Patent search ap:("Steven A. Cordes" OR "Peter A. Gruber") AND inv:"Peter A. Gruber" Page 1

1.

发明授权
Rotational fill techniques for injection molding of solder 失效
Title translation: 用于注射成型焊料的旋转填充技术

公开(公告)号：US07784673B2

公开(公告)日：2010-08-31

申请号：US12189388

申请日：2008-08-11

Applicant: Steven A. Cordes , Peter A. Gruber , John U. Knickerbocker , James L. Speidell

Inventor： Steven A. Cordes , Peter A. Gruber , John U. Knickerbocker , James L. Speidell

IPC: B23K31/02 , B23K37/00

CPC classification number: B23K3/0638 , B23K35/02 , B23K2101/40 , H01L2224/11

Abstract: A system and method for injection molding conductive bonding material into a plurality of cavities in a non-rectangular mold is disclosed. The method comprises aligning a fill head with a non-rectangular mold. The non-rectangular mold includes a plurality of cavities. The fill head is placed in substantial contact with the non-rectangular mold. Rotational motion is provided to at least one of the non-rectangular mold and the fill head while the fill head is in substantial contact with the non-rectangular mold. Conductive bonding material is forced out of the fill head toward the non-rectangular mold. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract translation: 公开了一种用于将导电接合材料注射成非矩形模具中的多个空腔的系统和方法。该方法包括将填充头与非矩形模具对准。非矩形模具包括多个空腔。填充头被放置成与非矩形模具基本接触。旋转运动提供给非矩形模具和填充头中的至少一个，同时填充头基本上与非矩形模具接触。将导电接合材料从填充头推向非矩形模具。导电接合材料被提供到与填充头附近的至少一个空腔同时的多个空腔的至少一个空腔中。

2.

发明申请
FILL HEAD FOR INJECTION MOLDING OF SOLDER 有权
Title translation: 喷枪注射成型头

公开(公告)号：US20080302502A1

公开(公告)日：2008-12-11

申请号：US12189822

申请日：2008-08-12

Applicant: STEVEN A. CORDES , Peter A. Gruber , John U. Knickerbrocker , James L. Speidell

Inventor： STEVEN A. CORDES , Peter A. Gruber , John U. Knickerbrocker , James L. Speidell

IPC: B22D17/00

CPC classification number: B23K3/0638 , B23K1/20 , B23K2101/40 , H01L24/11 , H01L24/742 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01027 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00

Abstract: A system, method, and apparatus for injection molding conductive bonding material into a plurality of cavities in a surface are disclosed. The method comprises aligning a fill head with a surface. The mold includes a plurality of cavities. The method further includes placing the fill head in substantial contact with the surface. At least a first gas is channeled about a first region of the fill head. The at least first gas has a temperature above a melting point of conductive bonding material residing in a reservoir thereby maintaining the conductive bonding material in a molten state. The conductive bonding material is forced out of the fill head toward the surface. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract translation: 公开了一种用于将导电接合材料注射成表面中的多个空腔的系统，方法和装置。该方法包括将填充头与表面对准。模具包括多个空腔。该方法还包括将填充头与表面实质接触。至少第一气体围绕填充头的第一区域引导。所述至少第一气体具有高于位于储存器中的导电接合材料的熔点的温度，从而将导电接合材料保持在熔融状态。导电接合材料从表面压出填料头。导电接合材料被提供到与填充头附近的至少一个空腔同时的多个空腔的至少一个空腔中。

3.

发明申请
Process for Preparing a Solder Stand-Off 审中-公开
Title translation: 焊接准备工序

公开(公告)号：US20090266480A1

公开(公告)日：2009-10-29

申请号：US12111915

申请日：2008-04-29

Applicant: Steven A. Cordes , Peter A. Gruber

Inventor： Steven A. Cordes , Peter A. Gruber

IPC: B32B38/04

CPC classification number: H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2221/68381 , H01L2224/05026 , H01L2224/05573 , H01L2224/11001 , H01L2224/111 , H01L2224/1148 , H01L2224/11901 , H01L2224/11902 , H01L2224/13076 , H01L2224/13078 , H01L2224/13099 , H01L2224/131 , H01L2224/13147 , H01L2224/16 , H01L2224/73104 , H01L2224/81191 , H01L2224/812 , H01L2224/81801 , H01L2924/0001 , H01L2924/00014 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , Y10T156/1064 , H01L2224/05099

Abstract: The present invention relates to an injection molding of solder (IMS) process for preparing heterogenous solder bumps that contain a stand-off feature.

Abstract translation: 本发明涉及一种用于制备含有间隔特征的异种焊料凸块的焊料注射成型（IMS）工艺。

4.

