公开(公告)号：US20150237726A1

公开(公告)日：2015-08-20

申请号：US14454850

申请日：2014-08-08

Applicant: Samsung Display Co., LTD.

Inventor： Ki-Hae SHIN ,  Jeong-Hun GO ,  Hee-Un KU ,  Young-Sun KIM ,  Hoe-Seok NA

IPC: H05K1/11 ,  H05K1/02 ,  H05K5/00

CPC classification number: H05K1/028 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K1/189 ,  H05K3/282 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/053 ,  H05K2201/09154 ,  H05K2201/09227 ,  H05K2201/09254 ,  H05K2201/09727 ,  H05K2201/10128 ,  H05K2201/2009 ,  H05K2203/1147 ,  H01L2924/00

Abstract: A tape package includes a base substrate including a signal transmitting area and a protruding area protruded from the signal transmitting area, an integrated circuit chip mounted on the base substrate, and a lead line disposed on the base substrate and including a first portion electrically connected with the integrated circuit chip, a second portion electrically connected with the first portion and extending in a first direction, and a third portion electrically connected with the second portion and extending in a second direction crossing the first direction.

Abstract translation: 一种带包装，包括：基底基板，包括信号传输区域和从信号传输区域突出的突出区域;安装在基底基板上的集成电路芯片;以及设置在基底基板上的引线， 集成电路芯片，与第一部分电连接并沿第一方向延伸的第二部分，以及与第二部分电连接并沿与​​第一方向交叉的第二方向延伸的第三部分。