公开(公告)号：US20160372408A1

公开(公告)日：2016-12-22

申请号：US15183868

申请日：2016-06-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hai LIU

IPC: H01L23/498 ,  H01L23/31 ,  H01L25/065 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49866 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/50 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/03828 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81447 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K1/00 ,  H01L2924/00014

Abstract: A method of manufacturing a semiconductor package according to the present inventive concepts comprises preparing a printed circuit board (PCB) including a protected layer, exposing a portion of the protected layer from the insulating layer, forming a solder ball land by processing the exposed surface of the protected layer, forming a solder ball on the solder ball land, and mounting a semiconductor chip on the solder ball formed on the PCB. The solder balls include copper of about 0.01 wt % to about 0.5 wt %.

Abstract translation: 根据本发明构思的半导体封装的制造方法包括制备包括保护层的印刷电路板（PCB），将保护层的一部分暴露于绝缘层，通过处理暴露表面形成焊球接地 保护层，在焊锡球焊盘上形成焊球，并将半导体芯片安装在PCB上形成的焊球上。 焊球包括约0.01重量％至约0.5重量％的铜。

公开(公告)号：US20160005683A1

公开(公告)日：2016-01-07

申请号：US14748970

申请日：2015-06-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hai LIU

IPC: H01L23/498

CPC classification number: H05K1/111 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15323 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/113 ,  H05K3/244 ,  H05K3/46 ,  H05K2201/0338 ,  H05K2201/0347 ,  H05K2201/09663 ,  H05K2201/09745 ,  H05K2201/098 ,  H05K2201/099 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/014

Abstract: A printed circuit board for a semiconductor package including a printed circuit board body, a plurality of ball lands on one surface of the printed circuit board body, a first plating layer on a portion of each of the ball lands, and a second plating layer on another portion of each of the ball lands may be provided. An upper surface of the first plating layer may be coplanar with an upper surface of the second plating layer.

Abstract translation: 一种用于半导体封装的印刷电路板，包括印刷电路板主体，印刷电路板主体的一个表面上的多个球形区域，每个球场的一部分上的第一镀层和第二镀层 可以设置每个球场的另一部分。 第一镀层的上表面可以与第二镀层的上表面共面。