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1.发明申请公开(公告)号：US20220282052A1
公开(公告)日：2022-09-08
申请号：US17633482
申请日：2020-09-30
Applicant: TOYOBO CO., LTD.
Inventor： Naoki WATANABE , Harumi YONEMUSHI , Kousuke SASAI (deceased) , Hiroyuki WAKUI
Abstract: The purpose is to provide a laminate useful as a temporary support for producing a large-area, high-definition flexible electronic device, the laminate having stably low adhesive strength between a colorless and highly transparent polyimide film and an inorganic substrate even in the case of a large surface area and having few blister defects. The laminate that attains the purpose is obtained by initially wetting either one of an inorganic substrate coated with the silane coupling agent and a colorless polyimide film with an aqueous medium, and then laminating while pressing out the aqueous medium.
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公开(公告)号：US20250019508A1
公开(公告)日：2025-01-16
申请号：US18894138
申请日：2024-09-24
Applicant: TOYOBO CO., LTD.
Inventor： Kaya TOKUDA , Tetsuo OKUYAMA , Naoki WATANABE , Hiroyuki WAKUI , Harumi YONEMUSHI , Denichirou MIZUGUCHI
IPC: B29C71/02
Abstract: Provided is a layered body including glass and a polyamic acid heat-cured product that is readily releasable from an inorganic substrate after being heated at 250° C. A layered body including an inorganic substrate and a polyamic acid heat-cured product, the layered body being characterized by a weight average molecular weight of 30,000 or greater for the polyamic acid, and a peel strength of 0.3 N/cm or weaker between the polyamic acid heat-cured product layer and the inorganic substrate, after the layered body has been heated at 250° C.
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Patent Agency Ranking
公开(公告)号：US20160237603A1
公开(公告)日：2016-08-18
申请号：US15026424
申请日：2014-09-30
Applicant: TOYOBO CO., LTD.
Inventor： Teruyuki TANINAKA , Shinichi KOBUCHI , Hiroyuki WAKUI
IPC: D04H3/14 , D04H3/007 , D04H3/009 , A47C7/02 , A47C27/12 , A47D15/00 , B61D33/00 , B60N2/70 , B62J1/26 , B60P7/08 , A47D1/00 , A47G27/02 , D04H3/016 , A47G9/00
CPC classification number: D04H3/14 , A47C7/02 , A47C27/122 , A47D1/00 , A47D15/00 , A47G9/00 , A47G27/0212 , B60N2/70 , B60P7/0823 , B61D33/0035 , B62J1/26 , D04H3/007 , D04H3/009 , D04H3/016 , D04H3/03 , D04H3/16 , D10B2321/02 , D10B2321/08 , D10B2331/02 , D10B2331/10
Abstract: The present invention provides a network structure having excellent repeated compression durability, a low repeated compression residual strain and a high hardness retention after repeated compression.A network structure made of a three-dimensional random loop bonded structure obtained by forming random loops with curling treatment of a continuous linear structure including at least one thermoplastic elastic resin selected from the group consisting of a polyolefin-based thermoplastic elastomer, an ethylene-vinyl acetate copolymer, a polyurethane-based thermoplastic elastomer and a polyamide-based thermoplastic elastomer, the continuous linear structure having a fineness of not less than 100 dtex and not more than 60000 dtex, and by making each loop mutually contact in a molten state, whereinThe network structure has an apparent density of 0.005 g/cm3 to 0.20 g/cm3, a 50%-constant displacement repeated compression residual strain of not more than 15%, and a 50%-compression hardness retention after 50%-constant displacement repeated compression of not less than 85%.
Abstract translation: 本发明提供了具有优异的重复压缩耐久性，低重复压缩残余应变和重复压缩后的高硬度保持率的网络结构。 一种由三维随机环接合结构制成的网状结构，其通过形成具有包括至少一种热塑性弹性树脂的连续线性结构的卷曲处理形成无规环，所述热塑性弹性树脂选自聚烯烃基热塑性弹性体，乙烯 - 乙烯基 乙酸酯共聚物，聚氨酯类热塑性弹性体和聚酰胺类热塑性弹性体，所述连续线状结构的细度为100dtex以上且60000dtex以下，并且使各环在熔融状态下相互接触，其中， 网络结构的表观密度为0.005g / cm 3至0.20g / cm 3，重复压缩残余应变的50％不超过15％，重复50％ - 复位后的50％压缩硬度保持率 压缩率不低于85％。
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公开(公告)号：US20230312852A1
公开(公告)日：2023-10-05
申请号：US18006042
申请日：2021-08-10
Applicant: TOYOBO CO., LTD.