发明授权
Fill head for injection molding of solder 失效
Title translation: 填充头用于注射成型焊料

公开(公告)号：US07410092B2

公开(公告)日：2008-08-12

申请号：US11409233

申请日：2006-04-21

Applicant: Steven A. Cordes , Peter A. Gruber , John U. Knickerbocker , James L. Speidell

Inventor： Steven A. Cordes , Peter A. Gruber , John U. Knickerbocker , James L. Speidell

IPC: B23K31/02

CPC classification number: B23K3/0638 , B23K1/20 , B23K2101/40 , H01L24/11 , H01L24/742 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01027 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00

Abstract: A system, method, and apparatus for injection molding conductive bonding material into a plurality of cavities in a surface are disclosed. The method comprises aligning a fill head with a surface. The mold includes a plurality of cavities. The method further includes placing the fill head in substantial contact with the surface. At least a first gas is channeled about a first region of the fill head. The at least first gas has a temperature above a melting point of conductive bonding material residing in a reservoir thereby maintaining the conductive bonding material in a molten state. The conductive bonding material is forced out of the fill head toward the surface. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract translation: 公开了一种用于将导电接合材料注射成表面中的多个空腔的系统，方法和装置。该方法包括将填充头与表面对准。模具包括多个空腔。该方法还包括将填充头与表面实质接触。至少第一气体围绕填充头的第一区域引导。所述至少第一气体具有高于位于储存器中的导电接合材料的熔点的温度，从而将导电接合材料保持在熔融状态。导电接合材料从表面压出填料头。导电接合材料被提供到与填充头附近的至少一个空腔同时的多个空腔的至少一个空腔中。

5.

发明授权
Solder standoffs for injection molding of solder 有权
Title translation: 用于注射成型焊料的焊接对位

公开(公告)号：US07810702B2

公开(公告)日：2010-10-12

申请号：US12166523

申请日：2008-07-02

Applicant: Steven A. Cordes , Peter A. Gruber

Inventor： Steven A. Cordes , Peter A. Gruber

IPC: H05K3/34 , H01L21/00 , B23K31/00

CPC classification number: B23K1/0016 , B23K3/0623 , B23K2101/40 , H05K3/3478 , H05K3/3484 , H05K2203/0113 , H05K2203/0338 , H05K2203/043

Abstract: A method of producing standoffs in an injection molded solder (IMS) mold, which possesses cavities, each of which is filled with a solder paste using standard techniques, such as screening or IMS. This solder paste is heated to a reflow temperature at which the solder melts and forms a ball or sphere. Since solder pastes are known to reduce in volume due to the therein contained organic material burning off, the remaining solder ball will be significantly lower in volume than that of the cavity. A solder material having a lower melting point is then filled into the cavities about the solder balls. The mold and solder metal are then allowed to cool, resulting in the formation of a solid sphere of metal in the cavity surrounded by solder material of a lower melting point, which, upon transfer to a wafer, form the standoffs.

Abstract translation: 在注射成型焊料（IMS）模具中制造支座的方法，其具有空腔，其中使用诸如筛选或IMS的标准技术填充焊膏。该焊膏被加热至回流温度，焊料熔化并形成球或球。由于已知焊膏由于其中含有有机材料燃烧而体积减小，所以剩余的焊球体积将明显低于空腔。然后将具有较低熔点的焊料材料填充到围绕焊料球的空腔中。然后允许模具和焊料金属冷却，导致在由熔点较低的焊料材料包围的空腔中形成金属固体球，其在转移到晶片时形成支座。

6.

发明授权
High-temperature alloy standoffs for injection molding of solder 失效
Title translation: 用于注射成型焊料的高温合金支架

公开(公告)号：US07506794B1

公开(公告)日：2009-03-24

申请号：US12166505

申请日：2008-07-02

Applicant: Steven A. Cordes , Peter A. Gruber

Inventor： Steven A. Cordes , Peter A. Gruber

IPC: H05K3/34 , H01L21/00 , H01L23/488

CPC classification number: H05K3/3478 , B23K3/0623 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/742 , H01L24/81 , H01L2224/0401 , H01L2224/06505 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/14505 , H01L2224/81136 , H01L2224/81801 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H05K3/3436 , H05K3/3463 , H05K2201/09781 , H05K2201/2036 , H05K2203/0113 , H05K2203/0338 , Y02P70/613 , H01L2924/00

Abstract: A method in forming high-temperature alloy solder standoff in a solder bumping process, such as in injection molded solder molds. The standoffs are formed in an injection molded solder mold, by means of pre-depositing a layer of a metal at select sites, such as some of the cavities which are formed in the surface of the mold, and thereafter, filling the mold cavities with solder, utilizing standard techniques as known in the technology. The particular metal, which is deposited in at least some of the mold cavities, will alloy with the solder during or after transfer, and will result in the formation of a higher temperature alloy solder at select locations in the mold cavities.

