公开(公告)号：US20160254622A1

公开(公告)日：2016-09-01

申请号：US15151772

申请日：2016-05-11

Applicant: SONY CORPORATION

Inventor： Akira AKIBA ,  Mitsuo HASHIMOTO ,  Shinya MORITA ,  Shun MITARAI ,  Mikihiro TAKETOMO ,  Kazunao ONIKI ,  Koichi IKEDA

IPC: H01R13/66 ,  H01P3/08 ,  H01R24/64

CPC classification number: H01R13/6691 ,  H01P3/08 ,  H01P3/085 ,  H01P3/121 ,  H01R13/6599 ,  H01R24/64 ,  H01R2107/00 ,  H05K1/0219 ,  H05K2201/0715 ,  H05K2201/09336 ,  H05K2201/09618

Abstract: A signal transmission cable has a cable including a dielectric layer and a metallic layer. The signal transmission cable further includes a connector having a chip with a terminal. The connector includes a substrate having an organic layer, and a portion of the organic layer extends from the substrate so as to form the dielectric layer of the cable. The metallic layer is located on the dielectric layer and is directly connected to the terminal.

Abstract translation: 信号传输电缆具有包括电介质层和金属层的电缆。 信号传输电缆还包括具有带终端的芯片的连接器。 连接器包括具有有机层的衬底，并且有机层的一部分从衬底延伸以形成电缆的电介质层。 金属层位于电介质层上，直接连接到端子。

公开(公告)号：US20180211989A1

公开(公告)日：2018-07-26

申请号：US15745176

申请日：2016-07-08

Applicant: SONY CORPORATION

Inventor： Susumu HOGYOKU ,  Shun MITARAI ,  Shusaku YANAGAWA

IPC: H01L27/146 ,  H04N5/335 ,  H04N5/225

Abstract: The present technology relates to a semiconductor device providing an image sensor package capable of coping with an increase in the number of I/Os of an image sensor, a manufacturing method thereof, and an electronic apparatus. The semiconductor device includes an image sensor, a glass substrate, a wiring layer, and external terminals. In the image sensor, photoelectric conversion elements are formed on a semiconductor substrate. The glass substrate is arranged on a first main surface side of the image sensor. The wiring layer is formed on a second main surface side opposite to the first main surface. Each of the external terminals outputs a signal of the image sensor. Metal wiring of the wiring layer extends to an outer peripheral portion of the image sensor and is connected to the external terminals. The present technology can be applied to, for example, an image sensor package and the like.

公开(公告)号：US20180158695A1

公开(公告)日：2018-06-07

申请号：US15568541

申请日：2016-04-25

Applicant: SONY CORPORATION

Inventor： Shun MITARAI ,  Shusaku YANAGAWA ,  Hiroshi OZAKI

IPC: H01L21/48 ,  H01L21/683 ,  H01L23/498

CPC classification number: H01L21/486 ,  H01L21/2885 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L24/16 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68386 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0306 ,  H05K3/423 ,  H05K3/4605 ,  H05K2201/09563 ,  H05K2203/0733 ,  H01L2924/00

Abstract: There is provided a method for manufacturing a wiring substrate with a through electrode, the method including providing a device substrate having a through hole, an opening of the through hole being blocked by a current supply path and the wiring substrate including the device substrate as a core layer with the through electrode; and disposing a first metal in the through hole to form the through electrode by electroplating, in a depth direction of the through hole, using the current supply path.

公开(公告)号：US20180145004A1

公开(公告)日：2018-05-24

申请号：US15574230

申请日：2016-05-11

Applicant: SONY CORPORATION

Inventor： Kousuke SEKI ,  Yusaku KATO ,  Shun MITARAI ,  Shinji ROKUHARA

IPC: H01L23/15 ,  H01L23/32 ,  H01L23/36 ,  H05K1/11 ,  H05K1/05 ,  H05K3/44 ,  H05K3/42

CPC classification number: H01L23/15 ,  H01L21/486 ,  H01L23/32 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/5384 ,  H01L23/5389 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16225 ,  H05K1/056 ,  H05K1/09 ,  H05K1/095 ,  H05K1/11 ,  H05K1/115 ,  H05K3/4061 ,  H05K3/426 ,  H05K3/445 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/0959

Abstract: The present disclosure relates to a wiring board and a manufacturing method that simultaneously solve problems of stress and heat release A wiring board as one aspect of the present disclosure includes a glass substrate as a core member, and a plurality of through holes arranged in a cyclic manner in the glass substrate. The through holes are filled with different kinds of filling materials. A wiring board manufacturing method as one aspect of the present disclosure includes: a through hole formation step of forming through holes arranged in a cyclic manner in a glass substrate serving as a core member; and a filling step of forming a protecting sheet on the glass substrate, and filling through holes with a filling material through openings formed in the protecting sheet. The present disclosure can be applied to a wiring board that has a through-electrode-equipped glass substrate as the core member.