公开(公告)号：US12226831B2

公开(公告)日：2025-02-18

申请号：US17342339

申请日：2021-06-08

Applicant: Iowa State University Research Foundation, Inc. ,  The Indium Corporation of America

Inventor： Martin Thuo ,  Christophe Frankiewicz ,  Ian Tevis

IPC: B22F7/00 ,  B22F1/16 ,  B22F7/04 ,  B22F10/20 ,  B29C64/135 ,  H05K3/12 ,  B33Y10/00

Abstract: A method of direct printing or writing of a metallic material involves depositing, with a printing device or writing device, an ink comprising of at least undercooled liquid metallic particles dispersed in a carrier fluid. The ink is deposited on any substrate surface to deposit the undercooled liquid metal particles thereon as one or more layers that can form a desired pattern or layered structure.

公开(公告)号：US20240243091A1

公开(公告)日：2024-07-18

申请号：US18415074

申请日：2024-01-17

Applicant: THE INDIUM CORPORATION OF AMERICA

Inventor： Richard McDonough ,  Milos Lazic ,  David P. Socha

IPC: H01L23/00 ,  H01L21/48

CPC classification number: H01L24/27 ,  H01L21/4882 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/16 ,  H01L24/73 ,  H01L2224/16221 ,  H01L2224/2743 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/29105 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29116 ,  H01L2224/29118 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29166 ,  H01L2224/29171 ,  H01L2224/2918 ,  H01L2224/29184 ,  H01L2224/32245 ,  H01L2224/32506 ,  H01L2224/73253 ,  H01L2224/83801 ,  H01L2924/01048 ,  H01L2924/0133

Abstract: Thermal interface materials deposited in solid form, in a layered manner, and their uses in electronics assembly are described. In one implementation, a method includes: forming an assembly including multiple solid metal thermal interface materials (TIMs) between a first device and a second device such that a first surface of the solid metal TIMs is in touching relation with a surface of the first device, and a second surface of the solid metal TIMs opposite the first surface is in touching relation with a surface of the second device, the solid metal TIMs including a first solid metal TIM and a second solid metal TIM; and forming a liquid TIM alloy from the solid metal TIMs by heating the assembly above a first solidus temperature of the first solid metal TIM, the liquid TIM alloy having a second solidus temperature below the first solidus temperature.

公开(公告)号：US12030126B2

公开(公告)日：2024-07-09

申请号：US17383150

申请日：2021-07-22

Applicant: THE INDIUM CORPORATION OF AMERICA

Inventor： Martin Thuo ,  Ian Tevis

IPC: B22F9/06

CPC classification number: B22F9/06 ,  B22F2201/01 ,  B22F2201/03

Abstract: A droplet comprises a core including an alloy comprising a majority of a first metallic element and a minority of a second element, wherein the core is in a liquid state below a solidus temperature of the alloy. A shell is arranged to enclose the core and includes an exterior surface comprising a majority of the second element and a minority of the first metallic element, wherein the shell is in a solid state below the solidus temperature of the alloy. The alloy can comprise a solder material that can be used to form solder connections below a solidus temperature of the alloy.

公开(公告)号：US12208471B2

公开(公告)日：2025-01-28

申请号：US18065356

申请日：2022-12-13

Applicant: THE INDIUM CORPORATION OF AMERICA

Inventor： Martin Thuo ,  Ian Tevis ,  Dana Drochner

IPC: B23K35/02 ,  B22F1/00 ,  B22F1/16 ,  B22F1/17 ,  B23K35/26

Abstract: A material includes a plurality of supercooled micro-capsules each including a metallic core in a liquid state at a temperature below a solidification temperature of the metallic core and further includes a metallic shell surrounding each respective metallic core. A plurality of alloyed metallic particles and flux are mixed with the plurality of supercooled micro-capsules to form a solder paste. Upon heating the solder paste, the plurality of alloyed particles melt. As the metallic shells destabilize, the liquid metallic cores interdiffuse with the melted alloyed particles forming a new alloy that has a higher melting temperature than the melting temperature of the alloyed metallic particles.

公开(公告)号：US20240342802A1

公开(公告)日：2024-10-17

申请号：US18633203

申请日：2024-04-11

Applicant: THE INDIUM CORPORATION OF AMERICA

Inventor： David P. Socha ,  Brent Muncy

IPC: B22F12/30 ,  B33Y30/00

CPC classification number: B22F12/30 ,  B33Y30/00

Abstract: Some implementations of the disclosure are directed to a build plate assembly including a body dimensioned for use in a 3D printing device, and a solid insert of a metal or metal alloy. The body includes an interior cavity formed through a top of the body, and extending to an opening at a first side of the body. The solid insert includes a top surface for forming a 3D printed metal object in the 3D printing device. The solid insert is configured to slidably couple, through the opening at the first side of the body, into the interior cavity of the body.

公开(公告)号：US20240058861A1

公开(公告)日：2024-02-22

申请号：US18452441

申请日：2023-08-18

Applicant: The Indium Corporation of America

Inventor： Martin Thuo ,  Ian Tevis

IPC: B22F1/16 ,  B22F1/08 ,  B22F1/17 ,  B22F1/102 ,  B23K35/02

CPC classification number: B22F1/16 ,  B22F1/08 ,  B22F1/17 ,  B22F1/102 ,  B23K35/025

Abstract: A particle comprises an amorphous solid metallic core enclosed within a metal-oxide shell. The amorphous solid metallic core includes one or more metals and is below a glass transition temperature of the one or more metals. The particle further comprises one or more regions having a crystalline or semi-crystalline structure disposed within the amorphous solid metallic core.

公开(公告)号：US20240258262A1

公开(公告)日：2024-08-01

申请号：US18426144

申请日：2024-01-29

Applicant: THE INDIUM CORPORATION OF AMERICA

Inventor： Milos Lazic ,  Richard McDonough

IPC: H01L23/00 ,  H01L23/367

CPC classification number: H01L24/26 ,  H01L23/367 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/2732 ,  H01L2224/29105 ,  H01L2224/3207 ,  H01L2224/32221 ,  H01L2224/83201 ,  H01L2924/0103 ,  H01L2924/01049 ,  H01L2924/0105

Abstract: Described are a double barrier system and method used to contain a thermal interface material to avoid unwanted interactions of the thermal interface material with other metals or components within a semiconductor device. In one implementation, a semiconductor assembly includes: a substrate; a heat generating device including a first surface attached to the substrate; a first barrier surrounding and in touching relation with the heat generating device; a second barrier surrounding the first barrier such that there is an area between the first barrier and the second barrier; a heat transferring device; and a thermal interface material between and in touching relation with the heat transferring device and a second surface of the heat generating device opposite the first surface.