公开(公告)号：US20150258657A1

公开(公告)日：2015-09-17

申请号：US14724916

申请日：2015-05-29

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chun-Hsing Su ,  Jing-Cheng Lin ,  Tsei-Chung Fu ,  Wen-Hua Chang ,  Yi-Chao Mao

IPC: B24B37/16 ,  H01L21/67 ,  B24B49/12 ,  B24B7/22 ,  B24B37/013

CPC classification number: B24B37/16 ,  B24B7/228 ,  B24B37/013 ,  B24B49/10 ,  B24B49/12 ,  H01L21/67253 ,  H01L21/6835 ,  H01L21/6836 ,  H01L22/12 ,  H01L22/26 ,  H01L23/3114 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/97 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2224/82 ,  H01L2224/83 ,  H01L2924/00

Abstract: A grinding wheel includes a base disk, and a plurality of teeth protruding beyond a surface of the base disk. The plurality of teeth is aligned to an elongated ring encircling a center of the grinding wheel.

Abstract translation: 砂轮包括基盘和突出超过基盘表面的多个齿。 多个齿与环绕砂轮的中心的细长环对准。

公开(公告)号：US10224293B2

公开(公告)日：2019-03-05

申请号：US15495788

申请日：2017-04-24

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chen-Hua Yu ,  Jing-Cheng Lin ,  Tsei-Chung Fu

IPC: H01L21/00 ,  H01L23/00 ,  H01L21/02 ,  H01L33/62 ,  H01L21/768 ,  H01L21/56 ,  H01L23/31 ,  H01L25/10 ,  H01L21/3205 ,  H01L23/528 ,  H01L23/532 ,  H01L21/48 ,  H01L23/538 ,  H01L25/00 ,  H01L23/525

Abstract: A package structure and method for forming the same are provided. The package structure includes a substrate and a semiconductor die formed over the substrate. The package structure also includes a package layer covering the semiconductor die and a conductive structure formed in the package layer. The package structure includes a first insulating layer formed on the conductive structure, and the first insulating layer includes monovalent metal oxide. A second insulating layer is formed between the first insulating layer and the package layer. The second insulating layer includes monovalent metal oxide, and a weight ratio of the monovalent metal oxide in the second insulating layer is greater than a weight ratio of the monovalent metal oxide in first insulating layer.

公开(公告)号：US20170025359A1

公开(公告)日：2017-01-26

申请号：US15284003

申请日：2016-10-03

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Yi-Lin Tsai ,  Jeffrey Chang ,  Jing-Cheng Lin ,  Nai-Wei Liu ,  Tsei-Chung Fu

IPC: H01L23/538 ,  H01L25/10 ,  H01L25/00 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31 ,  H01L21/48

CPC classification number: H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package includes a device die, a molding material molding at least a portion of the device die therein, and a through-via substantially penetrating through the molding material. The package further includes a dielectric layer contacting the through-via and the molding material, and a die attach film attached to a backside of the device die. The die attach film includes a portion extending in the dielectric layer.

Abstract translation: 包装包括装置模具，模制其中装置模具的至少一部分的模制材料以及基本穿透模制材料的通孔。 该封装还包括与通孔和成型材料接触的介电层，以及附着在器件裸片背面的管芯附着膜。 芯片附着膜包括在电介质层中延伸的部分。

公开(公告)号：US09461018B1

公开(公告)日：2016-10-04

申请号：US14690061

申请日：2015-04-17

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Yi-Lin Tsai ,  Jeffrey Chang ,  Jing-Cheng Lin ,  Nai-Wei Liu ,  Tsei-Chung Fu

IPC: H01L21/00 ,  H01L21/47 ,  H01L21/56 ,  H01L25/065 ,  H01L23/538 ,  H01L23/31 ,  H01L21/768 ,  H01L23/29 ,  H01L21/683 ,  H01L23/00

CPC classification number: H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package includes a device die, a molding material molding at least a portion of the device die therein, and a through-via substantially penetrating through the molding material. The package further includes a dielectric layer contacting the through-via and the molding material, and a die attach film attached to a backside of the device die. The die attach film includes a portion extending in the dielectric layer.

Abstract translation: 包装包括装置模具，模制其中装置模具的至少一部分的模制材料以及基本穿透模制材料的通孔。 该封装还包括与通孔和成型材料接触的介电层，以及附着在器件裸片背面的管芯附着膜。 芯片附着膜包括在电介质层中延伸的部分。

公开(公告)号：US10083913B2

公开(公告)日：2018-09-25

申请号：US15284003

申请日：2016-10-03

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Yi-Lin Tsai ,  Jeffrey Chang ,  Jing-Cheng Lin ,  Nai-Wei Liu ,  Tsei-Chung Fu

IPC: H01L23/538 ,  H01L23/31 ,  H01L25/00 ,  H01L25/10 ,  H01L21/56 ,  H01L21/48 ,  H01L21/78 ,  H01L25/065 ,  H01L21/683 ,  H01L23/00 ,  H01L23/498

Abstract: A package includes a device die, a molding material molding at least a portion of the device die therein, and a through-via substantially penetrating through the molding material. The package further includes a dielectric layer contacting the through-via and the molding material, and a die attach film attached to a backside of the device die. The die attach film includes a portion extending in the dielectric layer.

