公开(公告)号：US20110204478A1

公开(公告)日：2011-08-25

申请号：US13097989

申请日：2011-04-29

Applicant: Sangchae Kim ,  Tony Ivanov ,  Julio Costa

Inventor： Sangchae Kim ,  Tony Ivanov ,  Julio Costa

IPC: H01L27/06 ,  H01L21/02

CPC classification number: B81B7/02 ,  B81C1/0015 ,  H01L27/101 ,  H03H3/0072 ,  H03H9/02433 ,  H03H9/2405

Abstract: The present invention relates to using an insulator layer between two metal layers of a semiconductor die to provide a micro-electromechanical systems (MEMS) device, such as an ohmic MEMS switch or a capacitive MEMS switch. In an ohmic MEMS switch, the insulator layer may be used to reduce metal undercutting during fabrication, to prevent electrical shorting of a MEMS actuator to a MEMS cantilever, or both. In a capacitive MEMS switch, the insulator layer may be used as a capacitive dielectric between capacitive plates, which are provided by the two metal layers. A fixed capacitive element may be provided by the insulator layer between the two metal layers. In one embodiment of the present invention, an ohmic MEMS switch, a capacitive MEMS switch, a fixed capacitive element, or any combination thereof may be integrated into a single semiconductor die.

Abstract translation: 本发明涉及在半导体管芯的两个金属层之间使用绝缘体层来提供诸如欧姆MEMS开关或电容式MEMS开关的微机电系统（MEMS）器件。 在欧姆MEMS开关中，绝缘体层可用于在制造过程中减少金属底切，以防止MEMS致动器对MEMS悬臂的电短路，或两者兼而有之。 在电容MEMS开关中，绝缘体层可以用作由两个金属层提供的电容板之间的电容电介质。 固定的电容元件可以由两个金属层之间的绝缘体层提供。 在本发明的一个实施例中，欧姆MEMS开关，电容MEMS开关，固定电容元件或其任何组合可以集成到单个半导体管芯中。

公开(公告)号：US08636912B1

公开(公告)日：2014-01-28

申请号：US13400355

申请日：2012-02-20

Applicant: Sangchae Kim ,  Steven Crist

Inventor： Sangchae Kim ,  Steven Crist

IPC: C23F1/00 ,  H01L23/02

CPC classification number: H01L23/315 ,  B81C1/00333 ,  B81C2203/0136 ,  B81C2203/0145 ,  B81C2203/0154 ,  H01L21/56 ,  H01L23/3121 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of forming a device is provided. A substrate having a component is provided and a sacrificial layer is formed over the component. The sacrificial layer includes a cavity portion disposed about the component and a tunnel portion adjacent to the cavity portion. In addition, an encapsulation layer having a cover portion and a perimeter portion is formed over the sacrificial layer. The cover portion encapsulates the cavity portion such that the cavity portion forms a cavity within the cover portion. The perimeter portion is disposed over the tunnel portion. Moreover, an access hole is formed in the perimeter portion of the encapsulation layer.

Abstract translation: 提供了一种形成装置的方法。 提供具有部件的基板，并在该部件上形成牺牲层。 牺牲层包括围绕部件设置的空腔部分和与空腔部分相邻的隧道部分。 此外，在牺牲层之上形成具有盖部分和周边部分的封装层。 盖部分封装空腔部分，使得空腔部分在盖部分内形成空腔。 周边部分设置在隧道部分上。 此外，在封装层的周边部分形成有通孔。

公开(公告)号：US08399333B2

公开(公告)日：2013-03-19

申请号：US13097989

申请日：2011-04-29

Applicant: Sangchae Kim ,  Tony Ivanov ,  Julio Costa

Inventor： Sangchae Kim ,  Tony Ivanov ,  Julio Costa

IPC: H01L21/20 ,  H01L21/02

CPC classification number: B81B7/02 ,  B81C1/0015 ,  H01L27/101 ,  H03H3/0072 ,  H03H9/02433 ,  H03H9/2405

Abstract: The present invention relates to using an insulator layer between two metal layers of a semiconductor die to provide a micro-electromechanical systems (MEMS) device, such as an ohmic MEMS switch or a capacitive MEMS switch. In an ohmic MEMS switch, the insulator layer may be used to reduce metal undercutting during fabrication, to prevent electrical shorting of a MEMS actuator to a MEMS cantilever, or both. In a capacitive MEMS switch, the insulator layer may be used as a capacitive dielectric between capacitive plates, which are provided by the two metal layers. A fixed capacitive element may be provided by the insulator layer between the two metal layers. In one embodiment of the present invention, an ohmic MEMS switch, a capacitive MEMS switch, a fixed capacitive element, or any combination thereof may be integrated into a single semiconductor die.

Abstract translation: 本发明涉及在半导体管芯的两个金属层之间使用绝缘体层来提供诸如欧姆MEMS开关或电容式MEMS开关的微机电系统（MEMS）器件。 在欧姆MEMS开关中，绝缘体层可用于在制造过程中减少金属底切，以防止MEMS致动器对MEMS悬臂的电短路，或两者兼而有之。 在电容MEMS开关中，绝缘体层可以用作由两个金属层提供的电容板之间的电容电介质。 固定的电容元件可以由两个金属层之间的绝缘体层提供。 在本发明的一个实施例中，欧姆MEMS开关，电容MEMS开关，固定电容元件或其任何组合可以集成到单个半导体管芯中。

公开(公告)号：US20120156820A1

公开(公告)日：2012-06-21

申请号：US12973105

申请日：2010-12-20

Applicant: Sangchae Kim

Inventor： Sangchae Kim

IPC: H01L21/02

CPC classification number: B81C1/00626 ,  B81B2201/014 ,  H01H1/0036 ,  H01H59/0009

Abstract: The present Disclosure provides for fabrication devices and methods for manufacturing a micro-electromechanical system (MEMS) switch on a substrate. The MEMS fabrication device may have a first and second sacrificial layer that form the mold of an actuation member. The actuation member is formed over the first and second sacrificial layers to manufacture a MEMS switch from the MEMS fabrication device.

