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公开(公告)号：US20190080841A1
公开(公告)日：2019-03-14
申请号：US16121719
申请日：2018-09-05
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Kenichi INOUE , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
CPC classification number: H01G2/065 , H01G4/01 , H01G4/12 , H01G4/232 , H01G4/248 , H01G4/30 , H01G4/38 , H05K3/341 , H05K2201/10431
Abstract: A method of manufacturing an electronic device includes preparing a chip component with a terminal electrode. A terminal plate is prepared. A connection member is placed between an end surface of the terminal electrode and an inner surface of the terminal plate. The terminal plate and the terminal electrode are joined using the connection member by bringing a press head into contact with an outer surface of the terminal plate and pressing and heating the terminal plate against the terminal electrode.
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公开(公告)号：US20180286584A1
公开(公告)日：2018-10-04
申请号：US15928752
申请日：2018-03-22
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Katsumi KOBAYASHI , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
CPC classification number: H01G4/1227 , H01G2/06 , H01G2/065 , H01G4/005 , H01G4/12 , H01G4/232 , H01G4/2325 , H01G4/30
Abstract: A ceramic electronic device includes a chip component and a pair of metal terminals. The component includes a rectangular-parallelepiped element body having dielectrics and internal electrodes and a pair of terminal electrodes covering end surfaces of the body and a part of side surfaces of the body. The pair of metal terminals respectively has an engagement arm portion configured to hold the component. The terminal electrode includes first and second side surfaces. The first side surface has a predetermined side-surface electrode thickness. The second side surface is disposed farther from the end surface of the body than the first side surface and has the side-surface electrode thickness which is smaller than that of the first side surface. The arm portion contacts with the component at a position that is farther from the end surface of the body than the first side surface.
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公开(公告)号：US20180182553A1
公开(公告)日：2018-06-28
申请号：US15854523
申请日：2017-12-26
Applicant: TDK CORPORATION
Inventor： Kosuke YAZAWA , Norihisa ANDO , Masahiro MORI , Sunao MASUDA , Kayou MATSUNAGA
CPC classification number: H01G4/248 , H01G4/1227 , H01G4/224 , H01G4/2325 , H01G4/30 , H01G4/38
Abstract: A ceramic electronic device includes a chip component, a pair of metal terminal portions, and a case. The metal terminal portion includes a terminal connection portion and a mount portion. The terminal connection portion faces a chip end surface and is connected with a terminal electrode. The mount portion is electrically connected with the terminal connection portion, extends toward a center substantially vertically to the chip end surface, and faces the chip component with a predetermined space. The case has a pair of case end walls sandwiching the pair of metal terminal portions from both sides and holding the chip component between the pair of metal terminal portions.
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公开(公告)号：US20170186539A1
公开(公告)日：2017-06-29
申请号：US15391312
申请日：2016-12-27
Applicant: TDK CORPORATION
Inventor： Sunao MASUDA , Katsumi KOBAYASHI , Masahiro MORI , Kayou MATSUNAGA , Norihisa ANDO
Abstract: An electronic device includes a chip component with a terminal electrode formed on an end surface of a ceramic element body including an internal electrode and an external terminal electrically connected to the terminal electrode. The external terminal includes a terminal electrode connection part arranged to face the terminal electrode and a mounting connection part connectable to a mounting surface. The terminal electrode connection part includes a multilayer structure of a first metal connected to the terminal electrode, a second metal arranged outside the first metal, and a third metal arranged outside the second metal. A thermal expansion coefficient of the external terminal is smaller than that of the ceramic element body.
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公开(公告)号：US20160351333A1
公开(公告)日：2016-12-01
申请号：US15142530
申请日：2016-04-29
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Sunao MASUDA , Masahiro MORI , Kayou KUSANO
CPC classification number: H01G4/40 , H01C7/02 , H01C7/021 , H01C7/18 , H01G2/14 , H01G4/232 , H01G4/258
Abstract: A first metal terminal includes a first connection portion connected to an electrode portion of a second external electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion connected to a conductor portion of a connection conductor, and a second leg portion extending from the second connection portion. A multilayer capacitor and an overcurrent protection device are disposed in such a manner that a side surface on which an electrode portion of a first external electrode is disposed and a side surface of a second element body oppose each other. The electrode portion of the first external electrode and a fourth external electrode are connected to each other, and the connection conductor and a third external electrode are connected to each other.
