公开(公告)号：US20100283086A1

公开(公告)日：2010-11-11

申请号：US12774877

申请日：2010-05-06

Applicant: Byoung-Su LEE ,  Shin KIM ,  Sang-Shin LEE ,  Yeo-Taek YOON

Inventor： Byoung-Su LEE ,  Shin KIM ,  Sang-Shin LEE ,  Yeo-Taek YOON

IPC: H01L27/148 ,  G02B5/20

CPC classification number: G02B5/201 ,  B82Y20/00 ,  G02B5/1809 ,  H01L27/14621 ,  H01L31/02165

Abstract: Disclosed is a metal optical filter capable of a photo-lithography process and an image sensor including the same, and more particularly, a metal optical filter capable of a photo-lithography process, which can quite freely adjust the transmission band and transmittance thereof, even with a small number of metal layers, and simultaneously, can be actually applied in a CMOS process because it is possible to achieve nanoscale patterning by the photo-lithography process, and an image sensor including the metal optical filter. The metal optical filter capable of a photo-lithography process includes a plurality of metal rods arranged in parallel with each other at an equal nanoscale interval; and an insulation material formed between the plurality of metal rods and on upper and lower surfaces of the plurality of metal rods, wherein the metal rod is formed to comprise an upper Ti layer, an Al layer, and a lower TiN layer.

Abstract translation: 公开了一种能够进行光刻工艺的金属光学滤光器和包括该光刻工艺的图像传感器，更具体地说，涉及一种能够相当自由地调节透射带和透光率的光刻工艺的金属滤光器，甚至 具有少量金属层，并且同时可以实际应用于CMOS工艺，因为可以通过光刻工艺实现纳米级图案化，以及包括金属滤光器的图像传感器。 能够进行光刻工艺的金属光学滤光器包括以相等的纳米间隔彼此平行布置的多个金属棒; 以及形成在所述多个金属棒之间以及所述多个金属棒的上表面和下表面上的绝缘材料，其中所述金属棒形成为包括上Ti层，Al层和下TiN层。

公开(公告)号：US20130076893A1

公开(公告)日：2013-03-28

申请号：US13616137

申请日：2012-09-14

Applicant: Yeon Kyu JEONG ,  Shin KIM ,  Jeong Hun KIM ,  Jong Owan KIM ,  Sang Sik YOON ,  Dong Hun LEE ,  Jea Yun SO

Inventor： Yeon Kyu JEONG ,  Shin KIM ,  Jeong Hun KIM ,  Jong Owan KIM ,  Sang Sik YOON ,  Dong Hun LEE ,  Jea Yun SO

IPC: H04N7/18

CPC classification number: G01S17/00 ,  G01S7/4813 ,  G01S7/4814 ,  G01S7/4816 ,  G01S17/88 ,  G01S17/936 ,  G02B17/0808 ,  G05D1/0238 ,  G05D1/0248 ,  G05D2201/0203

Abstract: An obstacle sensor includes a line light irradiating unit including a light-emitting unit, a light-emitting driving unit to drive the light-emitting unit, and a first conical mirror, an apex of which is disposed towards the light-emitting unit in a light irradiation direction of the light-emitting unit and which converts light emitted from the light-emitting unit into line light irradiated in all directions, and a reflected light receiving unit including a second conical mirror to condense light, that is irradiated from the first conical mirror and is then reflected from an obstacle, a lens, that is spaced from the apex of the second conical mirror by a predetermined distance and transmits the reflected light, an imaging unit to image the reflected light that passes through the lens, an image processing unit, and an obstacle sensing control unit.

Abstract translation: 障碍传感器包括：行光照射单元，包括发光单元，驱动发光单元的发光驱动单元;以及第一锥形反射镜，其顶点设置在发光单元中 发光单元的光照射方向，并将从发光单元发射的光转换为沿所有方向照射的线光;以及反射光接收单元，包括第二锥形镜以使光从第一锥形 然后从与第二锥形反射镜的顶点隔开预定距离的障碍物，透镜反射并透射反射光，成像单元对通过透镜的反射光进行成像，图像处理 单元和障碍物感测控制单元。

公开(公告)号：US20130001615A1

公开(公告)日：2013-01-03

申请号：US13361555

申请日：2012-01-30

Applicant: Shin KIM

Inventor： Shin KIM

IPC: H01L33/60

CPC classification number: H01L33/58 ,  H01L33/38 ,  H01L33/42 ,  H01L33/44 ,  H01L33/46 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2933/0083 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Embodiments provide a light emitting device including a light emitting structure having a first conduction type semiconductor layer, an active layer, and a second conduction type semiconductor layer, a metal filter of an irregular pattern on the light emitting structure, and openings between the irregular patterns in the metal filter.

Abstract translation: 实施例提供一种发光器件，其包括具有第一导电类型半导体层，有源层和第二导电类型半导体层的发光结构，发光结构上的不规则图案的金属滤光器，以及不规则图案之间的开口 在金属过滤器中。

公开(公告)号：US20080012117A1

公开(公告)日：2008-01-17

申请号：US11752770

申请日：2007-05-23

Applicant: Shin KIM

Inventor： Shin KIM

IPC: H01L23/48 ,  H01L21/30 ,  H01L21/58

CPC classification number: H01L23/3114 ,  H01L21/561 ,  H01L23/13 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/12 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L25/105 ,  H01L2224/03334 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/16105 ,  H01L2224/16157 ,  H01L2224/274 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83 ,  H01L2225/1005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H05K1/183 ,  H05K1/184 ,  H05K2201/09845 ,  H05K2201/10477 ,  H05K2201/10727 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Provided are a semiconductor package having connection terminals whose side surfaces are exposed and a semiconductor module including such a semiconductor package. Also provided are methods of fabricating the semiconductor package and semiconductor module. According to an embodiment of the present invention, a semiconductor package includes a semiconductor chip including a semiconductor wafer having first and second opposite surfaces and a plurality of conductive pads arranged in a row on the first surface along the edges of the semiconductor wafer such that a side surface of each conductive pad is exposed. An insulating layer is formed on the first surface of the semiconductor wafer and includes openings for exposing parts of the conductive pads. A plurality of connection terminals are respectively arranged on the conductive pads exposed through the openings and a reinforcing member is arranged on the insulating layer to cover a portion of each connection terminal.

Abstract translation: 提供了具有侧表面露出的连接端子和包括这种半导体封装的半导体模块的半导体封装。 还提供了制造半导体封装和半导体模块的方法。 根据本发明的实施例，半导体封装包括半导体芯片，其包括具有第一和第二相对表面的半导体晶片和沿着半导体晶片的边缘在第一表面上排成一行的多个导电焊盘，使得 每个导电焊盘的侧面露出。 绝缘层形成在半导体晶片的第一表面上，并且包括用于暴露导电焊盘部分的开口。 多个连接端子分别布置在通过开口暴露的导电焊盘上，并且在绝缘层上布置加强构件以覆盖每个连接端子的一部分。