory buffer coupled to the memory module; coupling a memory expansion board, having a supplementary memory module, to the dual in-line memory module carrier including attaching a bridge transposer; and providing a system interface connector coupled to the integrated memory buffer and the bridge transposer for controlling the memory module, the supplementary memory module, or a combination thereof.
Abstract translation: 一种制造增强容量存储器系统的方法包括：提供具有存储器模块和耦合到存储器模块的集成存储器缓冲器的双列直插存储器模块载体; 将具有辅助存储器模块的存储器扩展板耦合到双列直插式存储器模块载体，包括附接桥式变压器; 并且提供耦合到集成存储器缓冲器的系统接口连接器和用于控制存储器模块，辅助存储器模块或其组合的桥接转换器。
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2.发明授权公开(公告)号：US10529688B1
公开(公告)日：2020-01-07
申请号：US15462885
申请日：2017-03-19
Applicant: SMART Modular Technologies, Inc.
Inventor： Satyanarayan Shivkumar Iyer , Reuben J. Chang , Victor Mahran
IPC: H01L25/065 , H01L23/00 , H01L25/00
Abstract: A system and method of manufacture of an integrated circuit device system includes mounting a first elevated device on a first riser positioned adjacent to a base device. The first elevated device includes a first device overhang that extends over the base device. A second elevated device can be mounted on a second riser adjacent to the first riser to allow the attachment of a second elevated device mounted above the first elevated device to achieve higher component densities.
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3.发明授权公开(公告)号：US09939855B2
公开(公告)日：2018-04-10
申请号：US14942787
申请日：2015-11-16
Applicant: SMART Modular Technologies, Inc.
Inventor： Victor Mahran , Robert S. Pauley, Jr.
CPC classification number: G06F1/185 , G06F1/20 , G11C5/025 , H05K1/0209 , H05K1/144 , H05K1/145 , H05K7/1431 , H05K2201/042 , H05K2201/10159 , H05K2201/10303 , H05K2201/10378 , H05K2201/10409 , Y10T29/4913
Abstract: A method of manufacture of an enhanced capacity memory system includes: providing a dual in-line memory module carrier having a memory module and an integrated memory buffer coupled to the memory module; coupling a memory expansion board, having a supplementary memory module, to the dual in-line memory module carrier including attaching a bridge transposer; and providing a system interface connector coupled to the integrated memory buffer and the bridge transposer for controlling the memory module, the supplementary memory module, or a combination thereof.
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Patent Agency Ranking
4.发明申请EXTENDED CAPACITY MEMORY SYSTEM WITH LOAD RELIEVED MEMORY AND METHOD OF MANUFACTURE THEREOF 有权具有负载恢复存储器的扩展容量存储器系统及其制造方法公开(公告)号：US20130083473A1
公开(公告)日：2013-04-04
申请号：US13633074
申请日：2012-10-01
Applicant: SMART MODULAR TECHNOLOGIES, INC.
Inventor： Victor Mahran , Robert S. Pauley, JR.
CPC classification number: G06F1/185 , G06F1/20 , G11C5/025 , H05K1/0209 , H05K1/144 , H05K1/145 , H05K7/1431 , H05K2201/042 , H05K2201/10159 , H05K2201/10303 , H05K2201/10378 , H05K2201/10409 , Y10T29/4913
Abstract: A method of manufacture of an enhanced capacity memory system includes: providing a dual in-line memory module carrier having a memory module and an integrated memory buffer coupled to the memory module; coupling a memory expansion board, having a supplementary memory module, to the dual in-line memory module carrier including attaching a bridge transposer; and providing a system interface connector coupled to the integrated memory buffer and the bridge transposer for controlling the memory module, the supplementary memory module, or a combination thereof
Abstract translation: 一种制造增强容量存储器系统的方法包括：提供具有存储器模块和耦合到存储器模块的集成存储器缓冲器的双列直插存储器模块载体; 将具有辅助存储器模块的存储器扩展板耦合到双列直插式存储器模块载体，包括附接桥式变压器; 并且提供耦合到集成存储器缓冲器的系统接口连接器和用于控制存储器模块，辅助存储器模块或其组合的桥接转换器
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公开(公告)号：US09648754B1
公开(公告)日：2017-05-09
申请号：US14231622
申请日：2014-03-31
Applicant: SMART Modular Technologies, Inc.
