公开(公告)号：US12208471B2

公开(公告)日：2025-01-28

申请号：US18065356

申请日：2022-12-13

Applicant: THE INDIUM CORPORATION OF AMERICA

Inventor： Martin Thuo ,  Ian Tevis ,  Dana Drochner

IPC: B23K35/02 ,  B22F1/00 ,  B22F1/16 ,  B22F1/17 ,  B23K35/26

Abstract: A material includes a plurality of supercooled micro-capsules each including a metallic core in a liquid state at a temperature below a solidification temperature of the metallic core and further includes a metallic shell surrounding each respective metallic core. A plurality of alloyed metallic particles and flux are mixed with the plurality of supercooled micro-capsules to form a solder paste. Upon heating the solder paste, the plurality of alloyed particles melt. As the metallic shells destabilize, the liquid metallic cores interdiffuse with the melted alloyed particles forming a new alloy that has a higher melting temperature than the melting temperature of the alloyed metallic particles.

公开(公告)号：US20240058861A1

公开(公告)日：2024-02-22

申请号：US18452441

申请日：2023-08-18

Applicant: The Indium Corporation of America

Inventor： Martin Thuo ,  Ian Tevis

IPC: B22F1/16 ,  B22F1/08 ,  B22F1/17 ,  B22F1/102 ,  B23K35/02

CPC classification number: B22F1/16 ,  B22F1/08 ,  B22F1/17 ,  B22F1/102 ,  B23K35/025

Abstract: A particle comprises an amorphous solid metallic core enclosed within a metal-oxide shell. The amorphous solid metallic core includes one or more metals and is below a glass transition temperature of the one or more metals. The particle further comprises one or more regions having a crystalline or semi-crystalline structure disposed within the amorphous solid metallic core.

公开(公告)号：US12226831B2

公开(公告)日：2025-02-18

申请号：US17342339

申请日：2021-06-08

Applicant: Iowa State University Research Foundation, Inc. ,  The Indium Corporation of America

Inventor： Martin Thuo ,  Christophe Frankiewicz ,  Ian Tevis

IPC: B22F7/00 ,  B22F1/16 ,  B22F7/04 ,  B22F10/20 ,  B29C64/135 ,  H05K3/12 ,  B33Y10/00

Abstract: A method of direct printing or writing of a metallic material involves depositing, with a printing device or writing device, an ink comprising of at least undercooled liquid metallic particles dispersed in a carrier fluid. The ink is deposited on any substrate surface to deposit the undercooled liquid metal particles thereon as one or more layers that can form a desired pattern or layered structure.

公开(公告)号：US12030126B2

公开(公告)日：2024-07-09

申请号：US17383150

申请日：2021-07-22

Applicant: THE INDIUM CORPORATION OF AMERICA

Inventor： Martin Thuo ,  Ian Tevis

IPC: B22F9/06

CPC classification number: B22F9/06 ,  B22F2201/01 ,  B22F2201/03

Abstract: A droplet comprises a core including an alloy comprising a majority of a first metallic element and a minority of a second element, wherein the core is in a liquid state below a solidus temperature of the alloy. A shell is arranged to enclose the core and includes an exterior surface comprising a majority of the second element and a minority of the first metallic element, wherein the shell is in a solid state below the solidus temperature of the alloy. The alloy can comprise a solder material that can be used to form solder connections below a solidus temperature of the alloy.