公开(公告)号：US20180145004A1

公开(公告)日：2018-05-24

申请号：US15574230

申请日：2016-05-11

Applicant: SONY CORPORATION

Inventor： Kousuke SEKI ,  Yusaku KATO ,  Shun MITARAI ,  Shinji ROKUHARA

IPC: H01L23/15 ,  H01L23/32 ,  H01L23/36 ,  H05K1/11 ,  H05K1/05 ,  H05K3/44 ,  H05K3/42

CPC classification number: H01L23/15 ,  H01L21/486 ,  H01L23/32 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/5384 ,  H01L23/5389 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16225 ,  H05K1/056 ,  H05K1/09 ,  H05K1/095 ,  H05K1/11 ,  H05K1/115 ,  H05K3/4061 ,  H05K3/426 ,  H05K3/445 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/0959

Abstract: The present disclosure relates to a wiring board and a manufacturing method that simultaneously solve problems of stress and heat release A wiring board as one aspect of the present disclosure includes a glass substrate as a core member, and a plurality of through holes arranged in a cyclic manner in the glass substrate. The through holes are filled with different kinds of filling materials. A wiring board manufacturing method as one aspect of the present disclosure includes: a through hole formation step of forming through holes arranged in a cyclic manner in a glass substrate serving as a core member; and a filling step of forming a protecting sheet on the glass substrate, and filling through holes with a filling material through openings formed in the protecting sheet. The present disclosure can be applied to a wiring board that has a through-electrode-equipped glass substrate as the core member.