公开(公告)号：US10991668B1

公开(公告)日：2021-04-27

申请号：US16720876

申请日：2019-12-19

Applicant: SYNAPTICS INCORPORATED

Inventor： Tsuyoshi Koga ,  Shinya Suzuki ,  Naoki Hasegawa ,  Naoyuki Narita ,  Kiyotaka Miwa ,  Kazuhiko Sato ,  Yuichi Nakagomi

IPC: H01L23/00 ,  H01L23/31

Abstract: A semiconductor device comprises a semiconductor substrate, a connection pad, and a bump. The connection pad is connected to the bump and disposed between the semiconductor substrate and the bump. The connection pad has one or more slits.

公开(公告)号：US11259406B2

公开(公告)日：2022-02-22

申请号：US16689805

申请日：2019-11-20

Applicant: SYNAPTICS INCORPORATED

Inventor： Shinya Suzuki ,  Naoyuki Narita ,  Tsuyoshi Koga ,  Yuichi Nakagomi

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K3/36 ,  H01L23/498 ,  G06F3/044 ,  G06F3/041

Abstract: A flexible connector comprises a first plurality of pads disposed within an integrated circuit (IC) area, a second plurality of pads disposed in the IC area, and a plurality of through holes disposed in the IC area. The flexible connector further comprises first wiring coupled to the plurality of through holes and the first plurality of pads, and a rigidity element at least partially disposed between the plurality of through holes and the second plurality of pads.