公开(公告)号：US11097948B2

公开(公告)日：2021-08-24

申请号：US16073608

申请日：2017-01-25

Applicant: TOKUYAMA CORPORATION

Inventor： Akimasa Kuramoto ,  Kikuo Yamamoto ,  Mou Ou ,  Saiko Fujii ,  Yukihiro Kanechika ,  Teruhiko Nawata

IPC: C01B21/072 ,  C08K3/28 ,  C08L101/00 ,  C09C1/40

Abstract: To provide an aluminum nitride particle having a hexagonal columnar barrel part and bowl-like projection parts at both ends of the columnar part, wherein the long diameter (D) of the barrel part is 10 to 250 μm, the ratio (L1/D) of the distance (L1) between the apexes of the two projection pars to the long diameter (D) of the barrel part is 0.7 to 1.3, and the percentage of the length or thickness (L2) of the barrel part to the distance (L1) between the apexes of the two projection parts is 10 to 60%. The aluminum nitride particle can provide high heat conductivity and excellent electric insulation to a resin when it is filled into the resin.

公开(公告)号：US20230242736A1

公开(公告)日：2023-08-03

申请号：US18007884

申请日：2021-11-22

Applicant: Tokuyama Corporation

Inventor： Saiko Fujii ,  Yoshitaka Inaki

IPC: C08K3/22 ,  C08K3/28 ,  C08G77/20 ,  C08G77/08

CPC classification number: C08K3/22 ,  C08K3/28 ,  C08G77/20 ,  C08G77/08 ,  C08K2201/003 ,  C08K2201/014 ,  C08K2201/001 ,  C08K2003/2227 ,  C08K2003/282

Abstract: One embodiment of the present invention relates to a resin composition or a method of producing a resin composition, and the resin composition includes 100 parts by volume of a resin (A), and 230 to 640 parts by volume of a filler (B) having an average particle diameter of 5 μm to 60 μm, wherein the filler (B) contains a filler (B-1) having a spherical shape with an average particle diameter of 0.1 μm or more and 0.7 μm or less and a filler (B-2) having a peak at least in a range of 0.9 μm to 3.0 μm in a particle size distribution measured by a laser diffraction method, and the proportion of the filler (B-1) is from 0.2 vol % to 5.0 vol % with respect to 100 vol % of the filler (B).

公开(公告)号：US20250101286A1

公开(公告)日：2025-03-27

申请号：US18294750

申请日：2022-07-22

Applicant: Tokuyama Corporation

Inventor： Saiko Fujii ,  Atsushi Sakamoto ,  Isao Masada

IPC: C09K5/14 ,  C08K3/22 ,  C08K3/28 ,  C08K7/18

Abstract: An embodiment of the present invention relates to a composition or filler mixture. This composition includes a thermally conductive filler (A) having a cumulative volume 50% particle diameter (D50(A)) of 0.05 μm or more and less than 1.0 μm and a cumulative volume 90% particle diameter (D90(A)) of 2.0 μm or less in a particle size distribution curve determined by laser diffractometry; a thermally conductive filler (B); and a binder component (C). The composition satisfies requirement (1) in the entire thermally conductive filler (B) used in the composition, a cumulative pore amount of pores with a pore diameter of 0.5 μm or less as calculated from a pore diameter distribution measured with a mercury porosimeter is 0.05 ml/g or less; requirement (2) the entire thermally conductive filler (B) used in the composition has a cumulative volume 50% particle diameter (D50(B)) of from 1.0 to 100 μm; and requirement (3) the entire thermally conductive filler (B) used in the composition has a cumulative volume 10% particle diameter (D10(B)) of 0.6 μm or more.