公开(公告)号：US12208471B2

公开(公告)日：2025-01-28

申请号：US18065356

申请日：2022-12-13

Applicant: THE INDIUM CORPORATION OF AMERICA

Inventor： Martin Thuo ,  Ian Tevis ,  Dana Drochner

IPC: B23K35/02 ,  B22F1/00 ,  B22F1/16 ,  B22F1/17 ,  B23K35/26

Abstract: A material includes a plurality of supercooled micro-capsules each including a metallic core in a liquid state at a temperature below a solidification temperature of the metallic core and further includes a metallic shell surrounding each respective metallic core. A plurality of alloyed metallic particles and flux are mixed with the plurality of supercooled micro-capsules to form a solder paste. Upon heating the solder paste, the plurality of alloyed particles melt. As the metallic shells destabilize, the liquid metallic cores interdiffuse with the melted alloyed particles forming a new alloy that has a higher melting temperature than the melting temperature of the alloyed metallic particles.