公开(公告)号：US20130149434A1

公开(公告)日：2013-06-13

申请号：US13708366

申请日：2012-12-07

Applicant: Samsung Corning Precision Materials Co., Ltd.

Inventor： Sang Yoon Oh ,  Ji Yoon Seo ,  Jin Soo An ,  Jin Sung Lim

IPC: C03B33/07

CPC classification number: C03B33/074 ,  C03C17/23 ,  C03C2218/33 ,  C03C2218/355 ,  C03C2218/365 ,  Y02P40/57

Abstract: A method of cutting a piece of tempered glass in which the piece of tempered glass is cut after a thin film having a tensile stress is formed a method of fabricating a touchscreen using the same. The method includes a step of forming a thin film layer having a tensile stress on the piece of tempered glass and a step of cutting the piece of tempered glass.

Abstract translation: 在形成具有拉伸应力的薄膜之后切割钢化玻璃片的方法是形成使用其的触摸屏的制造方法。 该方法包括在钢化玻璃片上形成具有拉伸应力的薄膜层和切割钢化玻璃的步骤。

公开(公告)号：US20140160370A1

公开(公告)日：2014-06-12

申请号：US14090404

申请日：2013-11-26

Applicant: Samsung Corning Precision Materials Co., Ltd.

Inventor： Jae Hong Lee ,  Jin Soo An ,  Jung Hong Oh ,  Chang Moog Rim

IPC: H05K1/02 ,  G06F1/16

CPC classification number: H05K3/064 ,  G06F3/041 ,  G06F2203/04103 ,  H05K2201/0326 ,  H05K2201/098 ,  H05K2201/10053 ,  H05K2201/10128

Abstract: A transparent conductive substrate that is used for detecting a touched position on a touch screen panel (TSP), and a touch panel including the same. The transparent conductive substrate includes a base substrate and a transparent conductive layer formed on the base substrate. The transparent conductive layer includes a patterned area which is provided by coating the base substrate with a transparent conductive film containing indium tin oxide and a non-patterned area through which the base substrate is exposed. The thickness of the transparent conductive layer ranges from 110 to 180 nm.

Abstract translation: 用于检测触摸屏面板（TSP）上的触摸位置的透明导电基板和包括该透明导电基板的触摸面板。 透明导电基板包括基底基板和形成在基底基板上的透明导电层。 透明导电层包括图案化区域，其通过用含有氧化铟锡的透明导电膜和暴露基底基板的非图案化区域涂覆基底基板而提供。 透明导电层的厚度为110〜180nm。

公开(公告)号：US20140154424A1

公开(公告)日：2014-06-05

申请号：US14093777

申请日：2013-12-02

Applicant: Samsung Corning Precision Materials Co., Ltd.

Inventor： Jung Hong Oh ,  Jin Soo An ,  Chang Moog Rim ,  Gi Mo Yang ,  Sang Yoon Oh

IPC: C23C14/50

CPC classification number: C23C14/086 ,  C23C14/34 ,  C23C14/541 ,  C23C14/562

Abstract: A roll-to-roll sputtering method transports a flexible substrate wound on an unwinder roll to a depositing part, forms a deposited film on the flexible substrate, and winds the flexible substrate on a winder roll. The depositing part includes a first depositing part. The first depositing part includes a first sputtering part which deposits a first target material on one surface of the flexible substrate and a heater which is disposed at a side of the other surface of the flexible substrate to heat the flexible substrate.

Abstract translation: 卷绕到溅射方法将卷绕在退绕辊上的柔性基板输送到沉积部分，在柔性基板上形成沉积膜，并将柔性基板卷绕在卷绕辊上。 沉积部分包括第一沉积部分。 第一沉积部分包括在柔性基板的一个表面上沉积第一目标材料的第一溅射部分和设置在柔性基板的另一个表面的侧面以加热柔性基板的加热器。