公开(公告)号：US20230365396A1

公开(公告)日：2023-11-16

申请号：US18142373

申请日：2023-05-02

Applicant: TDK CORPORATION

Inventor： Toyotaka KOBAYASHI

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0021 ,  B81C1/00158 ,  B81B2201/0257 ,  B81B2203/0315 ,  B81B2203/0353 ,  B81B2207/015 ,  B81C2201/0154 ,  B81C2201/0159

Abstract: Disclosed herein is a MEMS sensor package that includes a substrate, an annular-shaped first dry film pattern stuck to one surface of the substrate, and a MEMS sensor chip including a tubular support and a detection part which is supported on the support so as to overlap a cavity of the support. The MEMS sensor chip is fixed to the substrate by sticking an annular mounting surface of the support to the first dry film pattern.