公开(公告)号：US20230307335A1

公开(公告)日：2023-09-28

申请号：US18321391

申请日：2023-05-22

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Hermes T. Apale ,  KyuWon Lee ,  Mark Sackett

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/552 ,  H01L21/48 ,  H01L23/367

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L23/367 ,  H01L23/49822 ,  H01L23/552 ,  H01L24/16 ,  H01L2224/16227

Abstract: A semiconductor device has a substrate and plurality of first bumps formed over the substrate in an array. An array of second bumps is formed over the substrate on at least two sides of the first bumps. An electrical component is disposed over the first bumps. A package structure is disposed over the substrate and electrical component. The package structure has a horizontal member and legs extending from the horizontal member to form a cavity. The package structure is coupled to the array of second bumps. The package structure includes a material to operate as a heat sink or shielding layer. The shielding layer makes ground connection through the array of second bumps. The first bumps and second bumps have a similar height and width to form in the same manufacturing step. A protective layer, such as conductive epoxy, is disposed over the array of second bumps.

公开(公告)号：US20250079372A1

公开(公告)日：2025-03-06

申请号：US18459196

申请日：2023-08-31

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： KyuWon Lee ,  JiWon Jang ,  Myeongjin Kim ,  HyeSun Kim ,  YoungDeuk Lee ,  YoungJin Woo

IPC: H01L23/00

Abstract: A semiconductor device has a semiconductor wafer or substrate including a plurality of semiconductor die. A plurality of first bumps is formed over an active surface of the semiconductor wafer. A plurality of second bumps is formed within a saw street of the semiconductor wafer separating the plurality of semiconductor die. A top surface of the first bumps is coplanar with a top surface of the second bumps. The second bumps are formed within a first saw street of the semiconductor wafer and further within a second saw street of the semiconductor wafer different from the first saw street. The first bumps are electrically connected to the semiconductor die to provide a function for the semiconductor die. The second bumps are dummy bumps that have no electrical function for the semiconductor die. The semiconductor wafer is singulated through the saw street and second bumps.

公开(公告)号：US12211778B2

公开(公告)日：2025-01-28

申请号：US18321391

申请日：2023-05-22

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Hermes T. Apale ,  KyuWon Lee ,  Mark Sackett

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/367 ,  H01L23/552

Abstract: A semiconductor device has a substrate and plurality of first bumps formed over the substrate in an array. An array of second bumps is formed over the substrate on at least two sides of the first bumps. An electrical component is disposed over the first bumps. A package structure is disposed over the substrate and electrical component. The package structure has a horizontal member and legs extending from the horizontal member to form a cavity. The package structure is coupled to the array of second bumps. The package structure includes a material to operate as a heat sink or shielding layer. The shielding layer makes ground connection through the array of second bumps. The first bumps and second bumps have a similar height and width to form in the same manufacturing step. A protective layer, such as conductive epoxy, is disposed over the array of second bumps.

公开(公告)号：US11764136B2

公开(公告)日：2023-09-19

申请号：US17445469

申请日：2021-08-19

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Hermes T. Apale ,  KyuWon Lee ,  Mark Sackett

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/552 ,  H01L21/48 ,  H01L23/367

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L23/367 ,  H01L23/49822 ,  H01L23/552 ,  H01L24/16 ,  H01L2224/16227

Abstract: A semiconductor device has a substrate and plurality of first bumps formed over the substrate in an array. An array of second bumps is formed over the substrate on at least two sides of the first bumps. An electrical component is disposed over the first bumps. A package structure is disposed over the substrate and electrical component. The package structure has a horizontal member and legs extending from the horizontal member to form a cavity. The package structure is coupled to the array of second bumps. The package structure includes a material to operate as a heat sink or shielding layer. The shielding layer makes ground connection through the array of second bumps. The first bumps and second bumps have a similar height and width to form in the same manufacturing step. A protective layer, such as conductive epoxy, is disposed over the array of second bumps.

公开(公告)号：US20230230893A1

公开(公告)日：2023-07-20

申请号：US17648146

申请日：2022-01-17

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： SooJung Park ,  KyuWon Lee ,  HyunKyum Kim ,  JiWon Jang ,  JeeHyun Hong

IPC: H01L23/367 ,  H01L21/50

CPC classification number: H01L23/367 ,  H01L21/50

Abstract: A semiconductor device has an electrical component and heat sink disposed over the electrical component. A portion of the heat sink extends at least partially down a side surface of the electrical component to prevent lateral movement of the heat sink with respect to the semiconductor die. Alternatively, a portion of the heat sink extends at least partially below a surface of the electrical component. The heat sink can have an angled side, extension, or indentation to stabilize the heat sink on the electrical component to prevent rotation or otherwise shifting position that would impart movement in the lateral direction and possibly contact adjacent components or create defects on the PCB. The portion of the heat sink extending at least partially down does so on at least two side surfaces of the electrical component. The electrical component can be a flipchip semiconductor die.

公开(公告)号：US20230059429A1

公开(公告)日：2023-02-23

申请号：US17445469

申请日：2021-08-19

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Hermes T. Apale ,  KyuWon Lee ,  Mark Sackett

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/367 ,  H01L23/552 ,  H01L21/48

Abstract: A semiconductor device has a substrate and plurality of first bumps formed over the substrate in an array. An array of second bumps is formed over the substrate on at least two sides of the first bumps. An electrical component is disposed over the first bumps. A package structure is disposed over the substrate and electrical component. The package structure has a horizontal member and legs extending from the horizontal member to form a cavity. The package structure is coupled to the array of second bumps. The package structure includes a material to operate as a heat sink or shielding layer. The shielding layer makes ground connection through the array of second bumps. The first bumps and second bumps have a similar height and width to form in the same manufacturing step. A protective layer, such as conductive epoxy, is disposed over the array of second bumps.