公开(公告)号：US10177067B2

公开(公告)日：2019-01-08

申请号：US15598324

申请日：2017-05-18

Applicant: Subtron Technology Co., Ltd.

Inventor： Chin-Sheng Wang ,  Chih-Hsien Cheng ,  Shih-Hao Sun

IPC: H01L21/48 ,  H01L23/00 ,  H01L23/367 ,  H01L23/498

Abstract: A manufacturing method including following steps is provided. A substrate that includes a core layer, a first conductive layer, and a second conductive layer is provided. A heat conducting channel is formed in the substrate, and an adhesion layer is formed on the second conductive layer to cover a side of the heat conducting channel. A heat conducting element and a buffer layer are placed into the heat conducting channel, and a gap is formed between either the heat conducting element or the buffer layer and an inner side surface of the heat conducting channel. The gap is filled with a first insulant material, and the adhesion layer and the buffer layer are removed to form a cavity and expose the heat conducting element. The first conductive layer and the second conductive layer are patterned to form a first patterned circuit layer and a second patterned circuit layer, respectively.

公开(公告)号：US20170086293A1

公开(公告)日：2017-03-23

申请号：US14932974

申请日：2015-11-05

Applicant: Subtron Technology Co., Ltd.

Inventor： Chih-Hsien Cheng

IPC: H05K1/11 ,  H05K3/00 ,  H05K1/02

CPC classification number: H01L23/13 ,  H01L23/3677 ,  H01L23/49822 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K1/0204 ,  H05K3/022 ,  H05K3/427 ,  H05K2201/10416 ,  H05K2203/0191 ,  H01L2924/00014

Abstract: A manufacturing method of a package carrier is provided. A substrate having a through hole is provided, wherein a profile of the through hole from top view is a first rounded rectangular. A heat conducting slug is disposed inside the through hole, wherein the heat conducting slug and an inner wall of the through hole are separated with a gap, and a profile of the heat conducting slug from top view is a second rounded rectangular. An insulating material is filled in the through hole so as to fix the heat conducting slug in the through hole. A conductive through hole structure, a first and a second patterned circuit layers are formed. The first and the second patterned circuit layers are respectively formed on two opposite sides of the substrate. The conductive through hole structure penetrates the substrate and connects portions of the first and the second patterned circuit layers.

公开(公告)号：US10297517B2

公开(公告)日：2019-05-21

申请号：US15723206

申请日：2017-10-03

Applicant: Subtron Technology Co., Ltd.

Inventor： Chih-Hsien Cheng

IPC: H01L23/13 ,  H01L23/367 ,  H01L23/498 ,  H05K1/02 ,  H05K3/42 ,  H05K3/02

Abstract: A manufacturing method of a package carrier is provided. A substrate having a through hole is provided, wherein a profile of the through hole from top view is a first rounded rectangular. A heat conducting slug is disposed inside the through hole, wherein the heat conducting slug and an inner wall of the through hole are separated with a gap, and a profile of the heat conducting slug from top view is a second rounded rectangular. An insulating material is filled in the through hole so as to fix the heat conducting slug in the through hole. A conductive through hole structure, a first and a second patterned circuit layers are formed. The first and the second patterned circuit layers are respectively formed on two opposite sides of the substrate. The conductive through hole structure penetrates the substrate and connects portions of the first and the second patterned circuit layers.

公开(公告)号：US20180114739A1

公开(公告)日：2018-04-26

申请号：US15598324

申请日：2017-05-18

Applicant: Subtron Technology Co., Ltd.

Inventor： Chin-Sheng Wang ,  Chih-Hsien Cheng ,  Shih-Hao Sun

IPC: H01L23/367 ,  H01L21/48 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/3675 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/4882 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2924/15153 ,  H01L2924/00014

Abstract: A manufacturing method including following steps is provided. A substrate that includes a core layer, a first conductive layer, and a second conductive layer is provided. A heat conducting channel is formed in the substrate, and an adhesion layer is formed on the second conductive layer to cover a side of the heat conducting channel. A heat conducting element and a buffer layer are placed into the heat conducting channel, and a gap is formed between either the heat conducting element or the buffer layer and an inner side surface of the heat conducting channel. The gap is filled with a first insulant material, and the adhesion layer and the buffer layer are removed to form a cavity and expose the heat conducting element. The first conductive layer and the second conductive layer are patterned to form a first patterned circuit layer and a second patterned circuit layer, respectively.

公开(公告)号：US20180025956A1

公开(公告)日：2018-01-25

申请号：US15723206

申请日：2017-10-03

Applicant: Subtron Technology Co., Ltd.

Inventor： Chih-Hsien Cheng

IPC: H01L23/13 ,  H05K1/02 ,  H05K3/42

CPC classification number: H01L23/13 ,  H01L23/3677 ,  H01L23/49822 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K1/0204 ,  H05K3/022 ,  H05K3/427 ,  H05K2201/10416 ,  H05K2203/0191 ,  H01L2924/00014

Abstract: A manufacturing method of a package carrier is provided. A substrate having a through hole is provided, wherein a profile of the through hole from top view is a first rounded rectangular. A heat conducting slug is disposed inside the through hole, wherein the heat conducting slug and an inner wall of the through hole are separated with a gap, and a profile of the heat conducting slug from top view is a second rounded rectangular. An insulating material is filled in the through hole so as to fix the heat conducting slug in the through hole. A conductive through hole structure, a first and a second patterned circuit layers are formed. The first and the second patterned circuit layers are respectively formed on two opposite sides of the substrate. The conductive through hole structure penetrates the substrate and connects portions of the first and the second patterned circuit layers.