公开(公告)号：US09941244B2

公开(公告)日：2018-04-10

申请号：US14100987

申请日：2013-12-09

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chin-Chuan Chang ,  Tsei-Chung Fu ,  Jing-Cheng Lin

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/522 ,  H01L21/56

CPC classification number: H01L24/96 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3185 ,  H01L23/5226 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L2224/02381 ,  H01L2224/0239 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05018 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/12105 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/214 ,  H01L2224/94 ,  H01L2924/00 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18162

Abstract: In accordance with a method embodiment includes providing a die having a contact pad on a top surface and forming a conductive protective layer over the die and covering the contact pad. A molding compound is formed over the die and the conductive protective layer. The conductive protective layer is exposed using a laser drilling process. A redistribution layer (RDL) is formed over the die. The RDL is electrically connected to the contact pad through the conductive protective layer.

公开(公告)号：US20160307871A1

公开(公告)日：2016-10-20

申请号：US14690061

申请日：2015-04-17

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Yi-Lin Tsai ,  Jeffrey Chang ,  Jing-Cheng Lin ,  Nai-Wei Liu ,  Tsei-Chung Fu

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L23/29 ,  H01L21/683 ,  H01L23/538 ,  H01L21/768

CPC classification number: H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package includes a device die, a molding material molding at least a portion of the device die therein, and a through-via substantially penetrating through the molding material. The package further includes a dielectric layer contacting the through-via and the molding material, and a die attach film attached to a backside of the device die. The die attach film includes a portion extending in the dielectric layer.

Abstract translation: 包装包括装置模具，模制其中装置模具的至少一部分的模制材料以及基本穿透模制材料的通孔。 该封装还包括与通孔和成型材料接触的介电层，以及附着在器件裸片背面的管芯附着膜。 芯片附着膜包括在电介质层中延伸的部分。

公开(公告)号：US09358660B2

公开(公告)日：2016-06-07

申请号：US14724916

申请日：2015-05-29

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chun-Hsing Su ,  Jing-Cheng Lin ,  Tsei-Chung Fu ,  Wen-Hua Chang ,  Yi-Chao Mao

IPC: B24B37/16 ,  B24B7/22 ,  B24B37/013 ,  B24B49/12 ,  H01L21/67 ,  B24B49/10 ,  H01L21/66 ,  H01L23/00 ,  H01L21/683 ,  H01L23/31 ,  H01L23/538

CPC classification number: B24B37/16 ,  B24B7/228 ,  B24B37/013 ,  B24B49/10 ,  B24B49/12 ,  H01L21/67253 ,  H01L21/6835 ,  H01L21/6836 ,  H01L22/12 ,  H01L22/26 ,  H01L23/3114 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/97 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2224/82 ,  H01L2224/83 ,  H01L2924/00

Abstract: A grinding wheel includes a base disk, and a plurality of teeth protruding beyond a surface of the base disk. The plurality of teeth is aligned to an elongated ring encircling a center of the grinding wheel.

Abstract translation: 砂轮包括基盘和突出超过基盘表面的多个齿。 多个齿与环绕砂轮的中心的细长环对准。

公开(公告)号：US10748869B2

公开(公告)日：2020-08-18

申请号：US15938451

申请日：2018-03-28

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chin-Chuan Chang ,  Tsei-Chung Fu ,  Jing-Cheng Lin

IPC: H01L23/48 ,  H01L23/00 ,  H01L23/522 ,  H01L23/31 ,  H01L21/56

Abstract: A method includes providing a die having a contact pad on a top surface and forming a conductive protective layer over the die and covering the contact pad. A molding compound is formed over the die and the conductive protective layer. The conductive protective layer is exposed using a laser drilling process. A redistribution layer (RDL) is formed over the die. The RDL is electrically connected to the contact pad through the conductive protective layer.

公开(公告)号：US10163818B2

公开(公告)日：2018-12-25

申请号：US15495788

申请日：2017-04-24

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chen-Hua Yu ,  Jing-Cheng Lin ,  Tsei-Chung Fu

IPC: H01L21/00 ,  H01L23/00 ,  H01L21/02 ,  H01L33/62 ,  H01L21/768 ,  H01L21/56 ,  H01L23/31 ,  H01L25/10 ,  H01L21/3205 ,  H01L23/528 ,  H01L23/532 ,  H01L21/48 ,  H01L23/538 ,  H01L25/00 ,  H01L23/525

Abstract: A package structure and method for forming the same are provided. The package structure includes a substrate and a semiconductor die formed over the substrate. The package structure also includes a package layer covering the semiconductor die and a conductive structure formed in the package layer. The package structure includes a first insulating layer formed on the conductive structure, and the first insulating layer includes monovalent metal oxide. A second insulating layer is formed between the first insulating layer and the package layer. The second insulating layer includes monovalent metal oxide, and a weight ratio of the monovalent metal oxide in the second insulating layer is greater than a weight ratio of the monovalent metal oxide in first insulating layer.