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公开(公告)号：US10991668B1
公开(公告)日：2021-04-27
申请号：US16720876
申请日：2019-12-19
Applicant: SYNAPTICS INCORPORATED
Inventor： Tsuyoshi Koga , Shinya Suzuki , Naoki Hasegawa , Naoyuki Narita , Kiyotaka Miwa , Kazuhiko Sato , Yuichi Nakagomi
Abstract: A semiconductor device comprises a semiconductor substrate, a connection pad, and a bump. The connection pad is connected to the bump and disposed between the semiconductor substrate and the bump. The connection pad has one or more slits.
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