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    Optical fingerprint sensor package
    1.
    发明授权
    Optical fingerprint sensor package 有权

    公开(公告)号：US10185866B2

    公开(公告)日：2019-01-22

    申请号：US15269901

    申请日：2016-09-19

    Applicant: Synaptics Incorporated

    Inventor： Jason Goodelle ,  Paul Wickboldt ,  Young Seen Lee ,  Chien Lam ,  Bob Lee Mackey

    IPC: G06K9/28 ,  G06K9/00

    Abstract: Disclosed are optical sensors, optical fingerprint sensor packages, and methods for forming same. An optical sensor comprises: a substrate; an image sensor disposed over the substrate; a light source disposed over the substrate; a light guide disposed over the image sensor; and, an encapsulant disposed over the light source, wherein the encapsulant is coupled to the light guide and comprises a surface positioned to reflect light emitted from the light source and direct the reflected light into the light guide.

    DEVICE WITH IMPROVED CIRCUIT POSITIONING
    2.
    发明申请
    DEVICE WITH IMPROVED CIRCUIT POSITIONING 审中-公开

    公开(公告)号：US20190065814A1

    公开(公告)日：2019-02-28

    申请号：US15995717

    申请日：2018-06-01

    Applicant: Synaptics Incorporated

    Inventor： Stephen Morein ,  Guozhong Shen ,  Jason Goodelle

    IPC: G06K9/00 ,  G06F3/041 ,  G06F3/042 ,  G06F3/044

    Abstract: Disclosed is a sensor device comprising: a two-dimensional array of sensor pixel circuits, wherein the two-dimensional array includes a first axis and second axis, and wherein the two-dimensional array includes more sensor pixel circuits along the second axis than along the first axis; a gate drive circuit disposed along on the first axis of the two-dimensional array configured to drive one or more sensor pixel circuits; and, a readout circuit disposed along on the first axis of the two-dimensional array configured to receive output information from the one or more sensor pixel circuits.

    IMAGE SENSOR STRUCTURES FOR FINGERPRINT SENSING
    3.
    发明申请
    IMAGE SENSOR STRUCTURES FOR FINGERPRINT SENSING 审中-公开
    图像传感器结构用于指纹感测

    公开(公告)号：US20160254312A1

    公开(公告)日：2016-09-01

    申请号：US15087481

    申请日：2016-03-31

    Applicant: Synaptics Incorporated

    Inventor： Young Seen Lee ,  Paul Wickboldt ,  Patrick Smith ,  Robert John Gove ,  Jason Goodelle

    IPC: H01L27/146 ,  G02B27/30 ,  G06K9/00

    CPC classification number: H01L27/14685 ,  G02B5/201 ,  G02B6/04 ,  G02B27/30 ,  G06K9/0004 ,  H01L27/14625 ,  H01L27/14632 ,  H01L27/14687

    Abstract: Methods and systems for integrating image sensor structures with collimator filters, including manufacturing methods and associated structures for forming collimator filters at the wafer level for integration with image sensor semiconductor wafers. Methods of making an optical biometric sensor include forming a collimator filter layer on an image sensor wafer, wherein a plurality of light collimating apertures in the collimator filter layer are aligned with a plurality of light sensing elements in the image sensor wafer, and after forming the collimator filter layer on the image sensor wafer, singulating the image sensor wafer into a plurality of individual optical sensors.

    Abstract translation: 用于将图像传感器结构与准直器滤波器集成的方法和系统，包括用于在晶片级形成准直器滤波器的制造方法和相关联的结构，用于与图像传感器半导体晶片集成。 制造光学生物传感器的方法包括在图像传感器晶片上形成准直器滤光层，其中准直器滤光层中的多个光准直孔与图像传感器晶片中的多个感光元件对准，并且在形成 图像传感器晶片上的准直器滤光层，将图像传感器晶片分离成多个单独的光学传感器。

    Image sensor structures for fingerprint sensing
    4.
    发明授权
    Image sensor structures for fingerprint sensing 有权