Abstract translation: 第一金属端子包括连接到第二外部电极的电极部分的第一连接部分和从第一连接部分延伸的第一腿部部分。 第二金属端子包括连接到连接导体的导体部分的第二连接部分和从第二连接部分延伸的第二支腿部分。 多层电容器和过电流保护器件以这样的方式设置，使得设置第一外部电极的电极部分的侧表面和第二元件体的侧表面彼此相对。 第一外部电极的电极部分和第四外部电极彼此连接，并且连接导体和第三外部电极彼此连接。
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Patent Agency Ranking
公开(公告)号：US20190304690A1
公开(公告)日：2019-10-03
申请号：US16367937
申请日：2019-03-28
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
Abstract: An electronic device includes a chip component and a metal terminal. The chip component includes a terminal electrode formed on an element body. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes a terminal body and a pair of holding pieces. The terminal body faces an end surface of the terminal electrode of the chip component. The pair of holding pieces is formed on the terminal body and sandwiches the chip component. A width, a protrusion length, or a protrusion area of one of the pair of holding pieces is different from that of the other holding piece.
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公开(公告)号：US20190164694A1
公开(公告)日：2019-05-30
申请号：US16162580
申请日：2018-10-17
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
Abstract: A ceramic electronic device includes a chip component, a metal terminal, and a conductive connection member. The component includes a terminal electrode surface on which a terminal electrode is formed. The metal terminal includes an opposing surface to the electrode surface. The connection member contains at least Sn and Sb and connects the terminal electrode surface and the opposing surface. The connection member includes a first part and a second part. In the first part, a distance between the terminal electrode surface and the opposing surface is a first distance, and Sb/Sn is a first value. In the second part, a distance between the terminal electrode surface and the opposing surface is a second distance being smaller than the first distance, and Sb/Sn is a second value being larger than the first value.
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公开(公告)号：US20180211783A1
公开(公告)日：2018-07-26
申请号：US15819674
申请日：2017-11-21
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Katsumi KOBAYASHI , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
CPC classification number: H01G4/248 , H01G2/06 , H01G4/008 , H01G4/12 , H01G4/232 , H01G4/30 , H01G4/38
Abstract: A ceramic electronic device includes multiple chip components and a pair of metal terminal portions. The chip components consist of a pair of chip end surfaces and four chip side surfaces. Terminal electrodes are formed on the pair of chip end surfaces. The pair of metal terminal portions is arranged correspondingly with the pair of chip end surfaces. Each of the pair of metal terminal portions includes an electrode face portion, a pair of engagement arm portions, and a mount portion. The electrode face portion faces the chip end surface. The pair of engagement arm portions sandwich and hold the chip component. The mount portion extends from one of terminal second sides toward the chip component and is partially substantially vertical to the electrode face portion. The electrode face portion has a slit.
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公开(公告)号：US20190304691A1
公开(公告)日：2019-10-03
申请号：US16369813
申请日：2019-03-29
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
Abstract: An electronic device assembly includes a first electronic device, a second electronic device, and a connection member. The first electronic device includes a first metal terminal configured to hold a first chip component. The second electronic device includes a second metal terminal configured to hold a second chip component. The connection member connects the first electronic device and the second electronic device.
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公开(公告)号：US20190206626A1
公开(公告)日：2019-07-04
申请号：US16197870
申请日：2018-11-21
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
Abstract: An electronic device includes a chip component and a metal terminal. The chip component includes an element body containing laminated internal electrodes and a terminal electrode formed outside the element body to connect with ends of the internal electrodes. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes an electrode facing portion, a holding portion, and a mount portion. A connection member connecting between the electrode facing portion and the end surface of the terminal electrode exists in a joint region in a predetermined range. A non-joint region is formed between an edge of the joint region and the holding portion. A non-joint gap between the electrode facing portion and the end surface of the terminal electrode becomes larger toward the holding portion in the non-joint region.
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