Abstract translation: 在焊接凸块工艺中形成高温合金焊料支架的方法，例如在注塑模具中。通过在选定位置预先沉积金属层，例如形成在模具表面中的一些空腔，然后在模具腔中填充模具腔，在注塑模具中形成支座焊料，利用技术中已知的标准技术。沉积在至少一些模腔中的特定金属将在转移期间或转移后与焊料合金，并且将导致在模腔中的选定位置形成更高温度的合金焊料。

7.

发明申请
DIRECT EDGE CONNECTION FOR MULTI-CHIP INTEGRATED CIRCUITS 有权
Title translation: 用于多芯片集成电路的直接边缘连接

公开(公告)号：US20080315409A1

公开(公告)日：2008-12-25

申请号：US11765055

申请日：2007-06-19

Applicant: Steven A. Cordes , Matthew J. Farinelli , Sherif A. Goma , Peter A. Gruber , John U. Knickerbocker , James L. Speidell

Inventor： Steven A. Cordes , Matthew J. Farinelli , Sherif A. Goma , Peter A. Gruber , John U. Knickerbocker , James L. Speidell

IPC: H01L23/48

CPC classification number: H01L21/6835 , H01L24/11 , H01L24/81 , H01L24/83 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L25/50 , H01L2224/0401 , H01L2224/06183 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/16137 , H01L2224/16238 , H01L2224/17183 , H01L2224/81005 , H01L2224/811 , H01L2224/81191 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2224/81986 , H01L2224/97 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01054 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1532 , H01L2924/30105 , H01L2924/3025 , H01L2924/3512 , H01L2924/00 , H01L2224/83851 , H01L2224/81

Abstract: The present invention allows for direct chip-to-chip connections using the shortest possible signal path.

Abstract translation: 本发明允许使用尽可能短的信号路径进行直接芯片到芯片的连接。

8.

发明申请
CONDUCTIVE BONDING MATERIAL FILL TECHNIQUES 有权
Title translation: 导电粘接材料填充技术

公开(公告)号：US20080272177A1

公开(公告)日：2008-11-06

申请号：US12173346

申请日：2008-07-15

Applicant: Steven A. Cordes , Peter A. Gruber , John U. Knickerbocker , James L. Speidell

Inventor： Steven A. Cordes , Peter A. Gruber , John U. Knickerbocker , James L. Speidell

IPC: B23K37/06

CPC classification number: H05K3/3484 , B23K3/0607 , B23K2101/42 , H05K3/4038 , H05K2201/0305 , H05K2201/09472 , H05K2203/0126 , H05K2203/043 , H05K2203/0568

Abstract: A system provides solder into cavities in a circuit supporting substrate. The system places a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Solder is forced out of the fill head toward the circuit supporting substrate. The solder is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head. The system brings a second circuit supporting substrate in close proximity to the circuit supporting substrate, at least one receiving pad on the second circuit supporting substrate substantially contacts the conductive bonding material of the at least one cavity.

Abstract translation: 系统将焊料提供到电路支撑衬底中的空腔中。该系统使填充头与电路支撑衬底基本接触。电路支撑衬底包括至少一个空腔。当填充头与电路支撑衬底基本接触时，向电路支撑衬底和填充头中的至少一个提供直线运动或旋转运动。焊料被迫从填充头朝向电路支撑基板。焊料被提供到与填充头附近的至少一个空腔同时的至少一个空腔中。系统使第二电路支撑衬底紧靠电路支撑衬底，第二电路支撑衬底上的至少一个接收衬垫基本上接触至少一个空腔的导电接合材料。

9.

发明授权
Conductive bonding material fill techniques 有权
Title translation: 导电接合材料填充技术

公开(公告)号：US07410090B2

公开(公告)日：2008-08-12

申请号：US11409244

申请日：2006-04-21

Applicant: Steven A. Cordes , Peter A. Gruber , John U. Knickerbocker , James L. Speidell

Inventor： Steven A. Cordes , Peter A. Gruber , John U. Knickerbocker , James L. Speidell

IPC: B23K31/02

CPC classification number: H05K3/3484 , B23K3/0607 , B23K2101/42 , H05K3/4038 , H05K2201/0305 , H05K2201/09472 , H05K2203/0126 , H05K2203/043 , H05K2203/0568

Abstract: A system, method, and apparatus of providing conductive bonding material into a plurality of cavities in a circuit supporting substrate is disclosed. The method comprises placing a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Conductive bonding material is forced out of the fill head toward the circuit supporting substrate. The conductive bonding material is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract translation: 公开了一种在电路支撑衬底中的多个空腔中提供导电接合材料的系统，方法和装置。该方法包括将填充头放置成与电路支撑衬底基本接触。电路支撑衬底包括至少一个空腔。当填充头与电路支撑衬底基本接触时，向电路支撑衬底和填充头中的至少一个提供直线运动或旋转运动。导电接合材料被迫从填充头朝向电路支撑基板排出。所述导电接合材料被提供到与所述至少一个空腔同时的至少一个空腔中，所述至少一个空腔在所述填充头附近。