公开(公告)号：US20150235914A1

公开(公告)日：2015-08-20

申请号：US14328092

申请日：2014-07-10

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chang-Fu Lin ,  Chin-Tsai Yao ,  Ming-Chin Chuang ,  Po-Hua Chen ,  Fu-Tang Huang

IPC: H01L23/13 ,  H05K3/46 ,  H05K1/11 ,  C25D5/02 ,  H01L23/00 ,  H01L21/48

CPC classification number: H05K3/4661 ,  C25D5/02 ,  C25D5/48 ,  C25D7/00 ,  H01L21/4853 ,  H01L23/49894 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81444 ,  H01L2224/81815 ,  H01L2924/3841 ,  H05K1/111 ,  H05K3/244 ,  H05K3/3436 ,  H05K2201/09745 ,  H05K2201/099 ,  H05K2201/10674 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A flip-chip packaging substrate is provided, which includes: a substrate body; a plurality of conductive pads formed on a surface of the substrate body; an insulating layer formed on the surface of the substrate body and having a plurality of openings correspondingly exposing a portion of each of the conductive pads; and a metal layer formed on each of the conductive pads in the openings, wherein the metal layer has a top surface having a lowest point lower than a top surface of the insulating layer, and a thickness ratio of the metal layer to the insulating layer is greater than or equal to 1/4 and less than 1, thereby preventing a solder bridge or short circuit from occurring.

Abstract translation: 提供一种倒装芯片封装基板，其包括：基板主体; 形成在所述基板主体的表面上的多个导电焊盘; 绝缘层，其形成在所述基板主体的表面上并且具有多个开口，对应地暴露所述导电焊盘的每一个的一部分; 以及形成在所述开口中的每个所述导电焊盘上的金属层，其中，所述金属层具有比所述绝缘层的顶表面低的最低点的顶表面，并且所述金属层与所述绝缘层的厚度比为 大于或等于1/4且小于1，从而防止发生焊料桥或短路。