公开(公告)号：US10055631B1

公开(公告)日：2018-08-21

申请号：US15343168

申请日：2016-11-03

Applicant: Synaptics Incorporated

Inventor： Shengmin Wen ,  Brett Dunlap ,  Jay Kim

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  G06K9/00 ,  H01L23/538 ,  H01L23/00 ,  H01L23/498

CPC classification number: G06K9/0002 ,  G06K9/00053 ,  H01L23/49816 ,  H01L23/5383 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/2402 ,  H01L2224/2413 ,  H01L2224/24247 ,  H01L2224/24265

Abstract: A sensor package and a method of forming a sensor package are disclosed. The sensor package comprises: a multilayer substrate comprising a mold compound layer and a plurality of patterned metal layers; an embedded die embedded in the multilayer substrate, wherein the mold compound layer of the multilayer substrate surrounds the embedded die; and, a sensing element disposed over the multilayer substrate, the sensing element comprising a first patterned metal layer electrically connected to the embedded die through the multilayer substrate.

公开(公告)号：US20170177113A1

公开(公告)日：2017-06-22

申请号：US15282494

申请日：2016-09-30

Applicant: Synaptics Incorporated

Inventor： Guozhong Shen ,  Ozan Ersan Erdogan ,  Shengmin Wen ,  Brett Dunlap

IPC: G06F3/044 ,  G06F3/041

CPC classification number: G06F3/044 ,  G06F2203/04107

Abstract: An input device for capacitive sensing includes: a plurality of sensor electrodes, the plurality of sensor electrodes comprising a plurality of transmitter electrodes and a plurality of receiver electrodes, wherein the plurality of transmitter electrodes is configured to be driven by sensing signals and the plurality of receiver electrodes is configured to receive detected signals corresponding to respective sensing signals driven onto the plurality of transmitter electrodes; a plurality of transmitter electrode vias, wherein each transmitter electrode via corresponds to a respective transmitter electrode of the plurality of transmitter electrodes; and conductive shielding, configured to mitigate effects of the plurality of transmitter electrode vias on the detected signals received on one or more receiver electrodes of the plurality of receiver electrodes, wherein the conductive shielding comprises: a first portion disposed above the plurality of transmitter electrode vias; and a second portion disposed outside the plurality of transmitter electrode vias.

公开(公告)号：US20170061187A1

公开(公告)日：2017-03-02

申请号：US14975477

申请日：2015-12-18

Applicant: Synaptics Incorporated

Inventor： Shengmin Wen

IPC: G06K9/00

CPC classification number: G06K9/0002

Abstract: A capacitive sensor a method of making a capacitive sensor are disclosed. The capacitive sensor includes: a plurality of rows of sensor electrodes included in a first layer; a plurality of columns of sensor electrodes included in a second layer, where the plurality of columns of sensor electrodes are arranged orthogonally to the plurality of rows of sensor electrodes to form a two-dimensional sensing array; and, a plurality of conductive elements included in a third layer disposed between the first and second layers, wherein, for each conductive element of the plurality of conductive elements, a first end of the conductive element is electrically connected to a sensor electrode in the plurality of rows of sensor electrodes and a second end of the conductive element is capacitively coupled to a sensor electrode in the plurality of columns of sensor electrodes to form a trans-capacitive sensing pixel of the two-dimensional sensing array.

Abstract translation: 公开了电容式传感器制造电容式传感器的方法。 电容传感器包括：包括在第一层中的多行传感器电极; 包括在第二层中的多列传感器电极，其中所述多列传感器电极与所述多行传感器电极正交配置以形成二维感测阵列; 以及设置在所述第一和第二层之间的第三层中包括的多个导电元件，其中，对于所述多个导电元件中的每个导电元件，所述导电元件的第一端电连接到所述多个导电元件中的传感器电极 的传感器电极的行和导电元件的第二端电容耦合到多列传感器电极中的传感器电极，以形成二维感测阵列的跨电容感测像素。

公开(公告)号：US11625945B2

公开(公告)日：2023-04-11

申请号：US16909789

申请日：2020-06-23

Applicant: Synaptics Incorporated

Inventor： Yeh-Cheng Tan ,  Shengmin Wen

IPC: G06V40/13 ,  H01L51/52

Abstract: A sensor assembly includes a cover layer and a first sensor apparatus. The cover layer is molded from a first material to have a planar surface and non-uniform thickness, where a thickness of the first material at a first region of the cover layer is less than a thickness of the first material surrounding the first region. The first sensor apparatus is disposed beneath the planar surface of the cover layer, within the first region. The first sensor apparatus is configured to transmit and receive first capacitive sensing signals through a portion of the planar surface coinciding with the first region. For example, the first sensor apparatus may be a fingerprint sensor configured to detect a fingerprint on the portion of the planar surface coinciding with the first region based on changes in the first capacitive sensing signals.

