公开(公告)号：US20180241140A1

公开(公告)日：2018-08-23

申请号：US15807829

申请日：2017-11-09

Applicant: Shannon Systems Ltd.

Inventor： Xinglong WANG ,  Xiaoyan CHEN

IPC: H01R12/70 ,  G06F13/40 ,  G06F13/42 ,  G06F1/20 ,  H01R12/72

CPC classification number: H01R12/7076 ,  G06F1/185 ,  G06F1/20 ,  G06F13/4081 ,  G06F13/4282 ,  G06F2213/0026 ,  G06F2213/3802 ,  G06F2213/3852 ,  H01R12/721 ,  H01R12/724

Abstract: An adapter card is provided, which is adapted to couple a storage device to a circuit board. The adapter card includes a card body, a first port, a second port and a first planar supporter. The first port is disposed on a surface of the card body. The first port is adapted to be coupled to the storage device. The second port is disposed on an edge of the card body. The second port is adapted to be coupled to the circuit board. An interface stander of the first port differs from an interface stander of the second port. The first planar supporter is disposed on the surface of the card body. When the storage device is connected to the first port, the first planar supporter abuts a first side of the storage device.

公开(公告)号：US20180184537A1

公开(公告)日：2018-06-28

申请号：US15469798

申请日：2017-03-27

Applicant: Shannon Systems Ltd.

Inventor： Xinglong WANG ,  Jia HE ,  Xiaoyan CHEN

IPC: H05K7/02 ,  H05K7/20 ,  H05K1/18

CPC classification number: H05K7/026 ,  G06F1/20 ,  G11C5/02 ,  H01L23/367 ,  H05K1/0203 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K7/20409 ,  H05K2201/042 ,  H05K2201/066 ,  H05K2201/10159 ,  H05K2201/10189

Abstract: A memory device is provided. The memory device includes a motherboard, a controller, a first memory unit, a second memory unit and a heat sink. The motherboard includes a contact portion. The controller is disposed on the motherboard and corresponds to the contact portion. The first memory unit is coupled to the motherboard. The first memory unit is located on one side of the controller. The first memory unit includes a plurality of first memory chips. The second memory unit is coupled to the motherboard. The second memory unit is located on another side of the controller. The second memory unit includes a plurality of second memory chips. The heat sink is thermally connected to the controller. The heat sink is located between the first memory unit and the second memory unit.