Interposer for a display driver integrated circuit chip

    公开(公告)号:US10921855B1

    公开(公告)日:2021-02-16

    申请号:US16554826

    申请日:2019-08-29

    Abstract: A semiconductor assembly for a display device comprises a display driver integrated circuit (DDIC) chip and an interposer coupled to the DDIC chip. The DDIC chip comprises a plurality of output pads and a plurality of input pads. Further, the DDIC chip is configured to drive a plurality of data lines of the display device to update an active region of the display device. The interposer comprises a plurality of output pads coupled to the plurality of output pads of the DDIC chip and is configured to be coupled to the plurality of data lines of the display device. The interposer further comprises a plurality of input pads coupled to the plurality of input pads of the DDIC chip pads. Further, a width of the interposer is at least as large as a distance between outermost data lines of the plurality of data lines.

    Multi-functional ambient light sensor packaging

    公开(公告)号:US12161026B2

    公开(公告)日:2024-12-03

    申请号:US18531170

    申请日:2023-12-06

    Abstract: A touchscreen display device includes: a display; a flexible printed circuit; touch sensing electrodes connected to the flexible printed circuit; and a multi-functional ambient light sensor package mounted on the flexible printed circuit. The multi-functional ambient light sensor package includes: an ambient light sensor; transmitter and receiver circuitry connected to the touch sensing electrodes via the flexible printed circuit; and a controller configured to obtain capacitance information from the touch sensing electrodes and ambient light information from the ambient light sensor via a single chip. The multi-functional ambient light sensor package may be packaged as a wafer-level chip-scale package (WLCSP).

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