Inventor： Kaya TOKUDA , Tetsuo OKUYAMA , Naoki WATANABE , Hiroyuki WAKUI , Harumi YONEMUSHI , Denichirou MIZUGUCHI
IPC: B29C71/02
CPC classification number: C08J7/08 , C08J2377/06
Abstract: Provided is a layered body including glass and a polyamic acid heat-cured product that is readily releasable from an inorganic substrate after being heated at 250° C. A layered body including an inorganic substrate and a polyamic acid heat-cured product, the layered body being characterized by a weight average molecular weight of 30,000 or greater for the polyamic acid, and a peel strength of 0.3 N/cm or weaker between the polyamic acid heat-cured product layer and the inorganic substrate, after the layered body has been heated at 250° C.
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公开(公告)号：US20230211584A1
公开(公告)日：2023-07-06
申请号：US17996199
申请日：2021-05-25
Applicant: TOYOBO CO., LTD.
Inventor： Tetsuo OKUYAMA , Makoto NAKAMURA , Denichirou MIZUGUCHI , Harumi YONEMUSHI , Hiroyuki WAKUI , Kaya TOKUDA
CPC classification number: B32B17/10 , B32B9/045 , B32B27/34 , C08G73/14 , C08G73/1042 , C08G73/1067 , C08G73/1078 , C08J5/18 , B32B2255/26 , B32B2255/205 , B32B2307/54 , B32B2307/306 , B32B2307/308 , B32B2307/412 , B32B2307/414 , B32B2307/732 , B32B2307/748 , B32B2457/00 , C08J2379/08
Abstract: Provided is a layered product that uses a high temperature-resistant transparent film having sufficient heat resistance, and that is capable of being mechanically released from an inorganic substrate after various processes are performed on the inorganic substrate since the adhesive strength between the high temperature-resistant transparent film and the inorganic substrate is appropriately weak, and that is less warped along with the inorganic substrate. In this layered product, no adhesive is used between the high temperature-resistant transparent film and the inorganic substrate, the release strength between the high temperature-resistant transparent film and the inorganic substrate is at most 0.3 N/cm, and the warpage amount of the layered product when heated at 300° C. is at most 400 µm.
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公开(公告)号：US20240375381A1
公开(公告)日：2024-11-14
申请号：US18291771
申请日：2022-07-15
Applicant: TOYOBO CO., LTD.
Inventor： Kaya TOKUDA , Hiroyuki WAKUI , Tetsuo OKUYAMA , Makoto NAKAMURA , Harumi YONEMUSHI , Denichirou MIZUGUCHI
Abstract: Provided is a transparent heat-resistant laminated film that has a sufficiently smooth surface to be used as a substrate in a flexible device, and that has excellent handling properties and suppressed warping. A transparent heat-resistant laminated film characterized by having an (a) layer, a (b) layer, and a blending layer located at the interface between the (a) layer and the (b) layer, the thickness of the blending layer being 3 μm or greater.
(a) layer: A layer that contains a polyimide composition.
(b) layer: A layer that contains a polyimide composition and that has a higher inorganic filler content than the (a) layer.-
公开(公告)号：US20230173800A1
公开(公告)日：2023-06-08
申请号：US17995239
申请日：2021-05-25
Applicant: TOYOBO CO., LTD.
Inventor： Tetsuo OKUYAMA , Makoto NAKAMURA , Denichirou MIZUGUCHI , Harumi YONEMUSHI , Hiroyuki WAKUI , Kaya TOKUDA
CPC classification number: B32B27/281 , B32B27/08 , C08G73/1032 , C08G73/1064 , C08G73/1071 , C08G73/1042 , C08G73/1078 , C08G73/1039 , C08G73/1053 , C08L79/08 , C08J7/0427 , B32B2307/30 , B32B2307/412 , B32B2307/732 , B32B2307/54 , B32B2307/306 , B32B2307/748 , C08L2203/16 , C08J2379/08 , C08J2479/08
Abstract: The present invention provides a multilayer body of an inorganic substrate and a highly heat-resistant transparent film which has sufficient heat resistance and is able to be mechanically separated from the inorganic substrate after being subjected to various processes on the inorganic substrate since the adhesion between the highly heat-resistant transparent film and the inorganic substance is adequately weak. A multilayer body of a highly heat-resistant transparent film and an inorganic substrate, wherein: an adhesive is not substantially used; the peel strength between the highly heat-resistant transparent film and the inorganic substrate is 0.3 N/cm or less; and the CTE of the highly heat-resistant transparent film is 50 ppm/K or less.
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