Abstract:
A cover member includes a base material having a film shape and containing an amorphous aromatic polyamide. Further, it is preferred that the aromatic polyamide contains a carboxyl group. Furthermore, it is preferred that the aromatic polyamide contains a rigid structure in an amount of 85 mol % or more. Moreover, it is preferred that a tensile elastic modulus of the base material is 4 GPa or more. This makes it possible to provide a cover member having a good flatness keeping property and excellent long-term durability, and an electronic device provided with such a cover member and having excellent reliability.
Abstract:
A silicone rubber-based hardening composition includes a linear organopolysiloxane having a vinyl group (A), an organohydrogen polysiloxane (B), and a silica filler (C) of which surface is treated with a silane coupling agent having a trimethylsilyl group. The linear organopolysiloxane having a vinyl group (A) includes a first linear organopolysiloxane having a vinyl group (A1), and a second linear organopolysiloxane having a vinyl group (A2).
Abstract:
The present disclosure, in one aspect, relates to a polyamide solution which can suppress the yellowness. The present disclosure, in one or a plurality of embodiments, relates to a polyamide solution comprising an aromatic polyamide and a solvent, the aromatic polyamide comprising a constitutional unit having one or more free carboxyl groups and having an aromatic ring structure and an alicyclic structure in the main chain. Further, the present disclosure, in one aspect, relates to a laminated composite material, comprising a glass plate and a polyamide resin layer; the polyamide resin layer laminated onto one surface of the glass plate, the polyamide resin layer having yellowness (JIS K7373) of 2.4 or less; and the polyamide resin layer obtained by applying the solution onto the glass plate.
Abstract:
A silicone rubber-based curable composition of the present invention contains: a vinyl group-containing organopolysiloxane (A); an organohydrogen polysiloxane (B); silica particles (C); a silane coupling agent (D); and a platinum or platinum compound (E), wherein satisfied is the following requirement X, or both the following requirements X and Y: Requirement X: the vinyl group-containing organopolysiloxane (A) contains both a vinyl group-containing linear organopolysiloxane (A1) and a vinyl group-containing branch organopolysiloxane (A2), Requirement Y: the organohydrogen polysiloxane (B) contains a mixture (B3) of a linear organohydrogen polysiloxane (B1) and a branch organohydrogen polysiloxane (B2), or the branch organohydrogen polysiloxane (B2). This makes it possible to provide a silicon rubber-based curable composition which can produce a silicone rubber having excellent tensile strength and tearing strength.
Abstract:
In one or a plurality of embodiments, a process for manufacturing polyamide without using PrO (propylene oxide) in synthesis is provided. In one or a plurality of embodiments, provided is a process for manufacturing polyamide, including steps (a) to (c): (a) reacting diacid dichloride monomer with at least two kinds of diamine monomers in a solvent so as to generate polyamide; and (b) removing hydrochloric acid physically out of a reaction system, the hydrochloric acid being generated during the reaction in the step (a); or (c) adding a trapping reagent capable of trapping hydrochloric acid, at any time at least before the step (a), at the same time of starting the step (a), or during the step (a), wherein at least one of the diamine monomers is a diamine monomer containing a carboxyl group, and the trapping reagent does not include propylene oxide.
Abstract:
Provided are a resin composition and a substrate that are capable of being used for manufacturing an electronic device including a transparent resin film having an excellent display property, a method of manufacturing such a resin composition and a method of manufacturing the electronic device using such a substrate and the electronic device. The resin composition of the present invention contains an aromatic polyamide, an aromatic multifunctional compound having two or more functional groups including a carboxyl group or an amino group, and a solvent dissolving the aromatic polyamide.
Abstract:
Provided are a resin composition and a substrate that are capable of being used for manufacturing an electronic device having excellent light extraction efficiency. The resin composition contains a polymer and a solvent dissolving the polymer. The resin composition is used to form a layer, and when refractive indexes of the layer along two perpendicular in-plane directions thereof are respectively defined as “Nx” and “Ny” and a refractive index of the layer along a thickness direction thereof is defined as “Nz”, Nx, Ny and Nz satisfy a relationship of “(Nx+Ny)/2−Nz”>0.01. Further, a method of manufacturing the electronic device by using such a substrate, and the electronic device are also provided.