公开(公告)号：US20190204586A1

公开(公告)日：2019-07-04

申请号：US16008442

申请日：2018-06-14

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jose A. MARTINEZ

IPC: G02B26/08 ,  B81C1/00 ,  B81B7/02

CPC classification number: G02B26/0841 ,  B81B7/02 ,  B81B2201/042 ,  B81C1/00047 ,  B81C2201/0132 ,  B81C2201/0133 ,  G09G3/346

Abstract: A microelectromechanical system (MEMS) structure includes at least first and second metal vias. Each of the first and second metal vias includes a respective planar metal layer having a first thickness and a respective post formed from the planar metal layer. The post has a sidewall, and the sidewall has a second thickness greater than 14% of the first thickness.