公开(公告)号：US20160260546A1

公开(公告)日：2016-09-08

申请号：US15059047

申请日：2016-03-02

Applicant: TDK CORPORATION

Inventor： Masahiro MORI ,  Takayuki SAKAI ,  Katsumi KOBAYASHI

IPC: H01G4/228 ,  H01G4/12

CPC classification number: H01G4/228 ,  H01G2/06 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H05K3/301 ,  H05K3/3426 ,  H05K2201/1031 ,  H05K2201/10946 ,  H05K2201/10962 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic device includes a chip component and an external terminal. The external terminal includes a terminal electrode connection part, a mounting connection part, and a support part. The terminal electrode connection part is arranged to face an end surface electrode part of a terminal electrode of the chip component. The mounting connection part is connectable to a mounting surface. The support part faces one side surface of an element body of the chip component closest to the mounting surface so as to support the one side surface spaced from the mounting surface. A bonding region and a non-bonding region are formed between the terminal electrode connection part of the external terminal and the end surface electrode part of the terminal electrode. The non-bonding region is formed from the terminal electrode connection part to the support part.

Abstract translation: 电子设备包括芯片组件和外部终端。 外部端子包括端子电极连接部，安装连接部和支撑部。 端子电极连接部被配置为与芯片部件的端子电极的端面电极部相对。 安装连接部分可连接到安装表面。 支撑部分面向最靠近安装表面的芯片部件的元件主体的一个侧表面，以支撑与安装表面间隔开的一个侧表面。 在外部端子的端子电极连接部和端子电极的端面电极部之间形成接合区域和非接合区域。 非接合区域由端子电极连接部分形成到支撑部分。