    公开(公告)号：US10147757B2

    公开(公告)日：2018-12-04

    申请号：US15087481

    申请日：2016-03-31

    Applicant: Synaptics Incorporated

    Inventor： Young Seen Lee ,  Paul Wickboldt ,  Patrick Smith ,  Robert John Gove ,  Jason Goodelle

    IPC: H01L27/146 ,  G02B27/30 ,  G06K9/00

    Abstract: Methods and systems for integrating image sensor structures with collimator filters, including manufacturing methods and associated structures for forming collimator filters at the wafer level for integration with image sensor semiconductor wafers. Methods of making an optical biometric sensor include forming a collimator filter layer on an image sensor wafer, wherein a plurality of light collimating apertures in the collimator filter layer are aligned with a plurality of light sensing elements in the image sensor wafer, and after forming the collimator filter layer on the image sensor wafer, singulating the image sensor wafer into a plurality of individual optical sensors.

    Optical sensor with substrate light filter
    5.
    发明授权
    Optical sensor with substrate light filter 有权

    公开(公告)号：US10055637B2

    公开(公告)日：2018-08-21

    申请号：US15372207

    申请日：2016-12-07

    Applicant: Synaptics Incorporated

    Inventor： James MacDonald ,  Jason Goodelle

    IPC: G06K9/00 ,  H01L27/32

    CPC classification number: G06K9/0008 ,  G06K9/00013

    Abstract: An optical biometric sensor is disclosed. The optical biometric sensor includes a filter layer having a top surface and a bottom surface. The filter layer includes a light filter including a blocking material forming an array of apertures; a substrate including an electrical interconnect comprising a set of electrical conductors. The biometric sensor further includes an optical sensor including an array of sensing elements mounted to the bottom surface of the substrate, wherein sensing elements in the array of sensing elements sensors are aligned with the array of apertures and electrically connected to the electrical interconnect.

    OPTICAL SENSOR WITH SUBSTRATE LIGHT FILTER
    6.
    发明申请
    OPTICAL SENSOR WITH SUBSTRATE LIGHT FILTER 审中-公开

    公开(公告)号：US20180157889A1

    公开(公告)日：2018-06-07

    申请号：US15372207

    申请日：2016-12-07

    Applicant: Synaptics Incorporated

    Inventor： James MacDonald ,  Jason Goodelle

    IPC: G06K9/00 ,  H01L27/32

    CPC classification number: G06K9/0008 ,  G06K9/00013 ,  H01L27/3227

    Abstract: An optical biometric sensor is disclosed. The optical biometric sensor includes a filter layer having a top surface and a bottom surface. The filter layer includes a light filter including a blocking material forming an array of apertures; a substrate including an electrical interconnect comprising a set of electrical conductors. The biometric sensor further includes an optical sensor including an array of sensing elements mounted to the bottom surface of the substrate, wherein sensing elements in the array of sensing elements sensors are aligned with the array of apertures and electrically connected to the electrical interconnect.

    Interposer for a display driver integrated circuit chip
    7.
    发明授权
    Interposer for a display driver integrated circuit chip 有权

    公开(公告)号：US10921855B1

    公开(公告)日：2021-02-16

    申请号：US16554826

    申请日：2019-08-29

    Applicant: SYNAPTICS INCORPORATED

    Inventor： Shengmin Wen ,  Qing Xiao ,  Jason Goodelle ,  Joseph Kurth Reynolds

    IPC: G06F1/16 ,  G09G3/3275 ,  G09G3/36 ,  H01L25/16 ,  G02F1/1333

    Abstract: A semiconductor assembly for a display device comprises a display driver integrated circuit (DDIC) chip and an interposer coupled to the DDIC chip. The DDIC chip comprises a plurality of output pads and a plurality of input pads. Further, the DDIC chip is configured to drive a plurality of data lines of the display device to update an active region of the display device. The interposer comprises a plurality of output pads coupled to the plurality of output pads of the DDIC chip and is configured to be coupled to the plurality of data lines of the display device. The interposer further comprises a plurality of input pads coupled to the plurality of input pads of the DDIC chip pads. Further, a width of the interposer is at least as large as a distance between outermost data lines of the plurality of data lines.

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