Inventor： Satyanarayan Shivkumar Iyer , Robert S. Pauley, Jr. , Victor Mahran
CPC classification number: H05K1/181 , H05K3/301 , H05K3/303 , H05K3/3436 , H05K2201/10159 , Y02P70/611
Abstract: A system and method of manufacture of an integrated circuit device system includes: a module interposer having a module first side and a module second side; an outer chip assembly mounted to the module first side; a mirrored chip assembly mounted to the module second side, the mirrored chip assembly below the outer chip assembly; and a carrier attached to the module second side, the carrier includes a carrier first side and a carrier second side, the mirrored chip assembly suspended above the carrier first side.
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6.发明授权公开(公告)号：US09603252B1
公开(公告)日：2017-03-21
申请号：US14077908
申请日：2013-11-12
Applicant: SMART Modular Technologies, Inc.
Inventor： Satyanarayan Shivkumar Iyer , Reuben J. Chang , Victor Mahran
CPC classification number: H05K1/181 , H05K3/301 , H05K3/303 , H05K3/3436 , H05K2201/10159 , Y02P70/611
Abstract: A system and method of manufacture of an integrated circuit device system includes: a carrier having a first side; a base device mounted on the first side; a first riser mounted on the first side; a second riser mounted on the first side and adjacent to the first riser; a peripheral elevated device mounted on the first riser, the peripheral elevated device having a device overhang above the base device; and an inner elevated device mounted on the second riser, the inner elevated device having the device overhang above the base device.
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7.发明授权公开(公告)号：US09576615B1
公开(公告)日：2017-02-21
申请号：US14884369
申请日：2015-10-15
Applicant: SMART Modular Technologies, Inc.
Inventor： Victor Mahran , Kevin James Gabrielli , Reuben Jun Fong Chang
Abstract: A memory module with power management system, and a method of operation of a memory module with power management system thereof, including: a base power plane; a power management circuit electrically connected to the base power plane; a managed power plane electrically connected to the base power plane only through the power management circuit; and a memory array electrically connected to the managed power plane.
Abstract translation: 一种具有电源管理系统的存储器模块，以及具有电源管理系统的存储器模块的操作方法，包括：基本电源平面; 电连接到所述基本电源平面的电源管理电路; 管理电力平面，仅通过电力管理电路与基电源平面电连接; 以及电连接到被管理电力平面的存储器阵列。
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8.发明申请EXTENDED CAPACITY MEMORY SYSTEM WITH LOAD RELIEVED MEMORY AND METHOD OF MANUFACTURE THEREOF 有权具有负载恢复存储器的扩展容量存储器系统及其制造方法公开(公告)号：US20160070316A1
公开(公告)日：2016-03-10
申请号：US14942787
申请日：2015-11-16
Applicant: SMART Modular Technologies, Inc.
Inventor： Victor Mahran , Robert S. Pauley, JR.
CPC classification number: G06F1/185 , G06F1/20 , G11C5/025 , H05K1/0209 , H05K1/144 , H05K1/145 , H05K7/1431 , H05K2201/042 , H05K2201/10159 , H05K2201/10303 , H05K2201/10378 , H05K2201/10409 , Y10T29/4913
Abstract: A method of manufacture of an enhanced capacity memory system includes: providing a dual in-line memory module carrier having a memory module and an integrated memory buffer coupled to the memory module; coupling a memory expansion board, having a supplementary memory module, to the dual in-line memory module carrier including attaching a bridge transposer; and providing a system interface connector coupled to the integrated memory buffer and the bridge transposer for controlling the memory module, the supplementary memory module, or a combination thereof.
Abstract translation: 一种制造增强容量存储器系统的方法包括：提供具有存储器模块和耦合到存储器模块的集成存储器缓冲器的双列直插存储器模块载体; 将具有辅助存储器模块的存储器扩展板耦合到双列直插式存储器模块载体，包括附接桥式变压器; 并且提供耦合到集成存储器缓冲器的系统接口连接器和用于控制存储器模块，辅助存储器模块或其组合的桥接转换器。
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