公开(公告)号：US12026971B2

公开(公告)日：2024-07-02

申请号：US18178829

申请日：2023-03-06

Applicant: Synaptics Incorporated

Inventor： Yeh-Cheng Tan ,  Shengmin Wen

IPC: G06V40/13 ,  H10K50/842 ,  H10K50/844

CPC classification number: G06V40/1329 ,  G06V40/1306 ,  H10K50/8426 ,  H10K50/8445

Abstract: A sensor assembly includes a cover layer and a first sensor apparatus. The cover layer is molded from a first material to have a planar surface and non-uniform thickness, where a thickness of the first material at a first region of the cover layer is less than a thickness of the first material surrounding the first region. The first sensor apparatus is disposed beneath the planar surface of the cover layer, within the first region. The first sensor apparatus is configured to transmit and receive first capacitive sensing signals through a portion of the planar surface coinciding with the first region. For example, the first sensor apparatus may be a fingerprint sensor configured to detect a fingerprint on the portion of the planar surface coinciding with the first region based on changes in the first capacitive sensing signals.

公开(公告)号：US10921855B1

公开(公告)日：2021-02-16

申请号：US16554826

申请日：2019-08-29

Applicant: SYNAPTICS INCORPORATED

Inventor： Shengmin Wen ,  Qing Xiao ,  Jason Goodelle ,  Joseph Kurth Reynolds

IPC: G06F1/16 ,  G09G3/3275 ,  G09G3/36 ,  H01L25/16 ,  G02F1/1333

Abstract: A semiconductor assembly for a display device comprises a display driver integrated circuit (DDIC) chip and an interposer coupled to the DDIC chip. The DDIC chip comprises a plurality of output pads and a plurality of input pads. Further, the DDIC chip is configured to drive a plurality of data lines of the display device to update an active region of the display device. The interposer comprises a plurality of output pads coupled to the plurality of output pads of the DDIC chip and is configured to be coupled to the plurality of data lines of the display device. The interposer further comprises a plurality of input pads coupled to the plurality of input pads of the DDIC chip pads. Further, a width of the interposer is at least as large as a distance between outermost data lines of the plurality of data lines.

公开(公告)号：US10338754B2

公开(公告)日：2019-07-02

申请号：US15282494

申请日：2016-09-30

Applicant: Synaptics Incorporated

Inventor： Guozhong Shen ,  Ozan Ersan Erdogan ,  Shengmin Wen ,  Brett Dunlap

IPC: G06F3/044

Abstract: An input device for capacitive sensing includes: a plurality of sensor electrodes, the plurality of sensor electrodes comprising a plurality of transmitter electrodes and a plurality of receiver electrodes, wherein the plurality of transmitter electrodes is configured to be driven by sensing signals and the plurality of receiver electrodes is configured to receive detected signals corresponding to respective sensing signals driven onto the plurality of transmitter electrodes; a plurality of transmitter electrode vias, wherein each transmitter electrode via corresponds to a respective transmitter electrode of the plurality of transmitter electrodes; and conductive shielding, configured to mitigate effects of the plurality of transmitter electrode vias on the detected signals received on one or more receiver electrodes of the plurality of receiver electrodes, wherein the conductive shielding comprises: a first portion disposed above the plurality of transmitter electrode vias; and a second portion disposed outside the plurality of transmitter electrode vias.

公开(公告)号：US09785821B2

公开(公告)日：2017-10-10

申请号：US14975477

申请日：2015-12-18

Applicant: Synaptics Incorporated

Inventor： Shengmin Wen

IPC: G06K9/00

CPC classification number: G06K9/0002

Abstract: A capacitive sensor a method of making a capacitive sensor are disclosed. The capacitive sensor includes: a plurality of rows of sensor electrodes included in a first layer; a plurality of columns of sensor electrodes included in a second layer, where the plurality of columns of sensor electrodes are arranged orthogonally to the plurality of rows of sensor electrodes to form a two-dimensional sensing array; and, a plurality of conductive elements included in a third layer disposed between the first and second layers, wherein, for each conductive element of the plurality of conductive elements, a first end of the conductive element is electrically connected to a sensor electrode in the plurality of rows of sensor electrodes and a second end of the conductive element is capacitively coupled to a sensor electrode in the plurality of columns of sensor electrodes to form a trans-capacitive sensing pixel of the two-dimensional sensing array.