公开(公告)号：US20250079372A1

公开(公告)日：2025-03-06

申请号：US18459196

申请日：2023-08-31

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： KyuWon Lee ,  JiWon Jang ,  Myeongjin Kim ,  HyeSun Kim ,  YoungDeuk Lee ,  YoungJin Woo

IPC: H01L23/00

Abstract: A semiconductor device has a semiconductor wafer or substrate including a plurality of semiconductor die. A plurality of first bumps is formed over an active surface of the semiconductor wafer. A plurality of second bumps is formed within a saw street of the semiconductor wafer separating the plurality of semiconductor die. A top surface of the first bumps is coplanar with a top surface of the second bumps. The second bumps are formed within a first saw street of the semiconductor wafer and further within a second saw street of the semiconductor wafer different from the first saw street. The first bumps are electrically connected to the semiconductor die to provide a function for the semiconductor die. The second bumps are dummy bumps that have no electrical function for the semiconductor die. The semiconductor wafer is singulated through the saw street and second bumps.

公开(公告)号：US20230230893A1

公开(公告)日：2023-07-20

申请号：US17648146

申请日：2022-01-17

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： SooJung Park ,  KyuWon Lee ,  HyunKyum Kim ,  JiWon Jang ,  JeeHyun Hong

IPC: H01L23/367 ,  H01L21/50

CPC classification number: H01L23/367 ,  H01L21/50

Abstract: A semiconductor device has an electrical component and heat sink disposed over the electrical component. A portion of the heat sink extends at least partially down a side surface of the electrical component to prevent lateral movement of the heat sink with respect to the semiconductor die. Alternatively, a portion of the heat sink extends at least partially below a surface of the electrical component. The heat sink can have an angled side, extension, or indentation to stabilize the heat sink on the electrical component to prevent rotation or otherwise shifting position that would impart movement in the lateral direction and possibly contact adjacent components or create defects on the PCB. The portion of the heat sink extending at least partially down does so on at least two side surfaces of the electrical component. The electrical component can be a flipchip semiconductor die.