Abstract translation: 本公开提供了用于在基板上制造微机电系统（MEMS）开关的制造装置和方法。 MEMS制造装置可以具有形成致动构件的模具的第一和第二牺牲层。 致动构件形成在第一和第二牺牲层上，以从MEMS制造装置制造MEMS开关。

公开(公告)号：US07956429B1

公开(公告)日：2011-06-07

申请号：US12181356

申请日：2008-07-29

Applicant: Sangchae Kim ,  Tony Ivanov ,  Julio Costa

Inventor： Sangchae Kim ,  Tony Ivanov ,  Julio Costa

IPC: H01L29/84 ,  H01L21/00

CPC classification number: B81B7/02 ,  B81C1/0015 ,  H01L27/101 ,  H03H3/0072 ,  H03H9/02433 ,  H03H9/2405

Abstract: The present invention relates to using an insulator layer between two metal layers of a semiconductor die to provide a micro-electromechanicalsystems (MEMS) device, such as an ohmic MEMS switch or a capacitive MEMS switch. In an ohmic MEMS switch, the insulator layer may be used to reduce metal undercutting during fabrication, to prevent electrical shorting of a MEMS actuator to a MEMS cantilever, or both. In a capacitive MEMS switch, the insulator layer may be used as a capacitive dielectric between capacitive plates, which are provided by the two metal layers. A fixed capacitive element may be provided by the insulator layer between the two metal layers. In one embodiment of the present invention, an ohmic MEMS switch, a capacitive MEMS switch, a fixed capacitive element, or any combination thereof may be integrated into a single semiconductor die.

Abstract translation: 本发明涉及在半导体管芯的两个金属层之间使用绝缘体层来提供诸如欧姆MEMS开关或电容式MEMS开关的微机电系统（MEMS）器件。 在欧姆MEMS开关中，绝缘体层可用于在制造过程中减少金属底切，以防止MEMS致动器对MEMS悬臂的电短路，或两者兼而有之。 在电容MEMS开关中，绝缘体层可以用作由两个金属层提供的电容板之间的电容电介质。 固定的电容元件可以由两个金属层之间的绝缘体层提供。 在本发明的一个实施例中，欧姆MEMS开关，电容MEMS开关，固定电容元件或其任何组合可以集成到单个半导体管芯中。

公开(公告)号：US09221677B2

公开(公告)日：2015-12-29

申请号：US12973105

申请日：2010-12-20

Applicant: Sangchae Kim

Inventor： Sangchae Kim

IPC: H01L21/02 ,  B81C1/00 ,  H01H1/00 ,  H01H59/00

CPC classification number: B81C1/00626 ,  B81B2201/014 ,  H01H1/0036 ,  H01H59/0009

Abstract: The present Disclosure provides for fabrication devices and methods for manufacturing a micro-electromechanical system (MEMS) switch on a substrate. The MEMS fabrication device may have a first and second sacrificial layer that form the mold of an actuation member. The actuation member is formed over the first and second sacrificial layers to manufacture a MEMS switch from the MEMS fabrication device.

Abstract translation: 本公开提供了用于在基板上制造微机电系统（MEMS）开关的制造装置和方法。 MEMS制造装置可以具有形成致动构件的模具的第一和第二牺牲层。 致动构件形成在第一和第二牺牲层上，以从MEMS制造装置制造MEMS开关。

公开(公告)号：US08159056B1

公开(公告)日：2012-04-17

申请号：US12014665

申请日：2008-01-15

Applicant: Sangchae Kim ,  Steven Crist

Inventor： Sangchae Kim ,  Steven Crist

IPC: H01L23/02

CPC classification number: H01L23/315 ,  B81C1/00333 ,  B81C2203/0136 ,  B81C2203/0145 ,  B81C2203/0154 ,  H01L21/56 ,  H01L23/3121 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of forming a device is provided. A substrate having a component is provided and a sacrificial layer is formed over the component. The sacrificial layer includes a cavity portion disposed about the component and a tunnel portion adjacent to the cavity portion. In addition, an encapsulation layer having a cover portion and a perimeter portion is formed over the sacrificial layer. The cover portion encapsulates the cavity portion such that the cavity portion forms a cavity within the cover portion. The perimeter portion is disposed over the tunnel portion. Moreover, an access hole is formed in the perimeter portion of the encapsulation layer.

Abstract translation: 提供了一种形成装置的方法。 提供具有部件的基板，并在该部件上形成牺牲层。 牺牲层包括围绕部件设置的空腔部分和与空腔部分相邻的隧道部分。 此外，在牺牲层之上形成具有盖部分和周边部分的封装层。 盖部分封装空腔部分，使得空腔部分在盖部分内形成空腔。 周边部分设置在隧道部分上。 此外，在封装层的周边部分形成有通孔。