公开(公告)号：US11259406B2

公开(公告)日：2022-02-22

申请号：US16689805

申请日：2019-11-20

Applicant: SYNAPTICS INCORPORATED

Inventor： Shinya Suzuki ,  Naoyuki Narita ,  Tsuyoshi Koga ,  Yuichi Nakagomi

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K3/36 ,  H01L23/498 ,  G06F3/044 ,  G06F3/041

Abstract: A flexible connector comprises a first plurality of pads disposed within an integrated circuit (IC) area, a second plurality of pads disposed in the IC area, and a plurality of through holes disposed in the IC area. The flexible connector further comprises first wiring coupled to the plurality of through holes and the first plurality of pads, and a rigidity element at least partially disposed between the plurality of through holes and the second plurality of pads.

公开(公告)号：US11171111B2

公开(公告)日：2021-11-09

申请号：US16753758

申请日：2018-10-02

Applicant: Synaptics Incorporated

Inventor： Kazuhiro Okamura ,  Takeshi Okubo ,  Yuichi Nakagomi ,  Takefumi Seno

IPC: H01L23/00

Abstract: An integrated circuit device comprises: a resin film that is flexible; a plurality of traces bonded on a surface of the resin film and arrayed in a specific direction; an IC chip bonded on the surface of the resin film, located offset to the traces in a direction perpendicular to the specific direction, and connected to the traces; and a protection pattern formed on the surface of the resin film, located in the specific direction with respect to a disposition region in which the IC chip and/or the traces are disposed, and formed of the same material as that of the traces.

公开(公告)号：US10991668B1

公开(公告)日：2021-04-27

申请号：US16720876

申请日：2019-12-19

Applicant: SYNAPTICS INCORPORATED

Inventor： Tsuyoshi Koga ,  Shinya Suzuki ,  Naoki Hasegawa ,  Naoyuki Narita ,  Kiyotaka Miwa ,  Kazuhiko Sato ,  Yuichi Nakagomi

IPC: H01L23/00 ,  H01L23/31

Abstract: A semiconductor device comprises a semiconductor substrate, a connection pad, and a bump. The connection pad is connected to the bump and disposed between the semiconductor substrate and the bump. The connection pad has one or more slits.

公开(公告)号：US20200279828A1

公开(公告)日：2020-09-03

申请号：US16753758

申请日：2018-10-02

Applicant: Synaptics Incorporated

Inventor： Kazuhiro Okamura ,  Takeshi Okubo ,  Yuichi Nakagomi ,  Takefumi Senou

IPC: H01L23/00

Abstract: An integrated circuit device comprises: a resin film that is flexible; a plurality of traces bonded on a surface of the resin film and arrayed in a specific direction; an IC chip bonded on the surface of the resin film, located offset to the traces in a direction perpendicular to the specific direction, and connected to the traces; and a protection pattern formed on the surface of the resin film, located in the specific direction with respect to a disposition region in which the IC chip and/or the traces are disposed, and formed of the same material as that of the traces.

公开(公告)号：US11177229B2

公开(公告)日：2021-11-16

申请号：US16838047

申请日：2020-04-02

Applicant: SYNAPTICS INCORPORATED

Inventor： Naoki Hasegawa ,  Shinya Suzuki ,  Hiromasa Hiura ,  Yuichi Nakagomi

IPC: H01L23/00

Abstract: An integrated circuit (IC) chip comprises a plurality of pads and a plurality of bumps. The plurality of pads includes a first pad. The plurality of bumps is disposed on the plurality of pads. The plurality of bumps includes a first bump disposed on the first pad. The first bump as a width that is different than an exposed with of the first pad. The center of the first bump is not aligned with a center of the first pad.